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Presentation outline. Presentation outline Organization PA plans and compliance PMP MIP/KIP planning Cleanliness ESD control Configuration Control CN, NCR and RFW status Problem areas. FPss PA plans/compliance. PA plans and compliance

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presentation outline
Presentation outline
  • Presentation outline
  • Organization
  • PA plans and compliance
  • PMP
  • MIP/KIP planning
  • Cleanliness
  • ESD control
  • Configuration Control
  • CN, NCR and RFW status
  • Problem areas

FPss CDR 1/2/3 July 2003

fpss pa plans compliance
FPss PA plans/compliance
  • PA plans and compliance
  • Instead of one overall FPss PA plan separate plans for FCU, FPU and JPL:
    • FCU, SRON-U/FCU/PL/2000-001
    • FPU, FPSS-00026
    • JPL (MU bands 5, 6L and 6H, US part), JPL D-19161
  • Other FPss consortium members through compliance matrices (HIFI PA plan):
    • Compliance status in section 6.1 of FPSS-00026
    • Sufficient agreement between members and FPss PA
    • All need more or less support from FPss PA to fulfil these tasks
  • Subcontractors PA control through SoW’s or procurement specifications

FPss CDR 1/2/3 July 2003

pmp eee parts
PMP – EEE parts
  • EEE parts lists and procurement
  • All EEE parts lists established and reflecting current design status
  • All parts ordered at the CPPA or, if self procured, ordered at manufacturers/suppliers except Isolators
  • Isolator order waits finalization of PID but no delay expected
  • Go-ahead for housing production has been given and magnet materials procured
  • After approval of PID, probably shortly from now, go-ahead for production
  • Problems with CPPA expected delivery dates resolved for MU’s and IF amplifiers
  • Delivery of CPPA parts in progress and for the MU’s almost completed and for the other units expected to be on time
  • Parts list and procurement for IF Up-converter currently done by HIFI PA

FPss CDR 1/2/3 July 2003

pmp eee parts pad status
PMP – EEE parts – PAD status
  • PAD Status (28)
  • FPU resistors and capacitors (24 PAD’s active, 2 withdrawn)
  • Most of them have initial Acceptance up to HIFI System; at ESA for acceptance (19)
  • Some under final definition - new items like 18nF capacitor (5)
  • Isolators
  • PAD needs update: batches and sample sizes, LAT program (PAMTECH/SRON tasks), number of cold thermal cycles
  • IF amplifier HEMT
  • Under definition by HIFI System PA
  • CSA temperature sensor Lake Shore DT670E-BR
  • Initial Acceptance up to HIFI System; at ESA for acceptance
  • FCU OP12B
  • Accepted by ESA, closed

FPss CDR 1/2/3 July 2003

pmp eee parts pad status1
PMP – EEE parts – PAD status
  • PAD’s FPU CAPACITORS AND RESISTORS
  • PAD’s for all capacitors and resistors because of use at cryogenic temperature
  • Qualification logic for these parts and applied interconnection techniques:
    • Parts mounted on evaluation boards of with envisaged materials and processes:
      • Aluminium oxide/solder/wire bond
      • Duroid/solder/wire bond
      • Duroid/conductive epoxy/wire bond
      • TMM/conductive epoxy/wire bond
      • Kapton flex print/solder
    • Evaluation boards cycled RT/LHe (dip stick) 100x
    • Destructive analysis of parts and interconnections
    • Boards defined, to be manufactured, cycled and evaluated, expected to be completed in October 2003 except for IF2
    • JPL performs equivalent program on MU 5, 6L/6H hardware

FPss CDR 1/2/3 July 2003

pmp eee parts pad status2
PMP – EEE parts – PAD status
  • Alcatel IF1 evaluation board
  • Au plated aluminium/Duroid/conductive epoxy

