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Chip rdp - PowerPoint PPT Presentation

Thermal Modeling of Half an LPix

Thermal Modeling of Half an LPix. Brian Maynard March 10, 2010. Assumed Material Properties. Power dissipation for irradiated silicon (input to ANSYS). Power dissipation at 1e16 n eq /cm 2 ~122 mW/cm 2 (from T. Affolder ). For annealed silicon, we simply multiply

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218 views • 10 slides

More Diamond?

More Diamond?. A Substrate Thickness Study for C-Shape VELO Brian Maynard. Including Digital Section of Chip. 0.5 W/chip Analog +1/R section of chip (RDP). Constant digital section of chip (DPB). The orange part of the chip is situated such that it is farthest away from the beam center.

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176 views • 4 slides

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Chip rdp - PowerPoint PPT Presentation

Thermal Modeling of Half an LPix

More Diamond?