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Valencia Report

Valencia Report. 5 Pre-qualification (2 mechanical + 3 electrical) All inside mechanical specification in XY after assembled. However, Pre3-Pre5 bad planarity (> 115 m m).

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Valencia Report

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  1. Valencia Report • 5 Pre-qualification (2 mechanical + 3 electrical) • All inside mechanical specification in XY after assembled. However, Pre3-Pre5 bad planarity (> 115 mm). • Thermal cycling now understand (Tmax, module holding). Still some 4-8 mm variation in some parameters ( mainly in the hole). • IV all OK (before and after thermal cycling). • Bonding height and envelope measure done. • 2-4 unbonded channels per module. Have to be improved • Electrical performance: GND has been improved, noise well undercontrol, but still s-curve distortions observed (also in the Liverpool set-up). The VLN set-up is now working with 3 modules. • Valencia will start production with middle modules, then the qualification has to be done with middles. Carmen García RAL Cluster Meeting 15/7/2003

  2. Correlation spine-module bowing Pre-4 ~125 mm ~75 mm • Same effect observed in a dummy module. • More studies will be donewith new spines ~150 mm ~160 mm Carmen García RAL Cluster Meeting 15/7/2003

  3. Metrology: Liverpool-VLA crosscheck Pre-2 Valencia Liverpool Z reference plane = 227 mm Carmen García RAL Cluster Meeting 15/7/2003

  4. Metrology: Liverpool-VLA crosscheck Pre-5 Liverpool Valencia Z reference plane = 227 mm Carmen García RAL Cluster Meeting 15/7/2003

  5. Metrology: Liverpool-VLA crosscheck • Both modules show a difference on midx (Per2 & Pre5). • The fiducial on one detector corner missing, that could explain the difference on a3(Pre2). • The difference on mhx (Pre2) not understand. • Very good agreement with: • Geneva module • MPI (old middle module) Carmen García RAL Cluster Meeting 15/7/2003

  6. Envelope and bond height Point #NominalMaxPre-1 Pre-2 1001477189313421464 1031477189313481383 1109331249975951 1139331249984865 1011302175112621349 1041302175112861271 1117581057823856 1147581057864792 112758857830862 115758857840847 Edge chip F Edge chip B Out Fan-in F Out Fan-in B Cent. Fan-in B Bond Height Pre-1 Pre-2 (mm) D-Dloop high: 0.737 (0.026) 0.755(< 1above D) D-D loop low: 0.576 (0.013) 0.566 (> 0.5above D) D-F loop high: 0.376 (0.017) 0.437 (< 0.5above F) D-F loop low: 0.625 (0.11) 0.675 (> 0.5above D) C-F loop high: 0.467 (0.021) 0.480 (< 0.5above C) C-F loop low: 0.218 (0.023) 0.322 (> 0.1above C) Carmen García RAL Cluster Meeting 15/7/2003

  7. Electrical performance • The 3modules built are within specs, as far as performance is concerned • Gain ~50 mV/fC • Noise ≤ 1500 e- ENC @ T~10o C • Noise occupancy « 5x10-4 @ 1fC • GND and set-up tuning to measure the 3 modules simultaneously. • Howeverall showdistortionsin the noise occupancy s-curves at t ≤ 0.3 fC. • Not strong dependence on the GND configuration or noise level. • One module (Pre5) measured in Liverpool, same effect observed (may be reduce). • The effect is reduced when running hot. Carmen García RAL Cluster Meeting 15/7/2003

  8. Measurements @ 10ºC Pre3: Old connectors Pre4: Scratch fan-in and detector Not variation in the effect after the scratch Pre5: Measured atLiverpool Carmen García RAL Cluster Meeting 15/7/2003

  9. Measurements @ 30ºC • S-curve distortion less evident • Structure around the cooling block less pronounce Carmen García RAL Cluster Meeting 15/7/2003

  10. Preparation for Midwdle modules production • XY metrology under control. • Z survey: • Bonding program under test Set of Jigs 1 Set of Jigs 2 • Transfer back has been reworked • Transfers have been recalibrated Carmen García RAL Cluster Meeting 15/7/2003

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