2003 itrs factory integration update mani janakiram intel
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2003 ITRS Factory Integration Update Mani Janakiram, Intel PowerPoint PPT Presentation


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2003 ITRS Factory Integration Update Mani Janakiram, Intel. Agenda Scope and Global Landscape Difficult Challenges Manufacturing Strategy Evolution Technology Requirements Attributes of a 90nm -> 45nm Factory Some Integrated Potential Solutions:

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2003 ITRS Factory Integration Update Mani Janakiram, Intel

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2003 itrs factory integration update mani janakiram intel

2003 ITRS Factory Integration UpdateMani Janakiram, Intel

  • Agenda

  • Scope and Global Landscape

  • Difficult Challenges

  • Manufacturing Strategy Evolution

  • Technology Requirements

  • Attributes of a 90nm -> 45nm Factory

  • Some Integrated Potential Solutions:

    • Direct Transport, Process Control, Engineering Chain

  • Industry Research Needed

  • Key Messages


2003 itrs factory integration update mani janakiram intel

Factory Integration Scope and Drivers

UI

Factory

Operations

Production

Equipment

Factory Information

& Control Systems

Facilities

AMHS

Si Substrate

Mfg

Chip

Mfg

Wafer

Mfg

Product

Mfg

Distribution

Reticle

Mfg

  • FEOL

  • BEOL

  • Probe/Test

  • Singulation

  • Packaging

  • Test

Increasing cost &

Cycle time implications

  • Factory is driven by Cost, Productivity, and Speed:

  • Reduce factory capital and operating costs per function

  • Faster delivery of new and volume products to the end customer

  • Efficient high volume production, high reliability, & high equipment reuse

  • Enable rapid process technology shrinks and wafer size changes


Excellent participation from suppliers ic makers universities and research institutes

Excellent Participation from Suppliers, IC Makers, Universities, and Research Institutes

Over 100 Global Participants in 2004


What does a leading edge 300mm fab look like today

APC, Yield, and E-Manufacturing Capabilities (EEC)

R2R

FDC

SPC

Recipes

Data

Yield

PCS

E-Diag

EPT

What Does a Leading Edge 300mm Fab Look Like Today?

High product mix operations enabled using automation

100% AMHS Storage and Intrabay Transport Systems in place

Aggressive focus on lot cycle time reduction

Pervasive use of Standards for carriers, equipment interfaces, and software systems

FOUP carrier tracking using ID tags at load ports

Some Wafer Level Tracking &

Recipe/Parameter Changes

Very high use of APC and Yield systems

Factory Scheduler

And Material Control

Systems Scaled for > 30k wspm

Equipment

Control Systems

Manufacturing

Execution Systems

Most equipment data feed through SECS/GEM communications

All lots and wafers tracked and processed using the MES

Equipment Performance Tracking (EPT) Data

Partner, Customer

Or Supplier

Some use of

E-Diagnostics


Manufacturing strategy evolution

Manufacturing Strategy Evolution

Speed and environment center-minded

Throughput

center-minded

Specific Tech. Level

TR (Eq., AMHS, FICS)

Effort

Effort

Specific Tech.

Potential Solution

(Eq., AMHS, FICS)

Factory Operation

Requirement

Enterprise Level

Requirement

Current values

Next generation Values

Wider coverage needed


Search for new metrics

Search for New Metrics

  • Carrier Delivery Time

Facility

ECM

Equipment

Control

Technical

Element

Level

  • AMHS T/F Design

  • AMHS MTTR & MCBF

AMHS

SCM

FICS

  • Eq. Availability & Utilization

Eq. Process

Speed

Production

Flexibility

  • X Factor

Factory

Operation

Level

  • NPW Activity

  • NPW-Start Usage

Development

Speed

ES & H

NPW

Control

  • Productivity

  • Lot Cycle Time

  • Productivity and flexibility measure for high mix

Production Methodology and Constraints

  • Consumables and cost reduction

Enterprise

Level

Line capability strategy

  • Floor Space Effectiveness

  • Energy saving

Product Development


Future process control system capabilities

Future Process Control System Capabilities

Manufacturing Execution System (MES)

Operations

Data

WIP

Tool Control

Dispatch

MCS

SECS/GEM Control Line

Integrated APC/Yield Data & Systems

Equipment Data Acquisition (EDA) Standards Line

Equipment &

Process Data

Run

To

Run

FDC

SPC

Yield

PCS

Today

100 variables @ 3 Hz each

= 300 values per sec

Future EDA Goal

500 variables @10 Hz each

= 10,000 values per sec

  • Equipment Capabilities

  • Standardized data and connectivity

  • Fast sensor sampling & data transfer rates

  • Host ability to stop processing as needed

  • Graceful recovery when a fault occurs

  • Ability to change parameters and values between wafers

  • Wafer tracking all points within the tool

  • Automation Capabilities

  • Data Sharable between APC applications

  • High data transfer rates

  • Single point configurations

  • Integrated yield, process control, and operational systems

  • Rapid application development (run to run algorithms, etc.)


New products need faster customer delivery

Part of Supply Chain

Part of Supply Chain

Not Engineering or Supply Chain

Legend

New Products Need Faster Customer Delivery

  • Challenge: Customers want new products delivered much faster

  • Key Concept: The Engineering Chain integrates rapid data exchange from design to new chip delivery to the customer to ensure customer cycle times are met

    • Engineering Chain = Design  Reticle  Integration  Customer  HVM

    • Different from supply chain management which focuses on volume production

Data Transfer

Planning and parallel activities to deliver

Process Development

Product

Design

Mask

Fabrication

Packaging

and Test

Customer

Evaluation

Wafer Fab

Data

Transfer

Data

Transfer

This is a Supply Chain Task

Data

Transfer

Volume

Run

Design Fix

Design Improvement


Key messages

Key Messages

  • Business strategies, market demands, and process technology changes continue to make factories difficult to integrate

  • Economic and business challenges areequal to our manufacturing and process technology challenges

  • Gaps in Production Equipment OEE, Factory NPW usage, and Factory modeling still must be improved

  • Factory’s speed and flexibility are gaining more attention to accommodate various production methodology

  • Intense investigation of enterprise and FO level requirements to meet newer production methodology is required In addition to the current requirement

  • More industry alignment and standard development are to be continued


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