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Board level shields play a crucial role in minimizing device weight and size while ensuring EMI protection. Modern designs and lightweight materials, such as metallized plastic, enable compact, high-performance solutions. Learn how these shields contribute to efficient circuit board layouts and reduce the need for bulky enclosures.
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How SnapShot® Board Level Shields Minimize Size and Weight Introduction SnapShot® board-level shields from XGR Technologies offer the lightest weight EMI shielding available, enabling ultra-compact device designs without compromising performance. Weight Comparison Table Thickness (mm) Length Weight Decrease Width Height Weight Shield Type (g) (mm) (mm) (mm) SnapShot® 0.125 0.77 86% 100 40 40 3 Typical Frame & Lid 0.150 5.66 n/a When grams matter ... SnapShot Delivers Benefits of SnapShot® Board Level Shields Ultra-Lightweight Shielding Reduces the Need for Heavy Casings SnapShot® shields are up to 90% lighter than traditional frame-and-lid shields, thanks to their metalized engineered polymer construction. Eliminates the need for bulky enclosures, reducing overall weight while maintaining EMI protection. Minimal Impact on Device Size Optimized Board Space & Layout At only 0.125mm thick, SnapShot® shields add minimal height, making them ideal for compact electronics. Provides effective EMI shielding while allowing optimal use of PCB space by preventing crosstalk and interference. Material Innovation - Metalized Engineered Polyer Metalized Plastic • Conductive outer surface (Tin) •Non-conductive inner surface (PEI) + Polyetherimide + Tin Plating Attaches by “snapping” over Solder Spheres • Manual or automated with the use of installation tooling • Creates strong electromechanical connection Need the Lightest Board Level Shield? Contact can optimize your device’s weight, size, and performance. XGR Technologies today to learn how SnapShot®