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Dr. Jeremy Wang Asia Pacific Executive Director, FSA August 16, 2005. ICSOC Workshop (Chengdu) Guest Speech. Overview. About the FSA The superiority of the fabless business model The global semiconductor environment Challenging the successful innovation model Future trends. FSA MISSION.

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icsoc workshop chengdu guest speech
Dr. Jeremy Wang

Asia Pacific Executive Director, FSA

August 16, 2005

ICSOC Workshop (Chengdu) Guest Speech
slide2

Overview

  • About the FSA
  • The superiority of the fabless business model
  • The global semiconductor environment
  • Challenging the successful innovation model
  • Future trends
slide3

FSA MISSION

Accelerate the growth and increase the return on invested capital of the global fabless business model by promoting an environment for innovation.

  • Provide a platform for meaningful global collaboration between fabless companies and their partners
  • Identify and articulate opportunities and challenges to enable solutions
  • Provide members with research, resources, publications and survey information
  • Promote the fabless business model
slide4

A Global Community of Leaders

Dr. Chintay Shih

Special Advisor

Bob Bailey

PMC-Sierra

Woody Yang Silicon7

David French

Cirrus Logic

Chia Song Hwee Chartered

Robert Tsao

UMC

500 corporate members worldwide

Dwight Decker

Conexant

Ming Kai Tsai

MediaTek

Jensen Huang

NVIDIA

KY Ho

ATI

Jimmy S.M. Lee ISSI

Sanjay Jha

Qualcomm

Wim Roelandts

Xilinx

Richard Chang

ASE

Dr. Nicky Lu

Etron

Dr. Morris Chang

TSMC

slide5

FSA’s BOARD

Fabless Seat

Fabless Seat

Fabless Seat

Fabless Seat

Fabless Seat

Fabless Seat

Fabless Seat

Fabless Seat

Fabless Seat

Fabless Seat

Fabless Seat

Fabless Seat

Foundry Seat

Foundry Seat

Foundry Seat

Back-end Seat

Jodi Shelton

Executive Director

FSA

EDA Seat

IDM Seat

Special Director

Special Director

Director Emeritus

12 Fabless, 3 Foundry, 1 IDM, 1 EDA, 1 Backend, 1 FSA = 19 total 1 Director Emeritus, 2 Special Directors

slide6

FSA BOD Members

Aart de Geus

Synopsys, Inc.

Sanjay Jha

Qualcomm

Dwight Decker

Conexant

Ron Boyd

Freescale Semiconductor

Rick Cassidy

TSMC North America

Jodi Shelton

Almost 500 corporate members worldwide

Gina Gloski

Formerly with FyreStorm, Inc.

David French

Cirrus Logic

Colin Harris

PMC-Sierra, Inc.

Jeorge Hurtarte

TranSwitch Corporation

Dr. Jackson Hu

UMC

Jim Seto

ATI Technologies

Ron Torten

Agilent Technologies

Vahid Manian

Broadcom Corporation

Dennis Segers

Matrix Semiconductor

Dr. Tien Wu

ASE, Inc.

Michael Rekuc

Chartered

slide7

FABLESS INFRASTRUCTURE/ECOSYSTEM

Photomask

EDA/IP

Design Services

Foundry Partners

Wafer Fabs

Almost 500 corporate members worldwide

Over 1,100 Fabless Semiconductor Cos

OEM and ODM Customers

Packaging

Assembly

Testing and subsystems

slide8

The Global Fabless Model

1,300+ Fabless Companies Worldwide

Europe

150

China & Taiwan

500

North America

600

Israel

100

Growth of global membership—nearly

500 global members!

slide9

Fabless Leaders

The Fabless “Billion-Dollar Club”

  • In 2004, nine fabless companies achieved $1B+ in sales.

Source: FSA

slide10

ASIA-PACIFIC LEADERSHIP COUNCIL

Chairman

Dr. Nicky Lu

Etron

K.C. Shih

Global Unichip

Qin-Sheng Wang

Huada Electronic Design Co., Ltd.

Dr. Chintay Shih

Special Advisor

H.P. Lin

Faraday

Ming Kai Tsai

MediaTek

Dr. Shaojun Wei

Datang Microelectronic

Technology, Co. Ltd.

Chou-Chye Huang

Sunplus

Dr. Dr. Zhonghan (John) Deng

Vimicro

Wen-Chi Chen

VIA

Gordon Gau

Holtek

Dr. Woodward Yang

Silicon7

slide11

EUROPEAN LEADERSHIP COUNCIL

Anthony Sethill

Frontier Silicon

David Baillie

Cambridge

Semiconductor

John Hodgson

Cambridge

Silicon Radio

Svenn Tore Larsen

Nordic Semiconductor

David Milne

Wolfson

Microelectronics

Roland Pudelko

Dialog

Semiconductor

slide12

The Superiority of the Fabless Model

Fabless vs. Overall Semi Revenue

  • Fabless companies have

a higher gross margin than

IDMs (47.3%

vs 44.5%)

  • Fabless companies have significantly higher R&D expenditure

than IDMs 23.7% vs.15.2% of

sales

Fabless CAGR=22%

vs.

Overall Semiconductor Growth at 7%

slide13

The Rising Cost of Manufacturing

Fab Cost Growth 7x

Semi Industry Revenue Growth 5x

($B)

% Growth Industry Revenue

Source: Goldman Sachs

slide14

Who Can Afford a 300mm Fab?

“A company must have the long-term endurance for maintaining its technology leadership or risk falling behind foundries.”

Top 20 Semiconductor Companies by 2004 Revenue

A company must have revenue $5B - $7B to support 300mm expansion

A company must have revenue $5B - $7B to support 300mm expansion

($M)

Source: Goldman Sachs; FSA

slide15

Recent Hybrid and

Partnership Models

STMicro

Freescale

Philips

Partnered with TSMC to achieve

process alignment for 90-nm

Samsung

IBM

Infineon

Partnered with Chartered for 65-nm

down to 45-nm technology development

AMD

Takes 50% investment in UMC

Makes 30% investment in UMC

Infineon

Announced “capital-efficient” manufacturing strategy”;

Halted current plans to build a new fab;

Goal is 50% outsourcing on advanced CMOS processing

Philips

To outsource 40-50%+

TI

slide16

The Proliferation of the Foundry

50+ Foundries Worldwide

slide17

Cost of Implementing

Designs Increasing

Source: IBS (2005)

slide19

Design Composition (Typical)

HEAD COUNT WITHIN DESIGN TEAMSIS INCREASING RAPIDLY

* Estimate

slide20

Future Trends & Challenges

  • Standard Setting is the key
    • PC (Intel), Multimedia, DVD (Media Tek),
    • Wi-Fi (WAPI), Wimax, 3G (Qualcomm), Digital TV,
  • Leverage collaboration and integration of supply chain partners into a cohesive unit--designers, EDA and IP vendors & foundries
  • SiP vs. SOC (Hybrid model)
    • Heterogeneous Integration for SiP
    • 3rd party IPs for SOC
  • Consumer and communication applications
  • System and software knowledge
slide21
Thank you!Dr. Jeremy Wang王智立博士Asia Pacific Executive Director

e-mail: jwang@fsa.org全球IC設計與委外代工協會FSA(Fabless Semiconductor Association )

www.fsa.org