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Autonomous On-Wafer Sensor Arrays. SFR Workshop November 8, 1999 Mason Freed, Kameshwar Poolla, and Costas Spanos Berkeley, CA.

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Autonomous on wafer sensor arrays

Autonomous On-Wafer Sensor Arrays

SFR Workshop

November 8, 1999

Mason Freed, Kameshwar Poolla, and Costas Spanos

Berkeley, CA

This project involves the incorporation of sensors, a communication system, and a power supply onto a standard silicon wafer, for the purpose of supplying wafer-state information during a process step.


Overview
Overview

  • Motivation

    • Certain wafer-state variables are difficult or destructive to measure, and many are impossible to measure in real-time

    • Add-on in-situ measurement devices are costly and cumbersome

  • Proposal: distributed sensor array on a wafer


Test case etch rate

I

I

Poly-Si

V

Test-Case: Etch Rate

  • Polysilicon etch rate sensors based on van der Pauw probe electrical film-thickness measurement:

  • Use wired connections for power and communications

  • Initial testing in XeF2, an isotropic, gaseous etchant

    • No problem making connections to wafer

    • No electrical or physical isolation necessary


Design 1
Design #1

  • Connections made using “edge-board” connector:

Sensors

Edge-board connector


Results design 1
Results (Design #1)

  • Eleven etch cycles performed, interferometric thickness measurements made between each cycle.

  • Repeatability:  12.89 Å

  • Accuracy:  45.9 Å

  • Stability: 3.2 Å drift in 15 minutes.


Design 2
Design #2

Temperature-referenced Sensors

Surface mount multiplexers

Edge-board pads


Results design 2
Results (Design #2)

  • Preliminary test of a single sensor only, during etch


Progress vs milestones
Progress vs Milestones

Year 1

  • Demonstrate tethered, real-time etch-rate measurements in chemical, non-plasma etch. (Done)

    Year 2

  • Demonstrate un-tethered real-time measurements with integrated power and data processing. (Work in progress)


Future work
Future Work

Next Year

  • Conduct testing of new sensor design.

  • Research isolation schemes to allow operation in plasma conditions.

  • Work on integrating power and communications modules onto sensor wafer, for wireless operation.

    2000-2002

  • Develop additional integrated sensors for plasma.

  • Develop sensors for other processes (DUV resist processing, Rapid Thermal Processing steps.)


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