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IMIC DISCUSSION. Bob Ross Interconnectix Business Unit Mentor Graphics Corporation IBIS Summit Meeting, San Diego, CA December 7, 1998. IBIS Status Update. JEDEC/IBIS Meeting New Requirements& Needs IMIC ( I /O Interface M odel for Integrated C ircuits) IBIS Version 3.2

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imic discussion

IMIC DISCUSSION

Bob Ross

Interconnectix Business Unit

Mentor Graphics Corporation

IBIS Summit Meeting, San Diego, CA

December 7, 1998

ibis status update
IBIS Status Update
  • JEDEC/IBIS Meeting
    • New Requirements& Needs
    • IMIC (I/O Interface Model for Integrated Circuits)
  • IBIS Version 3.2
    • Delay, Expected January 15, 1998 Ratification Vote
    • BIRD57 (for Bus Hold/Active Termination Extension)
      • Consideration on December 18, 1998
      • ibischk3.2 parser change
  • DesignCon99 IBIS Summit February 1, 1999
    • Accuracy Issues, Future Features, Booth
why consider imic
Why Consider IMIC?
  • Started 1996 to Enhance IBIS Version 2.1 by EIAJ I/O Project Modeling Group
  • Targeted to Future Needs, Protect Process, Expand to New Device Architectures
  • Mixture of IBIS and SPICE
  • IBIS/EIAJ Meetings/Presentations 2/97, 6/97, 1/98, 6/98, 10/98
  • London IEC Meeting - Why IBIS & IMIC?
  • POSSIBLE SOLUTIONS TO IBIS LIMITATIONS
brief imic overview
Brief IMIC Overview
  • EIAJ Slides From Older Presentations (separate package)
    • Standard: http://tsc.eiaj.or.jp/tsc/SSC/iopg.htm
  • EIAJ Overview
    • Level 1: Signal Integrity
    • Level 2: Power Integrity
    • Level 3: Future EMI
  • Scope
    • Module (IBIS EBD)
    • IC (IBIS Component & Models)
    • Package (IBIS Package)
brief imic overview cont d
Brief IMIC Overview Cont’d
  • Missing Information for Digital Simulators
    • Model Type (must derive from other information)
    • Specs for Thresholds, Overshoots, Timing, etc.
    • Some Connection Information (explicit differential pins, ground/power relations, etc.)
  • IMIC: IBIS, SPICE & Table SPICE
    • Buffer Models - Table SPICE Construction
    • Package/Module Models SPICE & .SUBCKT Calls
    • IBIS Style Shell
    • SPICE PWL Stimulus
    • TYP, SLOW, FAST Packages, Buffers, Stimulus
ibis imic options
IBIS/IMIC Options
  • Merge
    • Complicates Well Accepted IBIS
    • Unacceptable Sacrifices in IBIS of IMIC
    • Actual Dual Support by EDA Vendors
  • Link
    • Leverage IBIS Specification & Acceptance & IMIC Package, Buffer Details
    • IBIS “Submodel” & Package Extension?
  • Be Independent
    • Translator Path: IMIC to IBIS
linkage discussions
Linkage Discussions
  • Package Model Linkage
    • IMIC Spice - Provides Format Convention
      • Supports FAST, SLOW, TYP Packages
    • Standard Spice
  • Table Spice For Buffers
    • Buffers by Construction for New Features
      • May Be Proprietary
      • May Be Complicated - Behavioral Approach in IBIS Extensions May Still Be Adequate
    • Single Complete Model by Construction & Scaling
    • Accuracy Details
discussion
Discussion
  • Study Group Participants
    • Stephen Peters, Raj Raghuram, Norio Matsui, Bob Ross
    • Others Welcome
  • Issues
    • Complexity
    • Support (IC & EDA Vendors)
    • Simulation Speed
    • Accuracy
    • Logistics
    • Incompatibilities?
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