FPss CDR 1/2/3 July 2003

pmp eee parts pad status3
PMP – EEE parts – PAD status
  • PAD FPU ISOLATORS
  • Two types of isolators that differ in outer dimensions only
  • PID for flight models almost completed
  • Two DM’s are cycled 30x at this moment; after that internal inspection and if necessary feedback into PID FM
  • Flight batch 100% inspection:
    • visual
    • performance at 4.2/15 Kelvin
  • From flight batch samples will be taken for LAT:
    • 2 of each type
    • Cycling 10x RT/LHe, 20x RT/LN2
    • Extended bake out and warm cycling, 1x 144 hours at 85C + 4 cycles RT/85C
    • Cryogenic (80K) vibration, qualification level
    • Internal

FPss CDR 1/2/3 July 2003

pmp eee parts pad status4
PMP – EEE parts – PAD status
  • PAD CSA TEMPERATURE SENSOR
  • Lake Shore DT670E-BR bare diode
  • 100% visual inspection
  • LAT on 4 items, 1 control item:
    • Mounted on alumina together with DT670SD-4L for calibration check at 4.2 and 77 K
    • Irradiated 10krad/Si and calibration check thereafter
    • Thermal cycling 353/4.2 Kelvin, 100x followed by a calibration check, visual inspection, bond pull test, die shear test.
  • PAD FCU OP12B
  • Part from XMM-RGS project
  • Relife and hermetic seal testing and external visual inspection performed on 25 pieces

FPss CDR 1/2/3 July 2003

pmp eee parts other issues
PMP – EEE parts – Other issues
  • Lake Shore Germanium thermistor GR200B
  • Lake Shore notified CPPA that they do not guarantee that part will survive launch vibration and does not change in calibration after bake out.
  • SRON performed vibration and bake out on commercially procured part
  • Bake out – 19 hours at 90, 145 hours at 80C
  • Vibration – together with console, in 11 steps from 2 upto 9 grms, 30 seconds each
  • No changes observed within our measuring accuracy of about 10 mKelvin
  • Results reported in FPSS-00402
  • Proposed to CPPA to do LAT, by SRON, on 2 pieces from the FPU flight batch
    • Vibration at 80K, FPU qualification level
    • Extended bake out for 144 hours at 85C

FPss CDR 1/2/3 July 2003

pmp eee parts other issues1
PMP – EEE parts – Other issues
  • SMA Attenuators
  • Radiall type R413 6xx 650, 0 – 10 dB attenuation
  • Located on SMA input connectors of IF2
  • No documented cryogenic history available
  • LAT on 2 pieces from flight batches
    • Thermal cycling RT/LN 10x and RT/LHe 6x
    • Vibration at 80K, FPU qualification level

FPss CDR 1/2/3 July 2003

pmp materials
PMP – Materials
  • Declared Materials Lists status
  • FPU – draft issue, to be updated
  • COA – established
  • DPB – in preparation
  • DRT – draft issue, to be updated and checked
  • MSA – draft issue, to be updated and checked
  • Console – draft issue, to be updated and checked
  • FPC – draft issue, to be updated and checked
  • CSA – draft issue, to be updated and checked
  • IF2 – not received yet (to be defined with selected Swiss company)
  • FCU – to be updated and checked
  • Draft issues are either based on draft or non-released production documents or on interviews

FPss CDR 1/2/3 July 2003

pmp processes
PMP – Processes
  • Declared Processes Lists status
  • FPU – draft issue, to be updated
  • COA – established
  • DPB – in preparation
  • DRT – draft issue, to be updated and checked
  • MSA – draft issue, to be updated and checked
  • Console – draft issue, to be updated and checked
  • FPC – draft issue, to be updated and checked
  • CSA – draft issue, to be updated and checked
  • IF2 – not received yet (to be defined with selected Swiss company)
  • FCU – to be updated and checked
  • Draft issues are either based on draft or non-released production documents or on interviews

FPss CDR 1/2/3 July 2003

pmp waveguide horns
PMP – Waveguide horns
  • Mixer unit waveguide horns electroforming process
  • Main problem with this process is fluid inclusion in corrugations, especially in the deep corrugations close to the waveguide transition
  • Status at RPG
  • RPG invested much time and in solving this problem
    • Optimization of electrolyte
    • Optimization of electroforming process
    • Development of an iterative process of copper growing and selective removal
    • Hiring a skilled and fully dedicated person for this process
  • Very recently they demonstrated that they were successful in producing an inclusion free MU 2 horn
  • No 100% guarantee that horns have no inclusions!

