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sqpcb.com Advantages of Thermoelectric separation PCB
Thermoelectric separation in printed circuit boards (PCBs) offers a range of advantages, particularly in high-performance and high-reliability applications where efficient heat management is crucial.
Specifications Base Material: FR4/CEM3/CEM1/FR1/HighTG/LF/HF/High frequency/Al base/Cu base - Max Board Size:1L 1800*800mm;2L 1200*600mm;≧4L 1200*600mm - Copper thickness:1-12OZ - Min line / space: 3/3mil - Surface treatment:HASL,OSP,ENIG,ImmersionTin,ImmersionAg,Au plating - Lead time: 1-3 days trial order,5-7 days for normal order - Shipment:DHL/Fedex/UPS/TNT/EMS/AIR/SEA ect,Follow customers requirements - SMD SMT DIP Component Assembly
Here are some key advantages: Enhanced Heat Dissipation 2. Improved Energy Efficiency 3. Increased Component Density 4. Enhanced Reliability and Longevity 5. Reduced Need for Additional Cooling Systems 6. Optimized Performance in High-Temperature Environments 7. Enhanced Efficiency for Power Electronics 8. Lower Risk of Thermal Expansion and Damage These advantages make thermoelectric separation a valuable technology in PCBs, especially in advanced applications where thermal management is vital for operational stability and efficiency.
Contact Us : • Shenzhen Shuoqiang Electronics Co.,Ltd. • Address : Flool1,Building2,Road17,Xin'erzhuang village, Shajing, China, Shenzhen city,Guangdong,China,518000 • Call : +86 136 0306 3656 • URL : https://sqpcb.com