'Mixed signal' presentation slideshows

Various SoC-Related Applications, Business Models, Global Industries & CareerLife Planning

Various SoC-Related Applications, Business Models, Global Industries & CareerLife Planning. Four Major Technology Drivers. RF and AMS SoC MPU (Embedded) Memory. RF and AMS (Analog/Mixed Signal). Application Spectrum of Various Competing RF Technologies.

837 views • 72 slides

Korean Brain Neuroinformatics Research Program and Artificial Auditory Systems

Korean Brain Neuroinformatics Research Program and Artificial Auditory Systems. Soo-Young Lee Brain Science Research Center Department of BioSystems Korea Advanced Institute of Science and Technology http:// bsrc.kaist.ac.kr. Korean Brain Neuroinformatics Research Program

756 views • 61 slides

673 views • 55 slides

System-on-a-Chip (SoC)

System-on-a-Chip (SoC). Lecture 6. SoC. ( S ystem O n a C hip) The electronics for a complete, working product contained on a single chip Complex functionalities that previously required heterogeneous components to be connected on a PCB, are integrated within one single silicon chip.

3.4k views • 54 slides

System on Chip (SOC)

System on Chip (SOC). SOC. SOC consists of at least two or more complex micro-electronic macro components previously integrated into different single dies

823 views • 45 slides

ITRS-2001 Design ITWG Andrew B. Kahng, Chair November 29, 2001

ITRS-2001 Design ITWG Andrew B. Kahng, Chair November 29, 2001. Design ITWG Contributions to ITRS-2001. New System Drivers Chapter MPU SOC (Low-Power, High-Performance, Mixed-Technology) Mixed-Signal Design Chapter ORTC support Frequency Power Density

768 views • 43 slides

Design ITWG ITRS Conference, San Francisco July 16, 2003 San Francisco Europe: Ralf Brederlow

Design ITWG ITRS Conference, San Francisco July 16, 2003 San Francisco Europe: Ralf Brederlow Japan: Ichiro Yamamoto, Tamotsu Hiwatashi, Koichiro Ishibashi Taiwan: Chung-Ping Chen U.S.: Andrew Kahng, Resve Saleh, Dennis Sylvester.

611 views • 39 slides

Design ITWG ITRS-2003 December 2, 2003 Taiwan Japan: Ichiro Yamamoto, Tamotsu Hiwatashi

Design ITWG ITRS-2003 December 2, 2003 Taiwan Japan: Ichiro Yamamoto, Tamotsu Hiwatashi Taiwan: Chung-Ping Chen USA: Andrew Kahng (Europe: Ralf Brederlow). Design ITWG Contributions to ITRS. System Drivers Chapter Defines IC products that drive manufacturing and design technologies

534 views • 36 slides

What are we measuring in fMRI? Ruth Stavy David Carmel

503 views • 33 slides

Fukun Tang Electronics Development Group University of Chicago

Introduction Approaches and Possibilities Simulations Summary. Simulation of ps-Detector Electronics Approaches & Possibilities Workshop on Very Fast Time-of-Flight Methods, Problems and Prospects November 18, 2005 University of Chicago. Fukun Tang Electronics Development Group

404 views • 30 slides

System-on-Packaging: A Broad Perspective from System Design to Technology Development

System-on-Packaging: A Broad Perspective from System Design to Technology Development. Li-Rong Zheng Lab. of Electronics and Computer Systems Royal Institute of Technology (KTH) SE-164 40 Kista/Stockholm, Sweden Email: lrzheng@ele.kth.se. Johan Liu Div. of Electronics Production

453 views • 30 slides

Contribution of: Fraunhofer Institute for Integrated Circuits Branch Lab Design Automation (EAS)

368 views • 28 slides

VLSI Testing

VLSI Testing. Dr. Vishwani D. Agrawal James J. Danaher Professor of Electrical and Computer Engineering Auburn University, Alabama 36849, USA vagrawal@eng.auburn.edu http://www.eng.auburn.edu/~vagrawal August 7-13, 2010. Course Description.

508 views • 20 slides

Project Submission

325 views • 15 slides

Analog & Mixed-Signal Test Where are we going to?

analogue embedded testing. The question is?. Analog & Mixed-Signal Test Where are we going to?. or The question should be:. Analog & Mixed-Signal Test Where do we have to go?. The answer is:. We are going to where we have to go. That is. On-Chip Test Manager. Stimuli generation

275 views • 14 slides

Ribbon Cutting Ceremony Microelectronics Process Engineering Laboratory College of Engineering September 25, 2003

Ribbon Cutting Ceremony Microelectronics Process Engineering Laboratory College of Engineering September 25, 2003. Founding Partners Award Intel Corporation Dr. Jai Hakhu. Founding Partners Award Applied Materials, Inc. Dr. David N.K. Wang.

202 views • 13 slides

Single-Channel Audio Source Separation based on Probabilistic Latent Variable Decomposition

Single-Channel Audio Source Separation based on Probabilistic Latent Variable Decomposition. Ph.D Student Jeongsoo Park. Introduction. Spectral basis. Weight. Desired signal. Reconstruction. Spectrogram. Residuals. Background signal.

116 views • 11 slides

ELECTRICAL ENGINEERING DEPARTMENT

ELECTRICAL ENGINEERING DEPARTMENT. COLLEGE OF ENGINEERING SAN JOSE STATE UNIVERSITY. Silicon Valley THE Center of Electronics, Venture Capital & Electrical Engineering Education. Silicon Valley Companies with Sales over $1B Apple HP Intel Linear Cisco Google Oracle Netgear

412 views • 10 slides

Status: Process Integration, Devices and Structures (PIDS)

ITRS ITWG Meeting Amsterdam April 4, 2003. Status: Process Integration, Devices and Structures (PIDS). P. Zeitzoff, J. Hutchby, K. Schrueffer, T. Skotnicki, S. Sawada, T. Sugii, G. Bourianoff, K. DeMeyer. Focus

117 views • 3 slides

Real Number Modeling Enables Fast, Accurate Functional Verification

RNM. RNM. FastSPICE. Digital. RX ANALOG. TX ANALOG. RX Logic. PLL ANALOG. PLL Logic. TX Logic. Real Number Modeling Enables Fast, Accurate Functional Verification. Analog Behavioral. Effort. SPICE. Performance. The Challenge Making people believe

155 views • 1 slides