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SGI ® Rackable ® Servers

SGI ® Rackable ® Servers. First Last Title. Speed and Scale. Finding Answers™. Astronomical. Human Scale. Atomic to Cellular. Subatomic. 0. ∞. 10 16. 10 18. 10 -15. 10 -6. 10 6. 10 24. Lightyear. Exascale. Femtometer. Yottascale. Our Strategy and Focus.

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SGI ® Rackable ® Servers

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  1. SGI®Rackable®Servers First Last Title

  2. Speed and Scale Finding Answers™ Astronomical Human Scale Atomic to Cellular Subatomic 0 ∞ 1016 1018 10-15 10-6 106 1024 Lightyear Exascale Femtometer Yottascale

  3. Our Strategy and Focus High Performance Computing Business Applications Business Computing HPC Redundancy Speed & Scale

  4. Our Strategy and Focus High Performance Computing Business Applications Big Data Business Computing HPC Redundancy Speed & Scale

  5. Agenda Rackable® Value Proposition Half-Depth Servers Standard-Depth Servers

  6. Customer Problems Getting the right configuration for a cluster for specific applications is difficult Setting up a cluster can take a lot of time and is prone to error Managing clusters can be very difficult Expanding clusters can lead to disappointing performance and management challenges

  7. HPC Commercial Scientific Modeling & Simulation SGI® Servers for Speed and Scale Big Data Hadoop In-memory Analytics Archive Cloud PublicPrivateGovernment SGI® ICE™ X Rackable® SGI® UV™ 2000 Rackable® CloudRack™ C2

  8. Rackable® Clusters Value Proposition Best of breed components, tested and integrated by SGI® Engineering Complete software stack including SGI Management Center and SGI Performance Suite Integrated, stood-up and tested in SGI factory • Not on your floor • Not in some 3rd party’s facility Supported Worldwide by SGI

  9. Fully Integrated in SGI® Factory • Comprehensive factory integration simplifies on-site deployment and management • Entirely built on industry-standard hardware and software components, enabling access to the full spectrum of the Linux ecosystem • Full integration with the SGI Performance Suite, which optimizes the performance of applications running on standard Linux, and with the SGI Management Suite, which enables ease of administration, including dynamic power and GPU monitoring and management

  10. Fully Integrated in SGI® Factory(2) Complete Factory Integration - SGI Rackable® Cluster: • Nodes labeled per customer requirements • Delivered fully cabled to switches • Cables labeled per customer requirements • Servers mounted in rack, if ordered • Static IP address range applied • Fully integrated and tested software on head node • Provisioned compute nodes per customer requirements • GigE and IB fabric tested using MPI

  11. Fully Integrated in SGI®Factory (3) SGI Linux HPC Stack • SGI delivers tightly integrated solutions based on Linux® • For HPC clusters, SGI provides a complete Linux technical computing stack • For virtualized environments, SGI offers VMware certified platforms, supports Red Hat RHEL with KVM, and Microsoft Hyper-V • Full system management and monitoring for both data center and HPC environments with SGI Management Center Linux Operating Systems: Novell SLES 10 & 11; Red Hat RHEL 5 & 6, CentOS 5 & 6* * Shipping when available

  12. Ultimate System RAS and Management Capability • Hundreds of thousands of SGI Rackable®servers in production powering the world’s largest internet and technical computing environments • Robust reliability and availability features at both the application architecture level and at the server level • World class professional consulting, installation and support services.

  13. High Density Both Rackable®half-depth and standard-depth servers can be deployed at leading core densities: • C1001 half-depth server: 2,944 cores/46U cabinet in 92 servers mounted back to back • C2112 standard-depth server: 2,688 cores/42U cabinet in 21 quad-node servers (84 nodes) Rackable servers also deliver a high local storage density, a central requirement for many applications Practical density is key as most data centers are power limited. A key SGI strength is designing at the cabinet level, optimizing power and thermals for the real life data center environment

  14. Eco-Logical™ Benefits SGI servers can cut 10-150+W of power vs. competitive designs Power savings delivered by • Optimizing component choices • CPU, memory, hard drives • Delivering superior thermal designs that cut cooling fan power • Maximizing AC and DC power supply efficiency and right-sizing power supplies to server configurations

