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WROCLAW UNIVERSITY OF TECHNOLOGY

WROCLAW UNIVERSITY OF TECHNOLOGY. Faculty of Microsystem Electronics and Photonics. Dean - Andrzej Dziedzic. Faculty of Microsyste m Electronics and Photonics - WEMIF.

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WROCLAW UNIVERSITY OF TECHNOLOGY

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  1. WROCLAW UNIVERSITY OF TECHNOLOGY Faculty of Microsystem Electronics and Photonics Dean - Andrzej Dziedzic

  2. Faculty of Microsystem Electronics and Photonics - WEMIF WEMIF employs 61 academic teachers, including 6 full professors, 10 associated professors and 35 assistant professors. Moreover WEMIF has 42 PhD students and about 850 students. Faculty Majors: Photonics Microelectronics and Microsystems • development of microsensors and microsystems for environmental and chemical applications • silicon micromechatronics and microsystems • thick and thin film circuits • process technology and characterisation of device structures for microwave • digital ASIC design • hybrid microelectronics • interconnecting and packaging electronic circuits(assemblies, materials, prototyping methods) • photovoltaics and solar cells (PV modules assembling/encapsulation, design and monitoring of PV systems) • optoelectronics, including integrated optics and fiber waveguides, design, fabrication and measurements of photonics devices and systems • process technology and characterisation of device structures for optoelectronics DIAGNOSTICS TECHNOLOGY

  3. Faculty of Microsystem Electronics and Photonics - WEMIF Faculty Units Division of Microelectronics and Nanotechnology (W12/Z1) Director: Marek Tłaczała, associate professor Division of Vacuum and Plasma Technologies (W12/Z2) Director: Witold Posadowski, associate professor Division of Micro- and Nanostructures Metrology (W12/Z3) Director: Teodor Gotszalk, associate professor Division of Technology and Diagnostics of Microelectronic Structures (W12/Z4) Director: Tadeusz Berlicki, professor Laboratory for Interconnecting and Packaging Electronic Circuits (W12/Z5) Director : Jan Felba, associate professor Division of Microsystems and Photonics (W12/Z6) Director: Leszek Golonka, professor

  4. GaAs AlGaAs Optoelectronics GaInNAs Microwaves • Schottky diode • MESFET • HEMT, HFET • OEIC • MMIC • detectors PIN, MSM • photo-voltaics • photo-HBT Division of Microelectronics and Nanotechnology (W12/Z1) The Main Research Interest MOCVD II MOCVD I III-N GaN, AlGaN Characterization Device technology • photoluminescence • X-ray diffractometry • dopant profiling C-V, PVS (Bio-Rad) • admitance spectroscopy • photoreflectance spectroscopy

  5. Division of Vacuum and Plasma Technologies (W12/Z2) Thin Films Techniques Physical Vapour Deposition (PVD)(novel thin films deposition methods) very high efficiency deposition of pure metal layers using DC and pulsed magnetron sputtering,  reactive, medium frequency pulsed magnetron sputtering,  self-sustained magnetron sputtering (SSS) :  DC self-sustained magnetron sputtering (DC-SSS),  pulsed DC self-sustained magnetron sputtering (pulsed DC-SSS)

  6. Division of Micro and Nanoscructure Metrology (W12/Z3) • Scanning Probe Microscopy Laboratory • Research Activity – Part 1 • Scanning Probe Microscopy-SPM diagnostics of micro- and nanostructures: • Lateral Force Microscopy-LFM and Load Modulation Force Microscopy-LMFM with piezoresistive cantilevers, • Scanning Thermal Microscopy-SThM using Nanoprobe and Wollaston sensors, • Electrostatic Force Microscopy-EFM using piezoresistive sensors, Si conductive cantilevers and cantilevers with metallic tips, • Scanning Nearfield Optical Microscopy-SNOM using fiber and cantilever sensors, • Quantitative nanostructure geometry investigations with calibrated Atomic Force Microscopy-AFM instruments, • SPM nanolithography on metallic and semiconductor surfaces. Topography of Au/Zn/Cr metalization Thermal conductivityof Au/Zn/Cr metalization

