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CMS TRACKER SYSTEM TEST. Outer Barrel –TOB. End cap –TEC. Inner Barrel –TIB. TIB TOB TEC. Different Geometries One Readout Architecture One Powering Sch e ma. Power Supplies and Cables. Power supplies Situated in counting room I mplement a u nipolar scheme

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slide1

CMS TRACKER SYSTEM TEST

Outer Barrel –TOB

End cap –TEC

Inner Barrel –TIB

  • TIB
  • TOB
  • TEC

Different Geometries

One Readout Architecture

One Powering Schema

slide3

Power Supplies and Cables

  • Powersupplies
  • FloatingLV, HV power supplies of each power group, their Return
  • Lines connected inside the detector to the Common Detector Ground
  • Power Cables 140 m long
    • Voltage drop = 5V
    • Use of sens wires to compensate the voltage drop
    • Multipolar cable with low inductance , high capacitance to minimize voltage overshoots due to current variations
slide4

Definition of the System Test

  • The tracker has to enter its production phase
  • Need to validate a complete subset of it
    • Validate designs
    • Tune design details
    • Verify/optimize integration of components

Focus is not on component characterization, but on

overall system performance

  • The subsets: (for TIB/TOB/TEC)
  • A number of final modules (sensors +frontend hybrid)
  • integrated on the final mechanical support structure equipped with:
    • interconnectboards
    • optical digital links and electronics for control
    • optical analogue links for readout
    • power supplies + 100m MSCable
    • cooling
slide5

What is necessary to prove it works

  • Modules
      • Noise
      • Physics signals (ß-source, Laser), SNR
      • APV settings
      • Detector leakage currents
  • Compare with corresponding measurements taken with individual
  • modules in the “single module setup” (i.e. electrical readout)
  • Analogue readout chain
      • Optical link gain and bias point
      • timing alignment of moduls
      • Noise contributions, Crosstalk, Common mode effects
      • Operation margin
  • Control chain
      • Noise immunity ( Grounding, cabling, shielding)
      • Operation margin
      • Redundancy
  • Long Term Stability and Temperature stability of the system
slide6

What is necessary to prove it works

  • Interconnect boards, mother boards
    • Signal Integrity
  • the distribution of the fast control signals: clock, reset and back plane pulses,
  • Power distribution
  • voltage drops; uniformity of supply voltage distribution
  • Behaviour of full loaded system due to sudden variation in current consumption in correlation with:
      • large inductance of the long cables
      • slow reaction time of PSU
  • Protection against over-voltage?
slide7

What is necessary to prove it works

  • Mechanics
  • mechanical compatibility of the various components with the mechanical support structure
  • mechanical stress of the modules due to their fixation on cooling system and interconnect boards
  • Deformation upon cooldown due to different CTE´s
  • Ambient parameters
  • temperatures of the modules
  • temp. of various elements
  • humidity in several spots
slide8
Phase 1 (April-July):Readout of 1 to 6 modules with a complete (analog & digital) optical link; test with prototype PSUs with long cables.

Phase 2 (July-December): mechanical and electrical integration and tests of a small part of TIB:

6 double sided modules on Layer #1 cylinder

12 single sided modules on Layer #3 cylinder

Tracker Inner Barrel System Test

slide10

Tracker Inner Barrel System Test

LAB set-up in Florencecopper readout : UTRI+FEDoptical readout: Opto Hybrid + Fiber + Opto Receiver + Diff. Buffer +FED

PC with

FED, FEC and TSC

CCU

Detector and

Opto Hybrid

Interface Board

(UTRI)

slide11

Copper Readout

Noise

1.47 ADC

NCh/bin

60 ADC

AD counts

T(ns)

AD counts

Optical Readout

Optical Readout

AD counts

NCh/bin

57 ADC

  • Noise
  • 1.18 ADC

AD counts

T(ns)

signal to noise

Tracker Inner Barrel System Test

Signal to noise
  • Signal equivalent to roughly 2 MIPs
  • Copper readout: S/N =42
  • Optical readout: S/N =48
slide13

Tracker Outer Barrel System Test

Patch panel

InterConnect Bus

Cooling pipe

Module frame

Module support blocks

The rod components

InterConnect Cards

110 cm

15 cm

slide14

Tracker Outer Barrel System Test

  • Detailed electrical test of IC bus + IC cards, with 12FE- Hybrids and
  • 8 OptoHybrids (almost full load)
    • Check of the signal integrity
    • Optimization of the impedance matching
    • Measurement of the voltage drop along the bus
    • Test of I2C communication
  • Results
  • The design of IC Bus and IC Cards is correct – signals are very clean
  • A few details have been fixed/optimized
  • Optical link commissioned on a single channel setup
  • Nominal gain of the link verified
  • Optimization of the bias point
slide15