FPss CDR 1/2/3 July 2003

pmp waveguide horns1
PMP – Waveguide horns

MU 2 horn produced with “old” process

MU 2 horn produced with optimized process

FPss CDR 1/2/3 July 2003

pmp waveguide horns2
PMP – Waveguide horns

Details of horn without inclusions

Details of horn with inclusions

FPss CDR 1/2/3 July 2003

pmp waveguide horns3
PMP – Waveguide horns
  • Status at RPG, continued
  • PID under review by SRON and KOSMA
  • Before delivery, horns are thermally cycled to reveal detrimental inclusions:
    • 150C for one hour
    • 2x between RT/LN2
  • Visual inspection after each test
  • One horn from SRON flight batch will be cut
  • Contents of EIDP agreed, a.o. photographs of the corrugations at three stages of the electroforming process giving some evidence of inclusion free electroforming
  • Status at Thomas Keating Ltd
  • TK is producing horns with another type of process
  • Status on inclusions not known yet
  • Same LAT as for the horns from RPG

FPss CDR 1/2/3 July 2003

pmp riveting
PMP – Riveting
  • Status COA riveting
  • HTS has riveted a COA precursor QM
  • External visual inspection of rivets showed that rivets are within NAS requirements
  • Results of micro sectioning of rivet samples were not acceptable to ETH/SRON
  • – probable cause is an inadequate DPA procedure of the riveting company –
  • HTS has produced new rivet samples that will be processed and inspected by a SRON contracted, independent, testhouse
  • Results expected at the end of the first week of July
  • If results are satisfying the go-ahead for riveting COA QM will be given
  • Pull strength test samples (NASM-1312-4) will be produced together with QM/FM

FPss CDR 1/2/3 July 2003

pmp pivots
PMP – Pivots
  • Status C-Flex pivot manufacturing
  • Together with SRON C-Flex has developed processes for manufacturing the pivots for the Focal Plane Chopper and Diplexers
  • The development was focused on:
    • CuBe and Inconel 718 pivots
    • Base material condition
    • Plating process CuBe
    • Braze and EB weld schemes
    • Braze materials
    • Hardening heat treatments
    • Production flow
  • Batches of three types were recently produced for evaluation
    • CuBe, 100 m spring, brazed/welded
    • CuBe, 130 m spring, brazed/welded
    • Inconel 718, 90 m spring, brazed/brazed

FPss CDR 1/2/3 July 2003

pmp pivots1
PMP – Pivots
  • Status C-Flex pivot manufacturing, continued
  • Samples of all three types have been
    • Visually inspected
    • Static load tested
    • Vibration tested
    • Micro sectioned
  • All three types comply with the FPU requirements
  • Inconel 718 has been selected for use in the FPU because:
    • High strength
    • Relatively simple production flow and processes, reproducibility good
    • Fatigue strength acceptable
    • Torque rate within requirements
  • C-Flex PID defined and SRON procurement specification in preparation

FPss CDR 1/2/3 July 2003

pmp semi rigid cables
PMP – Semi rigid cables
  • Status of semi rigid cables
  • Two types of semi rigid cable material
    • Stainless steel (between 1st and 2nd Isolators)
    • Aluminium (all others)
  • Reliability problem description
  • Creep of PTFE dielectric due stresses induced by bending and thermal cycling could cause breakage of solder joints at SMA connector
  • Problem widely recognized and occurs also in cables used in the normal temperature range
  • References:
    • ECSS-Q-70-18, section 4.1
    • Barry. D. Dunn; Metallurgical assessment of spacecraft parts, materials and processes; p.421