  15. SGI Global Services – Worldwide Reach Our Global Presence • 500 Services Professionals in 50 Countries • Global Customer Service Center Infrastructure • Global Logistics Infrastructure with over 60 Spare Parts Depots United Kingdom Reading Japan Tokyo Atlanta United States Our Customer Experience Australia Sydney • Same Day Support in 150 Major Metro Areas in over 20 Countries • Customized Support Available 7x24 via E-mail, Telephone or Web • Support in Multiple Languages

  16. Rackable® Form Factors All Rackableservers are 19” rack mount compatible Standard-Depth Servers • Mount in all standard racks (rail-based) • Ideal for heterogeneous deployments, including use as HPC management nodes with SGI ICE or UV systems • Not all available motherboard options fit within a half-depth footprint (e.g. many 4S options) • Multi-node solutions such as C2112 server (four nodes in 2U) available for high density deployments • Rear-facing ports ideal for compatibility (e.g. attaching to external storage systems) Half-Depth Servers • Mount back-to-back in Rackable™ cabinets for double density or in 2-post racks • Ideal for homogeneous deployments implemented at cabinet or row level • Choose either flow-through or hot-aisle containment configurations • 15.5” deep form factor ideal for thermals and reducing fan power • Front-facing ports and rail-less design increase serviceability • Best of blade features, without lock-in to a handful of motherboard designs!

  17. Rackable® Standard-Depth Servers C1103/C1104G Features • 1U dual-socket server • Ideal for GPU Computing • 3 x 3.5” or 4 x 2.5” hot-swap drives • Two or three GPUs (C1103 also available with up to 4 x PCIE x8) Key Models • C1103-TY12: Intel Xeon 5600 • C1104G-RP5: Intel Xeon E5-2600 C1110 Features • 1U dual-socket server • 4x 3.5” or 10 x 2.5” hot-swap drives • Two PCIe Gen 3 x16 slots • Redundant Power Supply (RPS) Key Models • C1110-RP6: Intel Xeon E5-2600 • C1110-RN3: Intel Xeon E5-2400

  18. Rackable® Standard-Depth Servers C2108 Features • 2U dual-socket server • Ideal HPC management/head node • Up to 8 x 3.5” hot-swap drives • Up to five expansion slots • 1+1 Redundant AC Power Supplies Key Models • C2108-RP2: Intel Xeon E5-2600 • C2108-G9: AMD Opteron 62/300 C2112 • Features • 2U quad-node dual-socket server • Ideal for HPC cluster nodes • Up to 12 x 3.5” hot-swap drives (3/node) • Four low-profile expansion slots (1/node) • Optional QSFP QDR/FDR InfiniBandport/node • 1+1 Redundant AC Power Supplies • Key Models • C2112-4RP4: Intel Xeon E5-2600 • C2112-4G10: AMD Opteron 62/300

  19. Rackable® Standard-Depth Servers H2106 • Features • 2U quad-socket server • Ideal HPC management/head node • Up to 6 x 3.5” hot-swap drives • 32 DIMM slots for up to 1024GB memory using 32GB DIMMs • Four low-profile expansion slots • 1+1 Redundant AC Power Supplies • Key Model • H2106-G7: AMD Opteron 62/300 C2110G • Features • 2U quad-socket server • Ideal high GPU/socket density node • Up to 10 x 2.5” hot-swap drives • 8 DIMM slots • Up to four GPUs • Two AC Power Supplies • Key Model • C2110G-RP5: Intel Xeon E5-2600

  20. Rackable® Half-Depth Advantage Flexibility Density Choice of 22U, 36U, 40U, 44U racks & full range of AMD/Intel server models Half-depth server design mounted back-to-back for 2x density Thermal Management & Power Distribution Unobstructed central air plenum for superior ventilation DC Power option provides power savings of up to 30% Passive cooling design for highest reliability Serviceability I/O in front and clean cabling reduces maintenance time by up to 75% IPMI remote management

  21. Two Airflow Options Hot aisle/cold aisle Typical data center footprint Chimney Front to Back Airflow • In-cabinet hot aisle containment • Easily duct hot air out • Optimal cooling

