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Independent Studies with Industry Partnership

Independent Studies with Industry Partnership. John Cohn (Sr. Engineer, IBM) Joanna Ellis Monaghan (Math, St. Michael’s College)* Dan Nardi (Student, University of Vermont) Robert Snapp (CS, University of Vermont). Goal.

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Independent Studies with Industry Partnership

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  1. Independent Studies withIndustry Partnership John Cohn (Sr. Engineer, IBM) Joanna Ellis Monaghan (Math, St. Michael’s College)* Dan Nardi (Student, University of Vermont) Robert Snapp (CS, University of Vermont)

  2. Goal • To solicit industry applications that provide rewarding independent study projects for both undergraduate and graduate students.

  3. Make Contact • Identify area industries. • Start with community outreach person, get in touch with a manager (keep trying until you get someone who seems interested) • emphasize potential benefit to the company • describe similar endeavors (for us, ground work was laid by very successful bio-informatics collaboration)

  4. Have a forum • A mechanism for facilitating the building of individual relationships (for us, the “applied” combinatorics seminar).

  5. Solicit problems • Give industry presenters an audience of potential collaborators, particularly faculty who can see the potential in the problems and then share them with students.

  6. Select areas • Combinatorics • Operations Research • Statistics • Dynamical Systems • Computer Science • Biology • Physics (interdisciplinary as well as academic/industry collaboration)

  7. Involving students These projects are generally very appealing to students • Not busywork--someone actually cares about the results. • Good for work experience and resume building. • Potential source of non-academic letter of reference. • Summer job/co-op/permanent employment potential

  8. Find Funding • Lots of potential, (but no action yet….)

  9. A Current Independent Study • Goal of this project is to check a chip’s design and find all occurrences of a simple pattern • Can be used to: • Find possible error spots • Check for already patented segments • Locate particular devices

  10. The Haystack • Sample layout of a chip (includes multiple layers)

  11. The Needle in the Haystack • Sample pattern we might look for

  12. The Input • The data to explain these patterns comes in the following format (.gul) BEGIN /* GULP2A CALLED ON THU FEB 21 15:08:23 2002 */ EQUIV 1 1000 MICRON +X,+Y MSGPER -1000000 -1000000 1000000 1000000 0 0 HEADER GYMGL1 'OUTPUT 2002/02/21/14/47/12/cohn' LEVEL PC LEVEL RX CNAME ULTCB8AD CELL ULTCB8AD PRIME PGON N RX 1467923 780300 1468180 780300 1468180 780600 + 1469020 780600 1469020 780300 1469181 780300 1469181 + 781710 1469020 781710 1469020 781400 1468180 781400 + 1468180 781710 1467923 781710 PGON N PC 1468500 782100 1468300 782100 1468300 781700 + 1468260 781700 1468260 780300 1468500 780300 1468500 + 780500 1468380 780500 1468380 781500 1468500 781500 RECT N PC 1467800 780345 1503 298 ENDMSG

  13. Sub-Graph Overlay Problem Two different layers/rectangles are combined into one layer that contains three shapes; one rectangle (purple) and two polygons (red and blue)

  14. Overlay Visualization Data represented visually after the algorithm is run. After the Overlay Algorithm is run there are no overlapping shapes. Each distinct shape is represented by a polygon with 4 or more sides. Algorithms is cutting edge, and not currently used for this application in industry

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