FPss CDR 1/2/3 July 2003

pmp semi rigid cables1
PMP – Semi rigid cables

FPss CDR 1/2/3 July 2003

pmp semi rigid cables2
PMP – Semi rigid cables
  • Remedy according to specification ECSS-Q-70-18
  • Thermal cycling of the cut cable between RT/-45C/RT/85C/RT
  • Minimum number of cycles is 3, removal of the protruding dielectric after each cycle
  • Mounting of the connectors only after 24 hours at RT
  • Evaluation performed (test report FPSS-00420)
  • As ECSS-Q-70-18 is meant for cables to be used in the normal temperature range different preconditioning thermal cycles schemes were applied to a range of cable types and invest their behaviour when exposed to multiple cycles between RT and LHe, LN2 and bake out temperature
  • It appeared that creep of dielectric in assembled cables can be detected with reflection measurements
  • Preconditioning of the cables by cycling 3x between RT/-45C/RT/90C/RT seems to be sufficient for cables used at cryogenic temperature
  • SS cable type JS50085 and aluminium type AX50085 seem to be a good choice as baseline for the semi rigid cable qualification program

FPss CDR 1/2/3 July 2003

pmp semi rigid cables3
PMP – Semi rigid cables
  • Qualification program
  • Selection of cable manufacturers; two possible candidates:
    • SV Microwaves
    • Philips Natlab (R&D laboratories)
  • The manufacturer has to select the materials and processes and establish the manufacturing procedures according to the ECSS specification and possible amendments specified by SRON
  • SMA connectors are procured by SRON through the CPPA
  • A set of cables have to be produced according to that PID
  • Program
    • Extended bake out 144 hours at 85C and 5 cycles RT/85C
    • Thermal cycling 20x RT/LN2 and 10x RT/LHe
    • Vibration at 80K, FPU qualification level
    • Reflection measurements
    • DPA on connector samples to verify solder quality

FPss CDR 1/2/3 July 2003

pmp polarizing grids
PMP – Polarizing grids
  • Polarizing grids
  • Manufactured by QMC on SRON manufactured frames
    • Frame material Sanmac SS 304L frames
    • Mylar thickness 1.5 m
    • Grid material sputtered copper, photographically patterned
    • Copper thickness 0.4 m
    • Photoresist Microposit 1805 for copper protection
    • Mylar glued between two frames with Torr Seal
  • Evaluation performed on DM grids
    • Cold cycling had no effect on flatness, tensile stress loss of about 30%
    • Bake out no effect on flatness and a tensile stress loss of about 20%
    • Remaining tensile stress sufficient
    • Vibration at 80K did not show any effect on grids
    • Sufficient flatness for visible light alignment
  • Test report FPSS-00012

FPss CDR 1/2/3 July 2003

pmp polarizing grids1
PMP – Polarizing grids
  • Grid LAT program on flight batch
    • 100% visual inspection
    • 100% grid pitch and width
    • 100% flatness
    • Two samples from flight batch for:
      • Extended bake out 144 hours at 85C and 5 cycles RT/85C
      • Thermal cycling 20x RT/LN2 and 10x RT/LHe

FPss CDR 1/2/3 July 2003

pmp absorbing coating
PMP – Absorbing coating
  • Absorbing coating
  • Stycast 2850FT/24LV mixed with SiC grains (volume ratio – 3:1, weight ratio – 1:1)
  • Outgassing properties Stycast 2850FT/24LV (source: GSC outgassing data base)
  • TML – 0.5% - 1%, mean 0.6
  • CVCM – 0.01% - 0.18%, mean 0.04%
  • Coating mass – 0.18 g/cm2 of which 0.9 g/cm2 Stycast
  • Total area of coating in FPU – 2520 cm2
  • Total coating mass in FPU – 454 grams of which 227 grams Stycast
  • Estimated TML – 1.4 grams mean, 2.3 grams max
  • Estimated CVCM – 0.1 grams mean, 0.41 grams max
  • Outgassing properties of the absorbing coating may differ because of the large exposed surface area, variation in Stycast production lots, applied cure scheme
  • Outgassing properties will be verified in the near future

