CMS   TRACKER  SYSTEM TEST
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CMS TRACKER SYSTEM TEST. Outer Barrel –TOB. End cap –TEC. Inner Barrel –TIB. TIB TOB TEC. Different Geometries One Readout Architecture One Powering Sch e ma. Power Supplies and Cables. Power supplies Situated in counting room I mplement a u nipolar scheme

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CMS TRACKER SYSTEM TEST

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CMS TRACKER SYSTEM TEST

Outer Barrel –TOB

End cap –TEC

Inner Barrel –TIB

  • TIB

  • TOB

  • TEC

Different Geometries

One Readout Architecture

One Powering Schema


Power Supplies and Cables

  • Powersupplies

    • Situated in counting room

    • Implement a unipolar scheme

    • PS modules power groups of ~60APV

    • I@2.5V =10A, I@1.25V=4A I@0V =14A

    • Each PS module equipped with 2 HV channels for detector bias

  • FloatingLV, HV power supplies of each power group, their Return

  • Lines connected inside the detector to the Common Detector Ground

  • Power Cables 140 m long

    • Voltage drop = 5V

    • Use of sens wires to compensate the voltage drop

    • Multipolar cable with low inductance , high capacitance to minimize voltage overshoots due to current variations


Definition of the System Test

  • The tracker has to enter its production phase

  • Need to validate a complete subset of it

    • Validate designs

    • Tune design details

    • Verify/optimize integration of components

      Focus is not on component characterization, but on

      overall system performance

  • The subsets: (for TIB/TOB/TEC)

  • A number of final modules (sensors +frontend hybrid)

  • integrated on the final mechanical support structure equipped with:

    • interconnectboards

    • optical digital links and electronics for control

    • optical analogue links for readout

    • power supplies + 100m MSCable

    • cooling


What is necessary to prove it works

  • Modules

    • Noise

    • Physics signals (ß-source, Laser), SNR

    • APV settings

    • Detector leakage currents

  • Compare with corresponding measurements taken with individual

  • modules in the “single module setup” (i.e. electrical readout)

  • Analogue readout chain

    • Optical link gain and bias point

    • timing alignment of moduls

    • Noise contributions, Crosstalk, Common mode effects

    • Operation margin

  • Control chain

    • Noise immunity ( Grounding, cabling, shielding)

    • Operation margin

    • Redundancy

  • Long Term Stability and Temperature stability of the system


  • What is necessary to prove it works

    • Interconnect boards, mother boards

      • Signal Integrity

    • the distribution of the fast control signals: clock, reset and back plane pulses,

    • Power distribution

    • voltage drops; uniformity of supply voltage distribution

    • Behaviour of full loaded system due to sudden variation in current consumption in correlation with:

      • large inductance of the long cables

      • slow reaction time of PSU

  • Protection against over-voltage?


  • What is necessary to prove it works

    • Mechanics

    • mechanical compatibility of the various components with the mechanical support structure

    • mechanical stress of the modules due to their fixation on cooling system and interconnect boards

    • Deformation upon cooldown due to different CTE´s

    • Ambient parameters

    • temperatures of the modules

    • temp. of various elements

    • humidity in several spots


    Phase 1 (April-July):Readout of 1 to 6 modules with a complete (analog & digital) optical link; test with prototype PSUs with long cables.

    Phase 2 (July-December): mechanical and electrical integration and tests of a small part of TIB:

    6 double sided modules on Layer #1 cylinder

    12 single sided modules on Layer #3 cylinder

    Tracker Inner Barrel System Test


    Tracker Inner Barrel System Test


    Tracker Inner Barrel System Test

    LAB set-up in Florencecopper readout : UTRI+FEDoptical readout: Opto Hybrid + Fiber + Opto Receiver + Diff. Buffer +FED

    PC with

    FED, FEC and TSC

    CCU

    Detector and

    Opto Hybrid

    Interface Board

    (UTRI)


    Copper Readout

    Noise

    1.47 ADC

    NCh/bin

    60 ADC

    AD counts

    T(ns)

    AD counts

    Optical Readout

    Optical Readout

    AD counts

    NCh/bin

    57 ADC

    • Noise

    • 1.18 ADC

    AD counts

    T(ns)


    Tracker Inner Barrel System Test

    Signal to noise

    • Signal equivalent to roughly 2 MIPs

    • Copper readout: S/N =42

    • Optical readout: S/N =48


    Tracker Outer Barrel System Test

    Patch panel

    InterConnect Bus

    Cooling pipe

    Module frame

    Module support blocks

    The rod components

    InterConnect Cards

    110 cm

    15 cm


    Tracker Outer Barrel System Test

    • Detailed electrical test of IC bus + IC cards, with 12FE- Hybrids and

    • 8 OptoHybrids (almost full load)

