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Key Messages: 2012 INTC-TWG

This document outlines key messages from the INTC Technical Working Group (TWG) internal meeting held in June 2012. Led by new US chair Paul Zimmerman and co-chair Azad Naeemi, discussions focused on reorganizing and scheduling efforts leading to the 2012 revision and 2013 updates. Attendees from the US, EU, and Japan addressed concerns related to TSV test performance, A&P interactions, and the impact of narrow dimension misalignment on design. Technology pacing with low-k surface preparation and advancements in Cu replacement materials were also highlighted.

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Key Messages: 2012 INTC-TWG

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  1. Key Messages: 2012 INTC-TWG Start reorganization and scheduling toward 2012 Revision/2013 Update. Attendees: Paul Zimmerman and Azad Naeemi (New US chair/co-chair), Jon Candelaria, Boyan Boyanov (US), Michele Stucchi, Didier Louis (EU) and Sam Yamazaki (JP). INTC Internal TWG meeting in June (Partially A&P XTWG) ITWG Interactions Via misalignment at narrow dimensions will influence Design Various concerns TSV-related with Test, A&P, Met and YE Interconnect performance with RF-AMS (passives and others) Technology pacing with PIDS low-k-related surface prep with FEP MtM materials and concept, represented by Cu replacement and native interconnect are presented. - 1 - - 1 -

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