FPss CDR 1/2/3 July 2003

mip kip planning
MIP/KIP planning
  • MIP/KIP
  • MIP’s currently not foreseen
  • KIP’s FPU and subunits thereof defined in FPss-00309
    • COA, after machining mechanical parts and riveting
    • MU’s (except MU’s 5 and 6L/H, is JPL task) electrical boards before integration and internal electrical connections
    • IF amplifiers before closing boxes
    • CSA Warm source after assembly
    • FPC pivot manufacturing, before and after pivot integration, LVDT’s and Actuators, before closing
    • DRT’s before and after pivot integration, before closing Actuator
    • MSA’s before closing boxes
    • Consoles after full assembly
    • Grids before integration
  • KIP’s FCU and parts thereof planned in FCU PA plan, SRON-U/FCU/PL/2000-001
    • Each board before conformal coating
    • After full assembly

FPss CDR 1/2/3 July 2003

cleanliness control
Cleanliness control
  • Cleanliness Requirements
  • FPU
  • Particles – 300 ppm
  • Molecular– 4.10E-6 g/cm2
  • FCU
  • Particles – 300 ppm
  • Control
  • One overall HIFI cleanliness control plan in cooperation with Subsystems down to the lowest level, no lower level control plans (SRON-U/HIFI/PL/2001-002)
  • Recording of exposure times to the different environment
  • On FPss level clean rooms and benches are validated to FED-STD-209 by an external company every year
  • Particle counter for on line monitoring in clean room
  • Molecular contamination monitoring periodically
  • Clean room garments – ESD safe – are regularly cleaned, dependent on use

FPss CDR 1/2/3 July 2003

cleanliness control1
Cleanliness control
  • Facilities
  • Available clean areas for FPU assembly and handling (requirement – class 1,000):
    • Clean room class 100
    • Clean benches class 100
    • Clean tent class TBD
  • Available clean areas for FCU assembly and handling (requirement – class 100,000):
    • Clean room class 100.000
  • For FPU subunits clean benches and clean rooms of class <1000 available at the FPU consortium institutes and subcontractors
  • Clean room and facility monitoring
  • On FPss level clean rooms and benches are validated to FED-STD-209 by an external company every year
  • Initial determination of the molecular contamination potential during QM program of:
    • Clean room, clean benches
    • SRON MSA cryostat
    • CTH MSA cryostat (beam measurements)
    • FPU cryostat

FPss CDR 1/2/3 July 2003

cleanliness control2
Cleanliness control

FPss CDR 1/2/3 July 2003

esd control
ESD control
  • ESD plan SRON-G/FPU/PL/2001-001(FPSS-00183), issue2
  • Four levels of ESD safe areas defined:
    • SIS/HEB/HEMT devices < 20V
    • MU’s/IF amplifiers/FPU/LOU < 100V
    • FCU/LSU/LCU < 1000V
    • Non ESD sensitivity hardware
  • (Sub)unit sensitivities in ESD plan are still estimates
  • (Sub)unit suppliers have to communicate sensitivities to the FPss; required for final classification and definition of protective measures
  • Integration/assembly/test locations and ESD measures for ESD sensitive hardware are defined with present sensitivity estimates as in ESD plan
  • ESD safe work locations available for all levels of ESD sensitivity, including for SIS, HEB and HEMT devices.
  • Guidelines for assembly and cable hook up

FPss CDR 1/2/3 July 2003

esd control1
ESD control
  • Facilities evaluation and personnel training
  • Facilities evaluated by a JPL expert and found acceptable with minor recommendations. Recommendations are implemented.
  • Personnel at institutes and subcontractors, receiving US ESD sensitive hardware, were trained by JPL expert. All passed the exam

