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EVG 560 Bonder

Bridge Tronic Global is a leading provider of high-quality semiconductor manufacturing equipment. We are pleased to offer the EVG 560 Bonder, an advanced wafer bonding system designed for fully automated operation. Equipped with interlocked doors and a signal light tower, this system ensures safety and operational efficiency. It features a 4-axis industrial robot and utilizes the EVG CIM Framework Software with a graphical user interface, allowing for flexible process flow definition and drag-and-drop recipe programming.

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EVG 560 Bonder

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  1. CE Certified Fully automated operation www.bridgetronic.com/products/127724 1360 Reynolds, Suite 102 Irvine, CA 92614 949-396-1851 www.bridgetronic.com

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