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Microplasma Optical Emission Spectrometer (MOES) on a chip. SFR Workshop November 8, 2000 Michiel Krüger, David Hsu, Scott Eitapence, K. Poolla, C. Spanos, D. Graves, O. Solgaard Berkeley, CA.

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Microplasma optical emission spectrometer moes on a chip

Microplasma Optical Emission Spectrometer (MOES) on a chip

SFR Workshop

November 8, 2000

Michiel Krüger, David Hsu, Scott Eitapence,

K. Poolla, C. Spanos, D. Graves, O. Solgaard

Berkeley, CA

2001 GOAL: to build a microplasma generating system and test it with bulk optical components by 9/30/2001.


Motivation and background
Motivation and background

  • Motivation

    • Precise detection of compounds near substrate required during semiconductor manufacturing

    • Organic compounds, emitted during DUV, can coat optics of stepper

  • Background

    • Small atmospheric pressure glow discharges can be used for species excitation.

    • Glow discharge optical emission spectroscopy has long history in analytical chemistry


Microplasma optical emission spectrometer
Microplasma Optical Emission Spectrometer

  • Basic idea:

    • OES from plasma reveals info about gas composition in chamber

  • Interdisciplinary:

    • plasma physics and chemistry

    • MEMS processing

    • optics and metrology

  • Inter-departmental:

    • chemical engineering

    • electrical engineering

    • mechanical engineering


Moes cont

plasma

cathode

 mm

dielectric

anode

MOES (cont.)

  • Generation of plasma with hollow cathode

  • Generation of plasma possible if: 0.05<p.D<10Torr.cm

  • Smaller diameter (75 mm) allows plasma generation at atmospheric pressure!

  • This results in smaller sensor

  • Many applications in (and outside!) IC processing industry (for example in lithography)

D


Schematic of initial moes experimental configuration

grating

detector array

lens

Schematic of initial MOES experimental configuration

  • Combination of

    • Bulk optical optical

      components

    • Microplasma chamber,

      fabricated in Si substrate

  • Light emitted from

    discharge is captured by

    lens and collimated onto grating

  • Diffracted light from grating is

    focused on detector array to record spectrum


First experiments plasma in 200 m m hole 100torr n 2 ambient

Molybdenum anode

Mica dielectric

(drilled hole)

Silicon chip with 200mm hole and aluminum cathode

First experiments: plasma in 200mm hole, 100Torr N2 ambient

molybdenum

chip

mica

dielectric

vacuum chamber


Currently fabricated in ucb microlab

50-200m

 0.7m

poly-Si

 1m

SiO2

 200m

substrate

Currently fabricated in UCB Microlab

  • Relatively simple to make

  • XeF2 etch to achieve required depth and undercut

  • Very small diameters, i.e. high pressure, possible

plasma

cathode

anode


Fabrication process and challenges
Fabrication process and challenges

  • Fabrication

    • OES cavity defined by deep reactive ion etching/XeF2 isotropic etch

    • anode/cathode defined on front and backside of wafer (metal or doped Silicon)

  • Challenges

    • Microplasma stability and contamination

    • Device sensitivity

    • Packaging of device

    • Exploration of pulsed operation to make autonomous power supply possible

    • Integration of micro discharges onto chips for other applications


2002 and 2003 goals
2002 and 2003 Goals

Build micro-optics for spectral analysis. Complete the preliminary designs for integrated MOES, by 9/30/2002.

Design and test integrated MOES. Calibration studies, sensor characterization, by 9/30/2003.


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