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Design for Printability From Device to Circuit for Flexible Electronics. Tsung-Ching (Jim) Huang Tim Cheng February 10th 2007. Outline. Introduction Motivation – Why design with flexible electronics Limitation – What difference from Si MOFET circuit design A-Si:H TFT Organic TFT

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Design for Printability From Device to Circuit for Flexible Electronics

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Design for printability from device to circuit for flexible electronics l.jpg

Design for PrintabilityFrom Device to CircuitforFlexible Electronics

Tsung-Ching (Jim) Huang

Tim Cheng

February 10th 2007


Outline l.jpg

Outline

  • Introduction

    • Motivation – Why design with flexible electronics

    • Limitation – What difference from Si MOFET circuit design

      • A-Si:H TFT

      • Organic TFT

  • Robust Circuit Design for Flexible Electronics

    • A-Si:H TFT

      • Robust building blocks

    • Organic TFT

      • Cell library design

      • Printable circuit layout


Why design with flexible electronics l.jpg

U. Tokyo

Poly IC

ASU

Plastic Logic

Polymer Vision

Why Design with Flexible Electronics


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What Differences from Si MOFET Circuit Design


Outline5 l.jpg

Outline

  • Introduction

    • Motivation – Why design with flexible electronics

    • Limitation – What difference from Si MOFET circuit design

      • A-Si:H TFT

      • Organic TFT

  • Robust Circuit Design for Flexible Electronics

    • A-Si:H TFT

      • Robust building blocks

    • Organic TFT

      • Cell library design

      • Printable circuit layout


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Pseudo-ComplementaryA-Si:H TFT Inverter


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A-Si:H TFT Inverter Transfer Function


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Output Reponses ofN-TFT Inverter Chain

  • Signal strength after propagation will diminish due to insufficient noise margin

  • Insufficient for circuit design with a certain degree of complexity


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Output Reponses ofC-TFT Inverter Chain

  • Signal strength after propagation remains at the same level as input signal

  • Sufficient for circuit design of higher complexity


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Immunity to Threshold Voltage Variation


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Compensation to Threshold Voltage Variation


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Outline

  • Introduction

    • Motivation – Why design with flexible electronics

    • Limitation – What difference from Si MOFET circuit design

      • A-Si:H TFT

      • Organic TFT

  • Robust Circuit Design for Flexible Electronics

    • A-Si:H TFT

      • Robust building blocks

    • Organic TFT

      • Cell library design

      • Printable circuit layout


Published otft model l.jpg

Published OTFT Model

~ pF

~ pF

~ kΩ

~ kΩ

Top Gate

Bottom Contact

Ref: M. Fadlallah et al, Plastic Logic, J. Applied Physics 2006


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Printed Passive Component

Physical dimension for high-impedance resistance:

1KΩ 2mm x 1mm

(190ºC, 1-layer)

  • Ink-jetted resistance normally can have much higher value than standard clean-room process

  • High impedance resistance can be beneficial in implementing pseudo-complementary design

Resistance

50 μm drop size

Capacitance

Ref: D. Radinger et al, J. Electron Device ‘04


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Pseudo-ComplementaryOTFT Inverter

Ratio-less Logic

  • PMOS together with necessary series resistance is used for OTFT equivalent model


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Inverter Layout

32 Units

46 Units

1 Unit = 50 μm


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Output Response toThreshold Voltage Variation

  • PC-OTFT exhibits robustness again VTH variation due to electrical or chemical degradation


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Output Response of Inverter Chain

  • Signal propagation will not diminish in PC-OTFT inverter design because of ratio-less design

  • After 10-stage signal propagation, ordinary OTFT inverter can not generate the same signal strength


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2-Input NAND Layout

79 Units

85 Units


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3-Input NAND Layout

90 Units

115 Units


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2-Input NOR Layout

79 Units

61 Units


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PC-OTFTD Flip-Flop Output Response

  • D-FF composed of PC-OTFT NAND gates exhibits good noise-margin in output response


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2-Bit ROM Layout

  • Ex1.

  • Input [ 0 1 0 0 ]

  • Output [ 0 1 0 1]

  • Ex2.

  • Input [0 0 1 0]

  • Output [0 0 1 0]

79 Units

89 Units


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Summary

  • Flexible electronics technology is now emerging and more commercial applications will become available

  • Low-cost, bendable, thin-film, and light-weight properties are highly desirable in consumer electronics

  • Circuit reliability and lifetime remain to be the biggest challenges to make wide use and market penetration

  • Novel circuit building blocks and printable layout are demonstrated to extend circuit lifetime

  • Significant innovations in material/device/design/testing area are still required


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Q & A

Thank you for your attention !!


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