Microchip for Drug Delivery Ramille M. Capito Leah Lucas ME 395 MEMS Spring 2000 Presentation Outline Introduction: Why the use of a microchip? Microchip Design/Microfabrication Gold Dissolution Circuit Design Power Source Conclusions Drug Delivery
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Ramille M. Capito
ME 395 MEMS Spring 2000
--can make it very difficult to select the proper drug delivery system.
delivery (intravenous) and may cause
more harm than good
Problem: too simple to have the ability to precisely control the amount or rate of drug released.
Problem: miniature power-driven
mechanical parts required to either
retract, dispense, or pump in order
to deliver drugs in the body
complicated and are subject to
breakdown (i.e. fatigue or fracture).
--complexity and size restrictions unsuitable to deliver more than a few drugs or drug mixtures at a time.
1.) Deposit layer of insulating material, silicon nitride (0.12 mm), onto the substrate by PECVD
2.) Pattern by photolithography and square reservoirs are etched by ECR-enhanced RIE
3.) With potassium hydroxide solution at 85C, anisotropically etch square pyramidal reservoirs into the silicon along the (111) crystal
4.) Invert and deposit gold electrodes (0.3-0.5 mm thick). Pattern by E-beam evaporation and liftoff.
5.) Deposit electrode protective coating, silicon dioxide, by PECVD. Silicon dioxide over anode, cathode and bonding pads are etched with ECR-enhanced RIE to expose gold film.
6.) Remove SiN layer in the inside of reservoir by RIE to expose gold membrane.
7.) Fill reservoirs by inkjet printing through opening (500 mm x 500 mm)
PV = nRT
8.) Bottom of reservoirs capped with a silicon nitride coating
9.) Device can now be patterned with IC control circuitry and thin-film battery.
is chosen as the model membrane material:
--Potentials below this region are too low to cause appreciable corrosion, whereas potentials above this region result in gas evolution and formation of a passivating gold oxide layer that causes corrosion to slow or stop.