Valencia report
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Valencia Report. 5 Pre-qualification (2 mechanical + 3 electrical) All inside mechanical specification in XY after assembled. However, Pre3-Pre5 bad planarity (> 115 m m).

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Valencia Report

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Valencia report

Valencia Report

  • 5 Pre-qualification (2 mechanical + 3 electrical)

    • All inside mechanical specification in XY after assembled. However, Pre3-Pre5 bad planarity (> 115 mm).

    • Thermal cycling now understand (Tmax, module holding). Still some 4-8 mm variation in some parameters ( mainly in the hole).

    • IV all OK (before and after thermal cycling).

    • Bonding height and envelope measure done.

    • 2-4 unbonded channels per module. Have to be improved

    • Electrical performance: GND has been improved, noise well undercontrol, but still s-curve distortions observed (also in the Liverpool set-up). The VLN set-up is now working with 3 modules.

  • Valencia will start production with middle modules, then the qualification has to be done with middles.

Carmen García RAL Cluster Meeting 15/7/2003


Correlation spine module bowing

Correlation spine-module bowing

Pre-4

~125 mm

~75 mm

  • Same effect observed in a dummy module.

  • More studies will be donewith new spines

~150 mm

~160 mm

Carmen García RAL Cluster Meeting 15/7/2003


Metrology liverpool vla crosscheck

Metrology: Liverpool-VLA crosscheck

Pre-2

Valencia

Liverpool

Z reference plane = 227 mm

Carmen García RAL Cluster Meeting 15/7/2003


Metrology liverpool vla c rosscheck

Metrology: Liverpool-VLA crosscheck

Pre-5

Liverpool

Valencia

Z reference plane = 227 mm

Carmen García RAL Cluster Meeting 15/7/2003


Metrology liverpool vla c rosscheck1

Metrology: Liverpool-VLA crosscheck

  • Both modules show a difference on midx (Per2 & Pre5).

  • The fiducial on one detector corner missing, that could explain the difference on a3(Pre2).

  • The difference on mhx (Pre2) not understand.

  • Very good agreement with:

  • Geneva module

  • MPI (old middle module)

Carmen García RAL Cluster Meeting 15/7/2003


Envelope and bond height

Envelope and bond height

Point #NominalMaxPre-1 Pre-2

1001477189313421464

1031477189313481383

1109331249975951

1139331249984865

1011302175112621349

1041302175112861271

1117581057823856

1147581057864792

112758857830862

115758857840847

Edge chip F

Edge chip B

Out Fan-in F

Out Fan-in B

Cent. Fan-in B

Bond Height Pre-1 Pre-2 (mm)

D-Dloop high: 0.737 (0.026) 0.755(< 1above D)

D-D loop low: 0.576 (0.013) 0.566 (> 0.5above D)

D-F loop high: 0.376 (0.017) 0.437 (< 0.5above F)

D-F loop low: 0.625 (0.11) 0.675 (> 0.5above D)

C-F loop high: 0.467 (0.021) 0.480 (< 0.5above C)

C-F loop low: 0.218 (0.023) 0.322 (> 0.1above C)

Carmen García RAL Cluster Meeting 15/7/2003


Electrical performance

Electrical performance

  • The 3modules built are within specs, as far as performance is concerned

    • Gain ~50 mV/fC

    • Noise ≤ 1500 e- ENC @ T~10o C

    • Noise occupancy « 5x10-4 @ 1fC

  • GND and set-up tuning to measure the 3 modules simultaneously.

  • Howeverall showdistortionsin the noise occupancy s-curves at t ≤ 0.3 fC.

    • Not strong dependence on the GND configuration or noise level.

    • One module (Pre5) measured in Liverpool, same effect observed (may be reduce).

    • The effect is reduced when running hot.

Carmen García RAL Cluster Meeting 15/7/2003


Measurements @ 10 c

Measurements @ 10ºC

Pre3:

Old connectors

Pre4:

Scratch fan-in and detector

Not variation in the effect after the scratch

Pre5:

Measured atLiverpool

Carmen García RAL Cluster Meeting 15/7/2003


Measurements @ 30 c

Measurements @ 30ºC

  • S-curve distortion less evident

  • Structure around the cooling block less pronounce

Carmen García RAL Cluster Meeting 15/7/2003


Preparation for mid w dle modules production

Preparation for Midwdle modules production

  • XY metrology under control.

  • Z survey:

  • Bonding program under test

Set of Jigs 1

Set of Jigs 2

  • Transfer back has been reworked

  • Transfers have been recalibrated

Carmen García RAL Cluster Meeting 15/7/2003


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