  22. Rackable® Half-Depth Server Cabinets • 26” wide, 40” deep • Can support both half-depth back-to-back andstandard-depth front-to-back deployments • 26” width cabinet cable troughs sufficient forlarge cable bundles including InfiniBandinterconnect cabling • Heights offered: 22U, 36U,40U, 44U • 24” wide • 24” width cabinet better aligned with standard 24 x 24” data center floor tiles • Heights offered: 36U, 42U and 46U • Can support both half-depth back-to-back andstandard-depth front-to-back deployments

  23. Rackable® Half-Depth Rack-level DC Power Delivery AC-to-DC rectification within the rack for superior combination of reliability and efficiency • AC power supplies replaced with 96.5% efficient DC power supply with 2 million hours MTBF • Rectifiers convert AC input to DC power for 10%-30% power savings • Now available in 1U model • DC distribution bars inside cabinet deliver N+M redundant DC power to individual servers • Easily deployed in any existing AC data center (no infrastructure upgrades needed) • Allows rack-level UPS at significant cost savings over individual chassis RPS

  24. Rackable® Half-Depth Servers C1001 Features • Blade level density (2,208 cores/46U rack) • 1 x 3.5” / 2 x 2.5” hot-swap drives • 6 Gb SAS • Single expansion slot • AC or DC power Key Models • C1001-TY8: Intel Xeon 5600 • C1001-RP6: Intel Xeon E5-2600 • C1001-C1: AMD Opteron 4200 • C1001-G13: AMD Opteron 62/300 C2005 • Features • Industry-leading thermals • Up to 5 x 3.5” / 10 x 2.5” hot-swap drives • 6 Gb SAS • Up to five expansion slots • AC, DC, or AC RPS power • Key Models • C2005-TY6: Intel Xeon 5600 • C2005-RP1: Intel Xeon E5-2600 • C2005-RN1: Intel Xeon E5-2400 • C2005-C3: AMD Opteron 4200 • C2005-G11: AMD Opteron 62/300

  25. Rackable® Half-Depth Server: C2005 • Four top drive tray / expansion slot configurations: 8 x 2.5” tray 5 low-profile slots (2-6) 4 x 3.5” tray 1 slot on riser 4 x 2.5” + 2 x 3.5” tray 1 slot on riser 2 x 3.5” tray 5 low-profile slots (2-6) • Plus additional lower-left bay capabilities: • Internal 3.5” drive and/or DVD-ROM & AC or DC power supply • Hot-Swap 3.5” drive or pair 2.5” drives & AC or DC power supply • Redundant AC power supply

  26. Rackable® Half-Depth Servers • C30xx • Features • High local storage density (720TB and 360 cores/46U cabinet) • Storage and/or I/O focused models • Key Models • ISS3012-TY15: Intel Xeon 5600 • ISS3009-TY15: Intel Xeon 5600 • ISS3012-RP1: Intel Xeon E5-2600 • ISS3009-RP1: Intel Xeon E5-2600 H4002 • Features • Specialized applications • Quad-socket models • Overclocking options • Key Models • H4002-G6: AMD Opteron 6200

  27. Summary Rackable™ servers are industry-leading in their configurability and flexibility Designed from the data center down, Rackable™ servers are well suited for both homogeneous and heterogeneous scale-out environments Fully Integrated for Easy Deployment Optimized for RAS and ease of management

  28. SGI®Rackable® Servers QUESTIONS?

  29. Rackable® Servers Backup Slides

  30. Rackable® Server Model Grid

  31. Rackable® Standard Depth: Single Node *** not available at launch

  32. Rackable® Standard Depth: Single Node (Cont’d)

  33. Rackable® Standard Depth: Multi-Node * Not at launch

  34. Rackable® Half-Depth: C1001

  35. Rackable® Half-Depth: C2005

  36. Rackable® ServerMotherboards

  37. SGI Board Form Factors SGI leverages three principal form factors to achieve best-in-class designs that are thermally superior: • EATX form factor • Offset CPU/memory • Ideal for 2U+ Rackable + CloudRack • EATX form factor • Rear CPU/memory • Ideal for 1U-2U Rackable + CloudRack • “Twin” form factor • Ideal for Rackablestd-depth + CloudRack

