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Microgear Transmission Process Sequence Diagram. Presented By: Christian Daco James Ford Michael Layman Huey Lee Allan Siu. Starting with a silicon substrate…. Silicon Substrate. 1. LPCVD 2  m layer silicon dioxide (SiO 2 ).

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Microgear transmission process sequence diagram

Microgear TransmissionProcess Sequence Diagram

Presented By: Christian Daco

James Ford

Michael Layman

Huey Lee

Allan Siu



1. LPCVD 2 m layer silicon dioxide (SiO2)

SiH4 + O2 SiO2 + H2 @ Temp 400 – 500 C

Silicon Dioxide

Silicon Substrate


2. LPCVD 1m polysilicon layer.

SiH4 Si + 2H2 @ Temp = 600-650 C

Polysilicon Layer #1

Silicon Dioxide

Silicon Substrate


3. Coat photoresist.

Photoresist

Polysilicon Layer #1

Silicon Dioxide

Silicon Substrate


4. Expose and develop photoresist.

Photoresist

Polysilicon Layer #1

Silicon Dioxide

Silicon Substrate


5. Etch polysilicon layer by plasma etching in Cl2 to expose silicon dioxide layer.

Photoresist

Polysilicon Layer #1

Silicon Dioxide

Silicon Substrate


6. Strip photoresist in H2SO4/H2O2

Polysilicon Layer #1

Silicon Dioxide

Silicon Substrate


7. Wet etch SiO2 layer with HF

Polysilicon Layer #1

Silicon Dioxide

Silicon Substrate


8. Deposit sacrificial SiO2 layer conformally with tetraethylorthosilicate (TEOS)

Silicon Dioxide

Polysilicon Layer #1

Silicon Dioxide

Silicon Substrate


9. Deposit 1m polysilicon layer with LPCVD.

Polysilicon Layer #2

Silicon Dioxide

Polysilicon Layer #1

Silicon Dioxide

Silicon Substrate


10. Apply photoresist and pattern gear shape.

Photoresist

Polysilicon Layer #2

Silicon Dioxide

Polysilicon Layer #1

Silicon Dioxide

Silicon Substrate


(Zoom out view to see gear formation)

Photoresist

Polysilicon Layer #2

Silicon Dioxide

Polysilicon Layer #1

Silicon Dioxide

Silicon Substrate


11. Plasma dry etch in Cl2 to create gear shape

Photoresist

Polysilicon Layer #2

Silicon Dioxide

Polysilicon Layer #1

Silicon Dioxide

Silicon Substrate


(Zoom in) 12. Strip photoresist in H2SO4/H2O2

Polysilicon Layer #2

Silicon Dioxide

Polysilicon Layer #1

Silicon Dioxide

Silicon Substrate


13. Wet etch SiO2 layer with HF to release gear.

Polysilicon Layer #2

Silicon Dioxide

Polysilicon Layer #1

Silicon Dioxide

Silicon Substrate

Silicon Substrate


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