Tracker Outer Barrel System Test

Next step:

Integrate a rod with electrical components and real modules

Build an Alu box, gas tight, with patch panel for pipes (cooling and dry air)

and other services (It can house 2 rods)

Add external temperature

and humidity probes

Commission a cooling system

with C6F14

slide16

Tracker Outer Barrel System Test

Current status:

  • All modules working properly and read out under bias
  • External temperatures probes also read out
  • Cooling running smoothly
  • Grounding scheme similar to the “final” one implemented
  • Now ready to start quantitative measurements

Further steps

  • Study sensitivity to noise on the power lines / grounding
  • Go to the tracker operating temperature
  • Install 12 detectors in the second rod (DS rod)
  • Add a second rod
slide17

Tracker Endcap System Test

Front petal

  • 28 Si-detectors
  • 28 FE hybrids
  • 28 Optohybrids
  • 2 CCUM
  • 4 IC Boards

B-side

A-side

front petalback petal

3 power groups : 1. Ring #1, #2 48 APVs 24 APVs

2. Ring #3, #4, #6 44 APVs 32 APVs

3. Ring #5, #7 44 APVs 56 APVs

slide18

Tracker Endcap System Test

  • Design verification of petals
    • mechanics, done
    • electrical performance of the interconnect board, done
    • deformation after cooldown tested
  • System test in 4 steps:
  • Test of the 2nd detector group (rings #3, #4, #6)
  • Test of the 3rd detector group (rings #5, #7)
      • Fully equipped but without Si-Sensors,
  • Test of the 1st detector group (rings #1, #2)
      • Fully equipped but without Si-Sensors,
    • Results expected by the end of this year
  • Full System Test for Front and Back petal
    • fully equipped with Sensors and front end electronics
    • with final cables and power supplies
  • Final results expected in spring 2003
slide19

Tracker Endcap System Test

Test of the mechanical compatibility

Digital Optical Hybrid

R#7

Interconnect Board

R#6

Analogue Optical Hybrid

R#5

R#4

Frontend Hybrid

R#3

R#2

R#1

slide21

Tracker Endcap System Test

Signal Integrity

Differential Bunch Clock Pulse

Reset Pulse

  • Over-voltage measurements
  • Behaviour of full loaded system due to sudden variation in current consumption (switching off the frontend hybrids)
      • over-voltage swing due to inductance of the long cables
      • over-voltage gradient due to slow reaction time of the PSU
slide22

Tracker Endcap System Test

Setup for the Measurements of the Over-voltage

slide23

Overvoltage measurements

C250 = 60 µF, C125 = 40 µF

  • Over-voltage swing due to
  • cable inductance
  • Commercial power supplies
  • Sense wires not connected
  • Cable Length = 100m
  • Different dumping capacitances

V2.50

V1.25

I250 = 1.2 A

I125 = 0.52A

C250 = 330 µF, C125 = 330 µF

C250 = 740 µF, C125 = 740 µF

V2.50

V2.50

V1.25

V1.25

I250 = 1.0 A

I125 = 0.52 A

I250 = 2.75 A

I125 = 0.84 A

slide24

Over-voltage measurements

  • Overvoltage gradient
  • due to slow regulation time of PSU
  • senses wires connected
  • commercial power supply
  • dumping capacitance 700µF
  • cable 100m, U = 0.8V
  • 4 frontend hybrids toggled; I = 2A
  • Overvoltage .4 V above the limit
  • Over voltage is a potential problem.
    • Overvoltage gradient requires :
      • special power supply design or
      • radhard voltage limiter located close to detector
      • could be reduced by proper system architecture
    • Overvoltage swing could be fixed by:
      • reasonable damping capacitance on the interconnect boards
slide25

Conclusions and Remarks

  • System test is underway for TIB/TOB/TEC
  • The goal is to test an overall performance of a complete subsystem:
  • Si-Modules + FE-electronics
  • / analogue optical links / digital control links /long cables /
  • power supplies /monitoring
  • It´s intended to be a step by step process
  • All sub-components will be integrated as soon as they are
  • made available
  • First TOB Rod is integrated, ready to start quantitative
  • measurements
  • Final results for all detectors are expected by the
  • beginning of 2003
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