  38. Intel Romley Platform (SandyBridge EP and EN)

  39. RP1 (Intel® S2600CP “Canoe Pass”) • Processor • (2) Intel® Xeon® E5-2600 (Romley EP) 130W 8 core CPUs • Chipset • Intel® C600 series PCH (Patsburg-A/-D) • Memory • (4) memory channels per CPU • (8+8) U/LR/RDDR3 1.5V, 1.35V DIMMs • PCI Expansion Slots • (6) PCI-E G3 x8 slots • Network • (4) GbE ports (Intel® I350-AM) • Storage • (2) SATA-III ports • (4) SATA-II ports RAID 0/1/10/5 support • (8) SATA/SAS from SCU 3Gb ports RAID 0/1/10 support • (w/upgrade key) • VGA & IPMI 2.0 • Server Engines Pilot III iBMC w/iKVM • Shared management port (dedicated via add-on module) • Form Factor • SSI EEB (12” x 13”) • Target Applications • Search engine • Hadoop / storage server • Workstation

  40. RP6 (Tyan®S7056) • Processor • (2) Intel® Xeon® E5-2600 (Romley EP) 150W 8 core CPUs • Chipset • Intel® C600 series PCH (Patsburg-A/-D) • Memory • (4) memory channels per CPU • (8+8) U/LR/RDDR3 1.5V, 1.35V DIMMs • PCI Expansion Slots • (2) PCI-E G3 x16 slots • (2) PCI-E G3 x4 slots • Network • (3) GbE port • Storage • (2) SATA-III ports • (4) SATA-II ports RAID 0/1/10/5 support • (8) SATA/SAS from SCU 3Gb ports RAID 0/1/10 support] • VGA & IPMI 2.0 • ASPEED AST2300 iBMC w/iKVM • Shared management port • Form Factor • EATX (12” x 13”) • Target Applications • CPU-centric HPC • Search engine • Virtual machine

  41. RP2 (Intel® S2600GZ4/GL4 “Grizzly Pass”) • Processor • (2) Intel® Xeon® E5-2600 (Romley EP) 130W 8 core CPUs • Chipset • Intel® C600 series PCH (Patsburg-A w/option keys) • Memory • (4) memory channels per CPU • S2600GL4 – (8+8) U/LR/RDDR3 1.5V, 1.35V DIMMs • S2600GL4 – (12+12) U/LR/RDDR3 1.5V, 1.35V DIMMs • PCI Expansion Slots • (6) PCI-E G3 x8 slots (riser) • Network • (4) GbE port (Intel® Powerville-17) • Storage • (2) SATA-III ports • (4) SATA-II ports RAID 0/1/10/5 support • (8) SATA/SAS 3Gb ports RAID 0/1/10 support (module) • VGA & IPMI 2.0 • Server Engines Pilot III iBMC w/iKVM • Shared management port (dedicated via add-on module) • Form Factor • 16.5” x 16.5” • Target Applications • “Summit” RFP • 2U storage server

  42. RP4 (Intel® S2600WP “Washington Pass”) • Processor • (2) Intel® Xeon® E5-2600 (Romley EP) 135W 8 core CPUs • Chipset • Intel® C600 series PCH (Patsburg-A/-B) • Memory • (4) memory channels per CPU • (8+8) U/LR/RDDR3 1.5V, 1.35V DIMMs • PCI Expansion Slots • (4) PCI-E G3 x16 slots • Network • (1) IB QDR (CX3) WPQ SKU • (1) IB FDR (CX3) Q2 2012*** • (2) GbE ports (Intel® Powerville) • Storage • (2) SATA-III ports (one via SATA DOM) • (4) SATA-II ports RAID 0/1/10/5 support (via module) • VGA & IPMI 2.0 • Server Engines Pilot III iBMC w/iKVM • Shared management port (dedicated via add-on module) • Form Factor • SFF (6.8” x 18.9”) • ***not available at launch • Target Applications • GPU or CPU-centric HPC • Application gateway • Virtual machine • Search engine

