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SV and CP Pkg CTE

SV and CP Pkg CTE. TQFP_EP (SV). Mold Compound. Silicon. Leadframe. LFCSP, QFN (CP). Mold Compound. Silicon. Leadframe. Mold Compound Sumitomo G700 CTE: α 1 ≤ 8, α 2 ≤ 38 ppm/C Tg = 130 ⁰ C. Die: Silicon CTE: 3 ppm/C Thickness: 10 mils. Leadframe: Copper CTE : 17 ppm/C

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SV and CP Pkg CTE

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  1. SV and CP Pkg CTE TQFP_EP (SV) Mold Compound Silicon Leadframe LFCSP, QFN (CP) Mold Compound Silicon Leadframe Mold Compound Sumitomo G700 CTE: α1 ≤ 8, α2 ≤ 38 ppm/C Tg = 130 ⁰C Die: Silicon CTE: 3 ppm/C Thickness: 10 mils Leadframe: Copper CTE: 17 ppm/C Thickness: 8 mils

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