  7. Division of Technology and Diagnostic of Microelectronics Structures(W12/Z4) Domain of study: • technology of fabrication microelectronic passive structures for new generation microsensors • fabrication of TCO (Transparent Conducting Oxide) and TOS (Transparent Oxide Semiconductor) thin films by reactive magnetron sputtering method for transparent electronic • electrical and optical diagnostic of materials and semiconductor structures • qualitative and quantitative diagnostic investigation of lattice mismatched AIIIBV semiconductor heterostructures and low-dimensional structures by Deep-Level Transient Spectroscopy (DLTS) • experimental and theoretical analysis of electronic states at extended defects (e.g. dislocations)

  8. Laboratory for Interconnecting and Packaging Electronic Circuits – LIPEC(W12/Z5) THE MAIN ACTIVITY: • interconnecting and packaging microelectronic circuits - materials and technology(developing and improving of dice attachment methods: flip-chip, chip-on-board, chip-scale-package, semi-flip-chip, twin-chips and so forth) • investigation of new materials for green polymer as well as micro and nano-scale electronics • numerical prototyping, optimization and multi-physics simulations of the microelectronic devices, packages and MEMS • microelectronic devices and packages reliability evaluation and assessment • thermo-mechanical material properties characterization in reference to micro-scale and nano-scale

  9. Division of Microsystems and Photonics - Thick-Film Microsystems Laboratory (W12/Z6) • Main Activities • Passive components in LTCC modules • LTCC packaging • Modeling of temperature and fluid flow in LTCC modules • Thermoelectric microgenerators • Thermographic measurements of microsystems • Integrated microfluidic systems • Applications of LTCC inoptoelectronics • Microsystems for biological applications • Sensors

  10. Channel (crossection) Micr.Int. 2002 Pressure sensor COE 2000 DC-DC converter Kita PhD 2003 Gas sensor, Sens&Act B 1998 Division of Microsystems and Photonics - Thick-Film Microsystems Laboratory (W12/Z6) LTCC modules investigated at TML Fluidic microreactor with optical detection Int.J.Appl.Cer.Tech.,2006 Enzymatic microreactor CICMT 2008 Gas flow sensor CICMT 2008 LTCC microreactor

  11. Faculty of Microsystem Electronics and Photonics - EDUCATION Major: ELECTRONICS AND TELECOMMUNICATIONS Academic year 2009/2010 Year I, II and III – first-cycle studies (7 semesters), mode of study; full-time studies and next Second-cycle studies (3 semesters) are planned Year IV and V – MSc courses (10 semesters), mode of study; full-time studies with 3 specializations: • Microsystems • Optoelectronics and optical fiber technology • Electronics, photonics and microsystems (offered in English)

  12. Electronics and Telecommunications – ELECTRONICS, PHOTONICS AND MICROSYSTEMS

  13. Electronics and Telecommunications – ELECTRONICS, PHOTONICS AND MICROSYSTEMS 1st YEAR, SEMESTER 1 Basic courses CHS – Contact Hours (organized), TSW – Total Student Workload (h), E – Exam, T – Test Advanced courses

  14. Electronics and Telecommunications – ELECTRONICS, PHOTONICS AND MICROSYSTEMS 1st YEAR, SEMESTER 2 Basic courses CHS – Contact Hours (organized), TSW – Total Student Workload (h), E – Exam, T – Test Advanced courses

  15. Electronics and Telecommunications – ELECTRONICS, PHOTONICS AND MICROSYSTEMS 2nd YEAR, SEMESTER 3 CHS – Contact Hours (organized), TSW – Total Student Workload (h), E – Exam, T – Test, CW - Course Work

  16. Faculty of Microsystem Electronics and Photonics …lets join us !!! Thank you

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