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Trends in Electronics Reliability Testing

Trends in Electronics Reliability Testing. Analysis Tech Phone: (781) 245-7825 Fax: (781) 246-6257 Email: info@analysistech.com Website: www.analysistech.com. by Dr. John W. Sofia. The Starting Point. First Transistor Bell Labs, 1947 www.lucent.com. First Integrated Circuit

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Trends in Electronics Reliability Testing

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  1. Trends in Electronics Reliability Testing Analysis Tech Phone: (781) 245-7825 Fax: (781) 246-6257 Email: info@analysistech.com Website: www.analysistech.com by Dr. John W. Sofia Trends www.analysistech.com

  2. The Starting Point First Transistor Bell Labs, 1947 www.lucent.com First Integrated Circuit Texas Instruments, 1958 www.ti.com Trends www.analysistech.com

  3. Yesterday And Today Intel 4004-2.3x103 transistors 1970 Intel Pentium II-7.5x106 transistors Today www.intel.com Trends www.analysistech.com

  4. Heat Fluxes For Various Events Chu, Simons, et.al 1999 Trends www.analysistech.com

  5. Moore’s Law Performance doubles with every new chip generation (approximately every 18-24 months) observed by Gordon Moore in 1965. www.ibm.com www.intel.com Trends www.analysistech.com

  6. Driving Factors Simons, 1999 Trends www.analysistech.com

  7. CPU Power Trend Aghazadeh, M., 1994 Trends www.analysistech.com

  8. Relative Cooling Capability of Various Modes of Convective Heat Transfer and Coolants Kraus and Bar-Cohen, 1983 Trends www.analysistech.com

  9. Power Dissipation of CMOS DevicesVs. Clock Speed Montesano & Cassia, 1995 Trends www.analysistech.com

  10. Explosion in heat flux Simons, 1996 Explosion in Heat Flux

  11. CPU Heat Dissipation Over Time Trends www.analysistech.com

  12. Processor Performance Vs. Temperature Kryotech, Inc., 1999 Trends www.analysistech.com

  13. National Technology Roadmap For Semiconductors www.nist.gov Trends www.analysistech.com

  14. Industry Trends • CMOS will continue to be the pervasive semiconductor technology for both memory and logic. • Chip sizes will increase, but circuit density will increase even more resulting in higher heat flux • Cost will become an increasingly significant challenge for future high-end cooling designs. • There will be increase emphasis on reducing design time. • The majority of new computer systems will most likely be air-cooled for the next few years. • The application of low temperature cooling as a means to achieve improved system performance may be expected to increase over the next few years. Simons, 1999 Trends www.analysistech.com

  15. Major Causes of Electronic Failures Source: U.S. Air Force Avionics Integrity Program Reynell, M. 1990 Trends www.analysistech.com

  16. Trends in Electronic Cooling • Increasing module and device heat fluxes • Declining thermal design-margins Trends www.analysistech.com

  17. Trends in Electronic Interconnects • Larger numbers of interconnects / signals • Smaller (less robust) mechanical size interconnects Trends www.analysistech.com

  18. Trends in System Costs • Decreasing cost-performance ratio • Increasing cost of system failure to end user Trends www.analysistech.com

  19. Trends in Test Needs • Increasing challenges to avoid thermal & interconnect failure • Increasing needs (& budgets) for reliability testing Trends www.analysistech.com

  20. Analysis TechThermal and Interconnect Reliability Test Systems Trends www.analysistech.com

  21. Analysis TechTest & Measurement Systems for Electronic Packaging Reliability • Measurement of all device thermal-characteristics • Electrical method of junction temperature measurement • Complete test lab equipment • Complete component test services Thermal Analyzers: Event Detectors: • Electrical monitoring of interconnect reliability • For thermal-cycle, vibration, and shock testing • Ideal for long-term unattended test • Solder joints, connectors, and all advanced interconnects Trends www.analysistech.com

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