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Semiconductor Processing (front-end). Stuart Muter 617.371.3853 [email protected] 12/02/2002. Semiconductor Processing. Agenda: An overview of the key steps in semi-conductor processing (how to make one of Stuart’s wafers).

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semiconductor processing
Semiconductor Processing

Agenda: An overview of the key steps in semi-conductor processing (how to make one of Stuart’s wafers).

A lot of information is in the packet, we will not be able to cover it all.

table of contents
Table of Contents

Section A Introduction to Semiconductor Manufacturing

Section B Key Processing Steps

- Deposition

- Etch

- Lithography

- Doping and Anneal

- CMP

Section C Future Trends

front end processing
Front End Processing

Key Steps

  • Deposition
  • - CVD
  • - PVD
  • - Oxidation
  • Etch
  • Lithography
  • Doping and Anneal
  • - Diffusion
  • - Ion Implant
  • - RTP
  • CMP
moore s law
Moore’s Law

Transistor density doubles every 2 years

Moore’s Law

Wafer Sizes

Source: www.intel.com

Source: Design News

state of the art semi device
State of the Art Semi Device
  • 0.13 micron critical dimension (human hair diameter is approx. 100 microns).
  • 7 metal layers
  • 25 mask steps
  • 300 - 400 process steps
state of the art fab
State of the Art Fab
  • 300mm wafers
  • $2-3 billion cost
  • wafer cycle time: 30 -80 days
  • WIP: 20 - 40K wafers
  • Full material automation
  • Cleanroom: Class 10 or 100
  • Mini-environment: Class 0.1
semi equipment industries

WFE Revenue Forecast by Equipment Segment ($ Millions)

Semi-Equipment Industries

Wafer Fab Equipment Spending

Source: Gartner Dataquest (July 2002)

device manufacturing

Fab

0.5µ CMOS Process Flow

Device Manufacturing
integrated circuit manufacturing process
Integrated Circuit Manufacturing Process

The “big picture” process

slide14

SECTION B:

Key Processing Steps

blanket metal deposition
Blanket Metal Deposition

Typically PVD or MCVD

physical vapor deposition
Physical Vapor Deposition
  • Preferred conductor deposition technology
  • Barrier and seed layer for Cu
  • DC/RF magnetron sputtering
  • Conductors:
  • - Al (interconnect), Ti, TiN, TiW (barrier and ARC), W (vias), Cu
ad