Involvement in ATLAS upgrade

1. Involvement in ATLAS upgrade M. Havránek on behalf of FNSPE-CTU Faculty of Nuclear Sciences and Physical Engineering of the Czech Technical University (FNSPE-CTU)

2. Newly formed HW group at FNSPE • New laboratory at FNSPE • Part of the people came from Institute of Physics, ASCR • Involvement of PhD students: • M. Carna – evaluation radiation hardness • Z. Janoska – IC design • M. Hejtmanek – image processing (MediPix) • O. Korchak – TCAD simulations, chip testing • M. Marcisovsky – general advisor • Professionals: • V. Vrba – group leader • M. Havranek – IC design, institute representative • G. Neue – test system development • V. Kafka – IC design • L. Tomasek – sensor/chip testing, software development

3. Experience obtained so far • Sensor development • - n on p sensor development • - TCAD simulations • Read-out system development • - universal FPGA based read-out system • IC design (150 nm technology) • - test structures (transistor arrays) • - charge sensitive amplifier • Evaluation of radiation hardness (150 nm CMOS technology) [1] 60Co Nucl. reactor [1] M. Carna et al: Radiation hardness evaluation of the commercial 150 nm CMOS process using 60Co source, IWORID2013 proceedings, accepted by JINST

4. International collaboration • M. Havranek – 3 years stay at Bonn University* • Pixel capacitance measurement chip - PixCap • - IC design, development of measurement setup, capacitance measurements → publication [1] • Pixel FE development in 65 nm CMOS technology • - design of two 65 nm pixel FE prototypes (FE-T65-0, FE-T65-1) • - test system HW/SW development, chip characterization → publication [2] capacitance [fF] capacitance [fF] Diamond Si planar Diamond Si planar 25 µm 180 µm * Supervised by H. Krüger and T. Hemperek

5. International collaboration • Depleted Monolithic Active pixel sensor • - design of DMAPS prototype chip EPCB01 • - sensor characterization, radiation test → publication [3] • Z. Janoska next month going to CPPM Marseille (HV MAPS testing) • References: • [1] M. Havranek et al:Measurement of pixel sensor capacitance with sub-femtofarad precision, • NIMA, vol. 714, 2013 • [2] M. Havranek et al: Pixel front-end development in 65 nm technology, JINST, vol 9, 2014 • [3] M. Havranek et al: DMAPS: a fully depleted monolithic active pixel sensor – analog performance • and characterization, submitted to JINST (05/2014)

6. Role in the ATLAS Collaboration • Membership in RD53 Collaboration since April 2014 • RD53 Collaboration: • - design of the next generation of ATLAS/CMS Pixel chip • (phase 2 upgrade in ~2022) • Planned activities in RD53: • - studies of low power analog pixel front-end in 65 nm • - chip testing, small pixel sensor design • evaluation of radiation hardness with neutrons and gammas (60Co) • Participation in planned design of prototype pixel arrays prior to submission of large FE chip • Involvement in AIDA 2 Collaboration • - AIDA activities: sensor design on a p-substrate • - sensor testing, production, evaluation of radiation hardness • - supporting students working at projects for RD53

7. Thank you for attention