  43. RP5 (SuperMicro®X9DRG-HF) • Processor • (2) Intel® Xeon® E5-2600 (Romley EP) 135W 8 core CPUs • Chipset • Intel® C600 series PCH (Patsburg-A) • Memory • (4) memory channels per CPU • (4+4) U/LR/RDDR3 1.5V, 1.35V DIMMs • PCI Expansion Slots • (4) PCI-E G3 x16 slots • (1) PCI-E G3 x8 slot • Network • (2) GbE ports (Intel® I350) • Storage • (2) SATA-III ports • (4) SATA-II ports RAID 0/1/10/5 support • VGA & IPMI 2.0 • Server Engines Pilot III iBMC w/iKVM (w/key) • Shared management port • Form Factor • SFF (7.71” x 16.64”) • Target Applications • GPU-centric HPC • Storage server • Application gateway • Search engine

  44. RN1(Intel® S2400GP “Granite Pass”) • Processor • (2) Intel® Xeon® E5-2400 (Sandy Bridge-EN)95W • Chipset • Intel® C600 series PCH (Patsburg-A/D/T) • Memory • (3) memory channels per CPU • (6+6) U/LR/RDDR3 1.5V, 1.35V DIMMs • PCI Expansion Slots • (2) PCI-E G3 x16 slot • (1) PCI-E G3 x8 slot • (1) PCI-E G3 x8 slot x4 electrical • (1) PCI-E G2 x8 slot x4 electrical • (1) PCI 32bit/33MHz slot • Network • (2/4) GbE ports (Intel® I350-AM) • Storage • (2) SATA-III ports • (4) SATA-II ports RAID 0/1/10/5 support • (8) SATA/SAS from SCU 3Gb ports RAID 0/1/10 support • (w/upgrade key) • VGA & IPMI 2.0 • Server Engines Pilot III iBMC w/iKVM • Shared management port (dedicated via add-on module) • Form Factor • SSI EEB (12” x 13”) • Target Applications • Search engine • Hadoop / storage server • Workstation

  45. AMD Socket G (MagnyCours)

  46. G11 • Form Factor: EATX • Chipset: AMD SR5690 + SP5100 • CPU: 2 x AMD Opteron 6200 • Memory: 16 x DDR3 DIMM (Max. 1600MHz) • Expansion Slots: • One PCI-E 2.0 x16 or two PCI-E 2.0 x8 (auto-selected), one PCI-E 2.0 x8, one PCI-E 2.0 x4 • Networking: Two GigE (Two Intel 82574L) • Management: IPMI 2.0 + KVM • Options: Onboard SAS motherboard SKU available • Manufacturer model: AsusKGPE-D16

  47. G13 • Form Factor: EATX • Chipset: AMD SR5690 + SP5100 • CPU: 2 x AMD Opteron 6200 • Memory: 16 x DDR3 DIMM (Max. 1600MHz) • Expansion Slots: • One PCI-E 2.0 x16 • Networking: Three GigE (Intel 82576EB + Intel 82574L) • Management: IPMI 2.0 + KVM • Options: Onboard SAS motherboard SKU available • Manufacturer model: TyanS8236IL

  48. C1 • Form Factor: EATX • Chipset: AMD SR5690 + SP5100 • CPU: 2 x AMD Opteron 4200 • Memory: 12 x DDR3 DIMM (Max. 1600MHz) • Expansion Slots: • One PCI-E 2.0 x16 • Networking: Three GigE (Intel 82576EB + Intel 82574L) • Management: IPMI 2.0 + KVM • Options: Onboard SAS motherboard SKU available • Manufacturer model: Tyan S8226

  49. C3 • Form Factor: EATX • Chipset: AMD SR5690 + SP5100 • CPU: 2 x AMD Opteron 4200 • Memory: 12 x DDR3 DIMM (Max. 1600MHz) • Expansion Slots: • Two PCIE-E 2.0 x 16, one PCI-E 2.0 x8, one PCI-E 2.0 x4 and one PCI-33 • Networking: Four GigE (Intel 82576EB +2 x Intel 82574L) • Management: IPMI 2.0 + KVM • Options: Onboard SAS motherboard SKU available • Manufacturer model: Tyan S8225

  50. Intel Tylersburg Platform (Westmere EP)

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