Nanofab trainer update
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NanoFab Trainer Update. Nick Reeder, January 17, 2014. Updates to User Interface. Uploaded Andrew’s seventeen PDF-file chapters to the Tutorial page, and sent list of possible typos to Andrew. File menu now has distinct Save As… and Save options . Window’s title bar shows filename.

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NanoFab Trainer Update

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Nanofab trainer update

NanoFabTrainer Update

Nick Reeder, January 17, 2014


Updates to user interface

Updates to User Interface

  • Uploaded Andrew’s seventeen PDF-file chapters to the Tutorial page, and sent list of possible typos to Andrew.

  • File menu now has distinct Save As… and Save options.

  • Window’s title bar shows filename.

  • Buttons in dialog boxes respond to key presses as well as mouse clicks.

  • Partially implemented Jamshid’s suggestion to make graphs more easily accessible.


Updates to wet etch code

Updates to Wet Etch Code

  • Etched edges of masked SiO2 are now tapered instead of vertical.


Updates to spin coat code

Updates to Spin Coat Code

  • Fixed problem of photoresist “spikes” reported in November by Jamshid’s student Chico.


Updates to sputter luts

Updates to Sputter LUTs

  • Updated the sputter look-up tables to include the deposition rates (for Ag, Al, Al203, Cr, Cu, Ge, Ti, SiO2) that Andrew sent on March 6, 2013.

    • Still need sputter data for Au, Ni, Pt, W, Si3N4, Ta2O5, TiO2, Si.

  • In many cases, rejected some of the original numbers as outliers or because they were inconsistent with linear interpolation from other numbers.

  • See following slides.


Sputter rates ag

Sputter Rates: Ag


Sputter rates al

Sputter Rates: Al


Sputter rates al 2 o 3

Sputter Rates: Al2O3


Sputter rates cr

Sputter Rates: Cr


Sputter rates cu

Sputter Rates: Cu


Sputter rates ge

Sputter Rates: Ge


Sputter rates ti

Sputter Rates: Ti


Sputter rates sio 2

Sputter Rates: SiO2


To do list

To-Do List

  • Implement look-up tables to compute deposition rates forCVDbased on user-supplied pressure & temperature.

  • Populate evaporation look-up tables with values.

  • Populate sputter look-up tables for Au, Ni, Pt, W, Si3N4, Ta2O5, TiO2, Si.

  • Fix expose,develop, polish code to compute depth from user-supplied values.

  • Continue writing bake code; need realistic values for S0 and .

  • In expose code, implement diffraction of UV in air and absorption within resist, with dependence on solvent content from bake code.

  • Fix etch code so that (for photoresist) etch rates depend on solvent content from bake code.

  • Fix spin-coat code so that resist does not adhere to underside of horizontal surfaces.

  • Write new code for

    • Lift-off

    • Clean

    • Profilometer

  • Write time-cost-quality code for all operations.

  • Write online help text.

  • Produce videos for Videos tab.


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