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Using Allegro PCB SI to Analyze a Board’s Power Delivery System from Power Source to Die Pad. International Cadence Usergroup Conference September 15 – 17, 2003 Juergen Flamm, Cadence. About the Author. Juergen Flamm Senior Technical Sales Leader Cadence Design Systems.
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International Cadence Usergroup Conference
September 15 – 17, 2003
Juergen Flamm, Cadence
Senior Technical Sales Leader
Cadence Design Systems
Juergen holds a MS EE degree from the “University Fridericiana” in Karlsruhe (Germany)
Throughout his career, he has been actively involved at all levels and in all aspects of electronic design.
He started designing wideband telephony line amplifiers and repeaters at AEG Telefunken. Next he joined Litef (Litton Germany) as the lead engineer for sensor electronic development. He designed mixed mode analog/digital ASICs, miniaturized hybrid electronics and next level multi-board system in a box electronics.
He relocated to the United States in 1990 to join Litton corporate as the leader of an international technology transfer team. Shortly after, he was promoted to manager of the Analog Design Group to move on to manager of the Electronic Engineering Department.
With the beginning of 2001, a planned careerr change brought Juergen to Cadence. He joined
PSD as a Senior Technical Sales Leader with focus on the Allegro PCB SI family of tools.
He holds 5 patents in the areas of performance electronics for fiber optic and MEMS sensors.
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Design & Analysis
Board with highlighted Plane Shapes, VRM, Noise Source, Grid Size
Multi Node Simulation result
Simple source impedance approximation: Z = 40mOhm + j2pi*f*0.32nH
Power & ground bus assignments
Power and ground bounce wave forms
Extracted net with current probe
Driver voltage wave form
Spectral current distribution
Driver current wave form
Comparison of Allegro PCB SI-SSN simulations with and without additional source impedance model added to pin parameters
Reflection/SSN simulation comparison
Falling edge detail