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Semiconductor Processing (front-end). Stuart Muter 617.371.3853 [email protected] 12/02/2002. Semiconductor Processing. Agenda: An overview of the key steps in semi-conductor processing (how to make one of Stuart’s wafers).

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Semiconductor Processing (front-end)

Stuart Muter

617.371.3853

[email protected]

12/02/2002


Semiconductor processing
Semiconductor Processing

Agenda: An overview of the key steps in semi-conductor processing (how to make one of Stuart’s wafers).

A lot of information is in the packet, we will not be able to cover it all.


Table of contents
Table of Contents

Section A Introduction to Semiconductor Manufacturing

Section B Key Processing Steps

- Deposition

- Etch

- Lithography

- Doping and Anneal

- CMP

Section C Future Trends


SECTION A: Introduction to Semiconductor Manufacturing


Front end processing
Front End Processing

Key Steps

  • Deposition

  • - CVD

  • - PVD

  • - Oxidation

  • Etch

  • Lithography

  • Doping and Anneal

  • - Diffusion

  • - Ion Implant

  • - RTP

  • CMP


Moore s law
Moore’s Law

Transistor density doubles every 2 years

Moore’s Law

Wafer Sizes

Source: www.intel.com

Source: Design News



State of the art semi device
State of the Art Semi Device

  • 0.13 micron critical dimension (human hair diameter is approx. 100 microns).

  • 7 metal layers

  • 25 mask steps

  • 300 - 400 process steps


State of the art fab
State of the Art Fab

  • 300mm wafers

  • $2-3 billion cost

  • wafer cycle time: 30 -80 days

  • WIP: 20 - 40K wafers

  • Full material automation

  • Cleanroom: Class 10 or 100

  • Mini-environment: Class 0.1


Semi and semi equipment industries

Worldwide Semiconductor Market

Source: WSTS 11/01

Semi and Semi-Equipment Industries

Market Segmentation


Semi equipment industries

WFE Revenue Forecast by Equipment Segment ($ Millions)

Semi-Equipment Industries

Wafer Fab Equipment Spending

Source: Gartner Dataquest (July 2002)


Device manufacturing

Fab

0.5µ CMOS Process Flow

Device Manufacturing


Integrated circuit manufacturing process
Integrated Circuit Manufacturing Process

The “big picture” process


SECTION B:

Key Processing Steps


Blanket metal deposition
Blanket Metal Deposition

Typically PVD or MCVD


Physical vapor deposition
Physical Vapor Deposition

  • Preferred conductor deposition technology

  • Barrier and seed layer for Cu

  • DC/RF magnetron sputtering

  • Conductors:

  • - Al (interconnect), Ti, TiN, TiW (barrier and ARC), W (vias), Cu


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