FPss CDR 1/2/3 July 2003

configuration control
Configuration Control
  • Organization
  • Configuration Control performed at location of design responsible institute
  • FCU – SRON-U
  • FPU – SRON-G
  • DA, DRT, FPC, MSA’s – SRON-G
  • CSA – SRON-U
  • IF1L/H – YEBES/Alcatel
  • IF2 – ETH/Swiss industry
  • MU’s – MU institutes
  • Upconverter – TBD

FPss CDR 1/2/3 July 2003

configuration control cidl pid
Configuration Control – CIDL/PID

FPss CDR 1/2/3 July 2003

configuration control cidl pid1
Configuration Control – CIDL/PID
  • Configuration Item Data List status
  • FCU – in DM phase; CIDL FM to be made soon
  • FPU QM – in preparation
  • COA QM – requirements and production documents part established
  • DA QM – production documents part established
  • DA FM – production documents part almost ready
  • DRT QM – production documents part established
  • MSA3V QM and FM – production documents part almost ready
  • MSA3H QM and FM – production documents part almost ready
  • FPss GSE’s – in preparation
  • CIDL’s of other subunits still have to be made
  • Process Identification Document status
  • MU’s and IF1H – almost established
  • IF1L – to be made but most of the contents the same as for IF1H
  • IF2 modules – to be made by to be selected Swiss industry

FPss CDR 1/2/3 July 2003

configuration control csl
Configuration Control - CSL
  • Configuration Status
  • Change Notes
  • Total of 13 CN’s
  • 11 for FPU, 4 closed, status of some unclear or at least open
  • 2 for FCU, both closed
  • Main changes
    • Band 7 deleted
    • HEB change in band 6H
    • IF frequency change and Upconverter added
    • FPU mechanical interface with Optical Bench
    • FPC DM – QM/FM design change

Problems

  • FPss Change register not well maintained
  • Insufficient communication and coordination between FPss CC and HIFI CC

FPss CDR 1/2/3 July 2003

configuration control csl1
Configuration Control - CSL
  • Requests for Waiver
  • 3 RFW’s for COA QM issued by the manufacturer, all closed, all level 4
  • Two accepted – corner radii of COA parts
  • One rejected – Alodine 1500 instead of 1000
  • NonConformance Reports
  • Total of 12 NCR’s. 1 open, 10 closed, 11 level 4, 1 level 2
  • DRT QM
  • 1 NCR, level 4, open
  • Lack of Configuration Control, corrected
  • FPU mirrors
  • 2 NCR’s, level 4, closed
  • Insufficient production specification, corrected

FPss CDR 1/2/3 July 2003

configuration control csl2
Configuration Control - CSL
  • NonConformance Reports, continued
  • COA QM
  • 8 NCR’s, level 4, all closed
  • Mechanical parts production errors, some remanufactured, others acceptable and closed out as use as is
  • InP HEMT
  • One NCR, level 2 (processed by JPL/HIFI), open
  • Used in IF1L, IF1H and IF2
  • Transistors from flight lot iher 1az1 wafer 4200-071 performed poor in test amplifier
  • Bad performance confirmed in IF1 and IF2 amplifiers
  • Some of the effects:
    • Higher noise (not good enough for bands 5 and 6) IF1
    • Either worse input matching or gain of IF2

FPss CDR 1/2/3 July 2003

problems
Problems
  • Main problem
  • Evaluation, LAT and qualification programs
  • The evaluation, LAT and qualification programs to prevent parts and subunits with low quality and reliability being built into the FM cannot be done in a timely manner.
  • Hardly any or no feedback from these programs into the flight (sub)units
  • Possible solutions
  • More manpower and/or time
  • Limit the programs to an agreed and acceptable risk
  • Prioritize the items and accept the late completion of the last items

FPss CDR 1/2/3 July 2003