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RockHydro. Northwest Nazarene University Advisor: Dr. Lawrence Chad Larson Ben Gordon Seth Leija David Vinson Zach Thomas Drew Johnson. Critical Design Review. Table of Contents. Section 1: Mission Overview Purpose Goals Theory Success Benefits Expected Results
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RockHydro Northwest Nazarene University Advisor: Dr. Lawrence Chad Larson Ben Gordon Seth Leija David Vinson Zach Thomas Drew Johnson Critical Design Review
Table of Contents • Section 1: Mission Overview • Purpose • Goals • Theory • Success • Benefits • Expected Results • Organizational Chart • Section 2: Design Description • Design Process • Design Requirements • User Guide Compliance • System Overview • Design View • Superhydrophobic • Flexible Chips • Radiation Hardened Chips • Pseudo code • Block Diagram
Table of Contents • Section 3: Prototyping/Analysis • Section 4: Manufacturing Plan • Section 5: Testing Plan • Section 6: Risks • Section 7: Project management plan • Section 8: Conclusions
Mission Overview: Purpose • Study the feasibility of using Superhydrophobic materials in the presence of high acceleration and vibrations for possible use on space missions. • Test Radiation Hardened chips and new FleX chips with American Semiconductors Inc.
Mission Overview: Goals • Do research on superhydrophic material that would allow it to be used in future space missions. • Gather data on Radiation hardened chips and to gain experience working with the microchip industry.
Mission Overview: Theory When water is in contact with the superhydrophobic surface (diatomaceous earth) it is more attracted to its own surface tension than it is to the material. This is because the material works like a microscopic bed of nails. Diatomaceous earth is a new material developed by John Simpson at Oakridge National Laboratory and is exceptional due to its high contact angle with water and low price.
Mission Overview: Success • For this mission to be considered a success, the SH material needs to be recovered and tested post-flight. It would be best if the Superhydrophobic material survived the flight. • Get usable data from the radiation hardened chips
Mission Overview: Benefits • The goal of this launch is to prove that this diatomaceous earth can survive a rocket launch and still be functional post-flight. • This material could have many different benefits if it is shown to survive space travel. The SH material has already been shown to work in microgravity by NNU and NASA’s SEED. NASA would benefit from the data gathered if they decide to use this material on future missions.
Mission Overview: Expected Results It is hypothesized that the material will survive the high acceleration and vibrations and still be functional in post-flight testing.
Expected Results • It is expected that the radiation hardened chips will make less errors in the flight compared to the non-hardened chips.
Team Organization Advisor Dr. Dan Lawrence Advisor Dr. Parke American Semiconductors Dale Wilson Superhydrophobic Electrical David Vinson Seth Leija Drew Johnson Mechanical Ben Gordon Chad Larson Zach Thomas
Design Process • Design Superhydrophobic Encasement • Design American Semiconductor Board/ Final Design of Plate. • Build encasement/Build American Semiconductor board. • Implement into Plate • Test board • Run full flight test
Design Requirements • Physical Envelope Cylindrical: • Diameter: 9.3 inches • Height: 4.75 inches • Mass Canister + Payload = 20±0.2 lbf • Center of Gravity Lies within a 1x1x1 inch envelope of the RockSatpayload canister‘s geometric centroid.
System Overview • A Superhydrophobic “donut” will be on one plate • The electrical systems will be on another plate above the original plate.
Design View Geiger Counter Board Arduino Board Flexible Chips Superhydrophobic “donut”
Superhydrophobic • A donut shaped hollow object will house Superhydrophobic material. This shape allows for different forces on different axis. • This will be on the lower plate and will be placed around the center support. “Donut”
Flexible Chips New flexible chips from American Semiconductors will now be integrated in with the Arduino subsystem
Radiation Hardened Chips • American Semiconductors will work with students to design a board which will test their radiation hardened chips Arduino/American Semiconductor Board & Geiger Counter
Pseudo code for Arduino loadTestVectors(); runTestVectorsThroughASChips(); readSensorData(); writeSensorDataToSDCard(); saveTestToSDCard(); CompareResultsWithExpected(); If Error { writeErrorToSDCard(); } Our system will be activated by a G-Switch. When turned on, the Arduino will load test vectors from the attached SD card. Additional sensor data from previous RockON boards will also be written to the SD card. The test vectors will be run through different portions ASC’s chip and the results will be compared to the expected results. The raw data as well as the errors will both be written onto the SD card.
Electrical Design Elements • Using 1 PCB • Geiger board will record radiation • Arduino board will test the radiation hardened chips and flex chips for error count • Arduino will also have flash memory • Activating with G-switch • There is software out there for Arduinothat will be used
Block Diagram Power Data G-Switch Power Supply Clock Arduino Voltage Regulator Clock ASC Chip (Unpackaged) Microcontroller SD Card ASC Chip (Packaged)
Prototyping Plan • Since the CDR, the superhydrophobicenclosure has been designed and is currently being prototyped on our dimension sst 1200es 3D printer. The materials have been collected from American Semiconductors and are in the process of being tested so they will function properly throughout the launch and flight.
Detailed Mass Budget • The mass is scheduled to be found more thoroughly once the parts are procured • Ballast will be needed
Power Budget • Arduino board: 7 V with each I/O pin running on 40 mA. • Flexchips: 1.2 V, low but unknown amperage. • Geiger Counter: 9V, same as RockOn. • All parts will be turned on at the start of the flight.
Mechanical Elements • SH “Donut” needs to be manufactured Mechanical Subsystem Complete Fabrication Fix errors in design Print Prototype Begin Testing Nov 30 Jan 25 Jan 18 Jan 11
Electrical and Software Elements Electrical Subsystem Board assembled Board design complete Electronic Parts arrive Testing Begins Dec 12 Feb 10 Jan 23 Feb 13 This schedule was made with help from American Semiconductor Inc.
Electrical Elements • PCB Needs to be prototyped and manufactured • We suspect that there may be up to 5 small revisions made on the electronics. • The Arduino board, socket, SD card, and PCB still need to be obtained.
Mechanical Testing • Need to figure out how much water there needs to be to be useful in the “Donut” • Test for any leakage • To test for leakage the amount of vibration resistance needs to be found • A passed test will be zero leakage • Test the contact angle of the superhydrophobic surface.
Electrical and Software Testing • The chips will be tested to make sure they produce the correct outputs before entering an area with radiation to see how much the radiation affects functionality. • Data will be taken at 1MHz • The electrical system will pass once it is shown to be able to gather data for a whole flight test. Correct voltages will be measured.
Software • Most of the code still needs to be written. We are waiting for all the parts to arrive and then will write the code with American Semiconductor’s help. American Semiconductors has a testing code that will hopefully be modified to complete our necessary actions.
Previous Risk Factors Risk 1: SH enclosure breaks Risk 2: G-switch fails to start data collection Risk 3:Malfunction of electrical board. 1: The SH enclosure will be double layered and extensively tested. 2: Will just have to be accepted. 3: The board will be tested to be in perfect working order multiple times prior to launch.
Risk Factors Risk 1: Leads on Flex chip fall off. Risk 2: G-switch fails to start data collection Risk 3: wires on packaged chip break due to G’s during launch
Conclusion • With the “donut” being manufactured the main focus will be on the electrical system. We have established weekly meetings with American Semiconductors to stay on schedule. • Questions?
