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How SMT Solder Paste Makes the Soldering Process Easy?

Surface mount technology (SMT) is one of the most commonly used methods to create electronic circuits on a printed circuit board. Through this process, you mount or place the components directly on the PCB, and they should stay in place and create electric circuits to make the board work.

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How SMT Solder Paste Makes the Soldering Process Easy?

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  1. How SMT Solder Paste Makes the Soldering Process Easy? Surface mount technology (SMT) is one of the most commonly used methods to create electronic circuits on a printed circuit board. Through this process, you mount or place the components directly on the PCB, and they should stay in place and create electric circuits to make the board work. For this to be possible and effective, it requires the use of appropriate adhesives, like the SMT solder paste, which should make the soldering process simpler and low-maintenance. Reputable manufacturers and suppliers of SMT adhesive and assembly products carry a wide array of technologically advanced solder pastes developed specifically to ensure high yield and throughput, while maintaining the lowest cost of ownership in every application. Solder paste is a critical aspect of the SMT assembly process, as it creates not just the mechanical bond, but the electrical connection between the components and the board, too. The paste is melted upon application to establish these bonds, and when used with appropriate stencils, the placement of solder paste can be more precise. Components may be placed by hand or with a pick-and-place machine, depending on the complexity of the assembly. The right SMT solder paste will depend on the requirements of your assembly process. Manufacturers carry no-clean, lead-free, and halogen-free solder pastes to suit specific applications, like low-temperature processing and fine feature printing. The pastes are formulated in different alloy types, such as the low-Ag SMT adhesive, which provides reliable soldering performance. The product is also offered in spheres, wire, preforms, and solder bars to ensure compatibility and dependable solder joints in your application. Lead-free solder pastes in SMT assembly offer high throughput and reliability for the application, but if you require conventional solders, there are tin-lead or SnPb solder pastes that provide superb print volume repeatability. A halogen-free SMT adhesive is appropriate for applications where the presence of lead is unacceptable. A good solder paste for SMT applications should maximize reflow yield, and it must meet the highest IPC 7095 voiding performance classification (Class III). Consider a product that is compatible with either air or nitrogen reflow and will perform under print speeds of up to 200mm/sec to enable a fast print cycle time.

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