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Pixel Production Database STATUS P. Netchaeva - INFN Genova 13 February 2003

Pixel Production Database STATUS P. Netchaeva - INFN Genova 13 February 2003. Sensors. PDB readiness : Item tables + java application for Wafer upload (with sub-structures) + Report with links to Items exist. Test tables (-last update)

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Pixel Production Database STATUS P. Netchaeva - INFN Genova 13 February 2003

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  1. Pixel Production Database STATUSP. Netchaeva - INFN Genova13 February 2003

  2. Sensors PDB readiness: Item tables + java application for Wafer upload (with sub-structures) + Report with links to Items exist. Test tables (-last update) + java applications for upload data and download data file + Reports exist. Missing: Last update of test tables. Data: 236 wafers: 201 CiS and 35 Tesla are registered. 121 wafers are with Visual inspection test results. 44 wafers are with Planarity test results. 24 wafers are with SCR test results. 0 wafers are with Thickness test results. Tiles: 478 IV tested (of 708) 36 ITS tested

  3. Electronics PDB readiness: Item tables + java application for Wafer upload (with sub-structures) + Report with links to Items exist. FE and MCC “colours” + java applications for their upload + Reports for colour representation of these Items exist. Missing: New reticle layout will not change Item table, but will change java application for Wafer upload. Test definitions, as a consequence: Tables + java applications + Reports for tests. Data: 34 wafers with FEs and MCCs.

  4. Bare Modules • PDB readiness: • Item tables • + java application for Tile + 16 FE assembling • + Report with links: • to Items, • to Bare Module Assembly sub-Items with link to future tests, • to X-ray test data • exist. • Missing: • Test definitions, as a consequence: • Tables + java applications + Reports for tests. • Data: • 33 Bare Modules.

  5. Flex Objects PDB readiness: Item tables + java applications for Flex+components, Flex+MCC assembling + Report with links to Items exist. Test tables + java application for upload + Reports exist. Missing: Our Flex Items all are called “Prototypes”. The PDB Item structure for production Items does not exist. Data: 166 FlexLoadedPrototype Items 46 FlexMCCPrototype Items. Missing: Test data.

  6. Flex Objects: Modules • PDB readiness: • The Modules are Flex Object Items, so as for Flex Objects: • Item tables • + java applications for Flex with MCC + Bare Module assembling • + Report with links • to Items • to Module Assembly sub-Items with link to future tests • exist. • Test IV + Report exist. • Missing: • Our Module Item is called “ModuleFEIPrototype”. • The PDB structure for production Item “Module” does not exist. • Test definitions, as a consequence: • Tables + java applications + Reports for tests. • Data: • 23 ModuleFEIPrototype Items with substructures.

  7. 23 ModuleFEIPrototype Items:

  8. not registered… Mechanics + Assemblies with Modules PDB readiness: Structures are defined. => the Items and Assemblies can be registered at least manually. Local Support test tables + java applications + Reports exist. Missing: java application to register Assemblies in the easy way. To start to think about: Tests for Staves (Bi-staves) and Sectors with Modules on them. Data: 200 Omegas are registered. 11 TMT-left are registered with CC test results. Missing (of existing Items): Al tubes, TMT-right, Sector parts. First Module is mounted on Sector: We need to accelerate…

  9. Shipments • PDB readiness: • java applications for: • send and receive Wafer (sensor or electronics) • send just received Items without change • receive an Assembly with the following update • of all components location • + Report with links to Shipments • exist. • Shipment statistics Report • (Items shipped/time) exist. • The activity of the manufacturers • seems to be well covered • by persons in charge. • Missing: • Send Electronics Wafer with • new reticle layout. Data

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