      • Check of the signal integrity

      • Optimization of the impedance matching

      • Measurement of the voltage drop along the bus

      • Test of I2C communication

    • Results

    • The design of IC Bus and IC Cards is correct – signals are very clean

    • A few details have been fixed/optimized

    • Optical link commissioned on a single channel setup

    • Nominal gain of the link verified

    • Optimization of the bias point


    Tracker Outer Barrel System Test

    Next step:

    Integrate a rod with electrical components and real modules

    Build an Alu box, gas tight, with patch panel for pipes (cooling and dry air)

    and other services (It can house 2 rods)

    Add external temperature

    and humidity probes

    Commission a cooling system

    with C6F14


    Tracker Outer Barrel System Test

    Current status:

    • All modules working properly and read out under bias

    • External temperatures probes also read out

    • Cooling running smoothly

    • Grounding scheme similar to the “final” one implemented

    • Now ready to start quantitative measurements

    Further steps

    • Study sensitivity to noise on the power lines / grounding

    • Go to the tracker operating temperature

    • Install 12 detectors in the second rod (DS rod)

    • Add a second rod


    Tracker Endcap System Test

    Front petal

    • 28 Si-detectors

    • 28 FE hybrids

    • 28 Optohybrids

    • 2 CCUM

    • 4 IC Boards

    B-side

    A-side

    front petalback petal

    3 power groups : 1. Ring #1, #2 48 APVs 24 APVs

    2. Ring #3, #4, #6 44 APVs 32 APVs

    3. Ring #5, #7 44 APVs 56 APVs


    Tracker Endcap System Test

    • Design verification of petals

      • mechanics, done

      • electrical performance of the interconnect board, done

      • deformation after cooldown tested

    • System test in 4 steps:

    • Test of the 2nd detector group (rings #3, #4, #6)

    • Test of the 3rd detector group (rings #5, #7)

      • Fully equipped but without Si-Sensors,

  • Test of the 1st detector group (rings #1, #2)

    • Fully equipped but without Si-Sensors,

  • Results expected by the end of this year

  • Full System Test for Front and Back petal

    • fully equipped with Sensors and front end electronics

    • with final cables and power supplies

  • Final results expected in spring 2003


  • Tracker Endcap System Test

    Test of the mechanical compatibility

    Digital Optical Hybrid

    R#7

    Interconnect Board

    R#6

    Analogue Optical Hybrid

    R#5

    R#4

    Frontend Hybrid

    R#3

    R#2

    R#1


    First optical readout of TEC Module: Lyon


    Tracker Endcap System Test

    Signal Integrity

    Differential Bunch Clock Pulse

    Reset Pulse

    • Over-voltage measurements

    • Behaviour of full loaded system due to sudden variation in current consumption (switching off the frontend hybrids)

      • over-voltage swing due to inductance of the long cables

      • over-voltage gradient due to slow reaction time of the PSU


    Tracker Endcap System Test

    Setup for the Measurements of the Over-voltage


    Overvoltage measurements

    C250 = 60 µF, C125 = 40 µF

    • Over-voltage swing due to

    • cable inductance

    • Commercial power supplies

    • Sense wires not connected

    • Cable Length = 100m

    • Different dumping capacitances

    V2.50

    V1.25

    I250 = 1.2 A

    I125 = 0.52A

    C250 = 330 µF, C125 = 330 µF

    C250 = 740 µF, C125 = 740 µF

    V2.50

    V2.50

    V1.25

    V1.25

    I250 = 1.0 A

    I125 = 0.52 A

    I250 = 2.75 A

    I125 = 0.84 A


    Over-voltage measurements

    • Overvoltage gradient

    • due to slow regulation time of PSU

    • senses wires connected

    • commercial power supply

    • dumping capacitance 700µF

    • cable 100m, U = 0.8V

    • 4 frontend hybrids toggled; I = 2A

    • Overvoltage .4 V above the limit

    • Over voltage is a potential problem.

      • Overvoltage gradient requires :

        • special power supply design or

        • radhard voltage limiter located close to detector

        • could be reduced by proper system architecture

      • Overvoltage swing could be fixed by:

        • reasonable damping capacitance on the interconnect boards


    Conclusions and Remarks

    • System test is underway for TIB/TOB/TEC

    • The goal is to test an overall performance of a complete subsystem:

    • Si-Modules + FE-electronics

    • / analogue optical links / digital control links /long cables /

    • power supplies /monitoring

    • It´s intended to be a step by step process

    • All sub-components will be integrated as soon as they are

    • made available

    • First TOB Rod is integrated, ready to start quantitative

    • measurements

    • Final results for all detectors are expected by the

    • beginning of 2003


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