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Design of Low-Power Silicon Articulated Microrobots

Design of Low-Power Silicon Articulated Microrobots. Richard Yeh & Kristofer S. J. Pister. Presented by: Shrenik Diwanji. Abstract

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Design of Low-Power Silicon Articulated Microrobots

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  1. Design of Low-Power Silicon Articulated Microrobots Richard Yeh & Kristofer S. J. Pister Presented by: Shrenik Diwanji

  2. Abstract • To design and build a class of autonomous, low power silicon articulated micro-robots fabricated on a 1 cm2 silicon die and mounted with actuators, a controller and a solar array.

  3. Designing • Primarily based on micro-machining • Pros • Feature sizes in sub micron • Mass production • Cons • Designing from scratch

  4. Basic model of the micro-robot.

  5. Actuator Design • Main backbone of the robot design • Should have high W/kg3 ratio • Different types of actuators:- • Piezoelectric • Thermal and shape-memory alloy • Electromagnetic • Electrostatic

  6. Piezoelectric actuators • Pros • Produce large force • Require low power • Cons • Require high voltage ~ 100v. • difficult to integrate with CMOS electronics

  7. Thermal and Shape-memory alloy actuators • Pros • Robust • Easy to operate • Cons • High current dissipation ( 10s of mA)

  8. Electromagnetic actuators • Pros • High Energy Density • Cons • Needs external magnet and / or high currents to generate high magnetic fields

  9. Electrostatic actuators • Pros • Low power dissipation. • Can be designed to dissipate no power while exerting a force. • High power density at micro scale. • Easy to fabricate.

  10. Electrostatic actuator design • Gap Contraction Actuator _ 1Et l v2 2 d2 Fe =

  11. Scaling Effects Actuator force Dissipative force Gravitational force Squeeze-film damping Resistance of spring support Frequency Power density

  12. Inch Worm Motors. Design of Inch Worm Motors Inch Worm Cycle

  13. Prototype design and working

  14. Power requirements • Main areas of power dissipation • CMOS controller • Actuators • Power dissipation in actuators • Weight - 0.5mN • Adhesion force - 100µN C = Total capacitance F = frequency

  15. Designing Articulated Rigid Links • Shape of the links • Flat links • Cons • Less strength due to 2 thin poly crystalline layers • HTB • Pros • Good weight bearing capacity

  16. Designing Articulated Rigid Links • Mounting of the solar array and the chip

  17. Mechanical Coupling of the legs

  18. Power Source • Solar array is used • η = 10 % ( max 26%) • Power density = 10mW/cm2 (100 mw/cm2, η = 26%)

  19. Controller • Open loop control (as no sensors) • CMOS controller • Simple finite state machine • Clock generator • Charge pump

  20. Logic behind walking of the Robot

  21. Gait speed • Gait speed = Δx/T • In one leg cycle • Δx = 100μm • T = 15 ms. • With • GCA to leg displacement factor of 1:10 • GCA gap – stop size of 2μm. • Operating frequency of 1kHz. Gait Speed = 100/15 = 7mm/s

  22. Robot assembly • Difficulty • The size of the robot • The strength needed for perfect mechanical coupling • Solution • Flip chip bonding • Allows the micro machined devices to be transferred from substrate to another.

  23. Conclusion • Key design issues • Actuation power density • Actuators used • Key tools • Micro machining

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