'Die surface' presentation slideshows

Control of Soldering and Thermal Fatigue During Die Casting

Control of Soldering and Thermal Fatigue During Die Casting. Srinath Viswanathan Metals and Ceramics Division Oak Ridge National Laboratory Oak Ridge, TN 37831 NADCA Die Materials Committee Meeting NADCA, Rosemont, Illinois March 6, 2002. Univ. of TN-ORNL Research Team.

622 views • 40 slides

Bulk Deformation Processes

755 views • 21 slides

Manufacturing Process -II

EE4271 VLSI Design. Dr. Shiyan Hu Office: EERC 518. Manufacturing Process -II. Adapted and modified from Digital Integrated Circuits: A Design Perspective by Jan M. Rabaey, Anantha Chandrakasan, and Borivoje Nikolic. Challenge. 193 nm. Illumination source. 45 nm. Mask. Objective Lens.

296 views • 17 slides

The Advantages of Flip-Chip Design

The Advantages of Flip-Chip Design. February 2003 John Park. What is Flip-Chip?. Flip-Chip IS- A method to electrically connect the die to the package carrier Lead Frame or Substrate

504 views • 3 slides