3D ICs Market, By End-Use Sectors (Consumer electronics, Information and communication technology, Transport (automotive

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2. 3D ICS MARKET ANALYSIS 3D ICs Market, By End-Use Sectors (Consumer electronics, Information and communication technology, Transport (automotive and aerospace), Military, Others (Biomedical applications and R&D)), by Substrate Type (Silicon on insulator(SOI), Bulk silicon), by Fabrication Process ( Beam re-crystallization, Wafer bonding, Silicon epitaxial growth, Solid phase crystallization), by Product (MEMS and Sensor, RF SiP, Optoelectronics and imaging, Memories (3D Stacks), Logic (3D Sip/Soc), HB LED) and by Region (North America, Europe, Asia Pacific, RoW) - Size, Share, Outlook, and Opportunity Analysis, 2020 - 2027

3. Market Overview The global 3D ICs market is estimated to account for US$ 38,252.9 Mn in terms of value by the end of 2027. Market Dynamics Drivers • Increasing demand for efficient solutions is expected to drive growth the global 3D ICs market during the forecast period • Rising adoption of portable devices is expected to propel the global 3D ICs market growth over the forecast period

4. Figure 1. Global 3D ICs Market Share (%), in terms of Value, By Region, 2019

5. Market Dynamics Restraints • High cost associated and testing issues are expected to restrain growth of the global 3D ICs market during the forecast period • Lack of foundries and assemble houses is expected to hinder the global 3D ICs market growth over the forecast period

7. Market Opportunities • Advent of big data analytics can present lucrative growth opportunities • Collaborations among market players can provide business opportunities

8. Figure 2.Global 3D ICs Market Value (US$ MN), 2017 - 2027

9. Market Trends • Multi-chip packaging is a major trend • IntSim is another major trend

10. Global 3D ICs Market - Impact of Coronavirus (Covid-19) Pandemic • Due to Covid-19 pandemic, many industries witnessed significant shift in their business. There is significant impact on the growth of 3D ICs market. As manufacturing operations are temporarily suspended across many countries to contain the coronavirus. • Competitive Section Key players operating in the global 3D ICs market are Taiwan Semiconductor Manufacturing Company, Ltd., MonolithIC 3D Inc., XILINX, Inc., Elpida Memory, Inc. (Micron Technology, Inc.), The 3M Company, Ziptronix, Inc., STATS ChipPAC Ltd., United Microelectronics Corporation, and Tezzaron Semiconductor Corporation.

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