Atotech s solutions for mlb production using advanced basematerials
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Atotech’s Solutions for MLB Production using Advanced Basematerials. Speaker: Jaime Peraza Ordaz PMM Atotech Europe mobile: +34 606 372 364 email: [email protected] Tobias Sponholz Global Assistant Product Manager BTT PTH Mobile: +49 (0)173 - 628 64 80

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Atotech’s Solutions for MLB Production using Advanced Basematerials

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Atotech s solutions for mlb production using advanced basematerials

Atotech’s Solutions for MLB Production using Advanced Basematerials

Speaker:

Jaime PerazaOrdaz

PMM Atotech Europe

mobile: +34 606 372 364

email: [email protected]

Tobias Sponholz

Global Assistant Product Manager BTT PTHMobile: +49 (0)173 - 628 64 80

Email: [email protected]


Agenda

Agenda

Application Guide

Vertical Electroless Copper

Printoganth PV (E)

Direct Plating

Neopact

Seleo CP Plus

Horizontal Electroless Copper

Printoganth P Plus

1

3

4

2

Atotech’s Solutions MLB Production using Advanced Basematerials Saint Petersburg, May 2013, JPO


Atotech s solutions for mlb production using advanced basematerials

Application Guide


Pth process overview application and pricing guide

PTH Process Overview Application and Pricing Guide


Atotech s solutions for mlb production using advanced basematerials

Horizontal Electroless CopperPrintoganth P Plus


Atotech s solutions for mlb production using advanced basematerials

Printoganth P Plus enables highest flexibility in production mix

Printoganth P PlusFeatures & Benefits

  • Market Introduction in Sept. 2009

  • Target Application

    • Any production with advanced materials where adhesion or blistering is an issue e.g. flex, rigid-flex, PTFE, BT, PI, etc.

    • HDI and AMSAP technology

  • Technical Benefits

    • Extremely good non-blister behavior and coverage performance

    • Very good reliability

    • Easily adjustable deposit rate 0.35 – 0.5µm / 4 min

    • Enhanced bath stability


Horizontal mlb and hdi processes comparison

Printoganth P Plus is Atotech’s most capable process for HDI manufacturing

Horizontal MLB and HDI ProcessesComparison

CN-

, JPO


Horizontal desmear uniplate p

Horizontal DesmearUniplate P

Sweller

Permanganate Etch

Reducer

  • SECURIGANTH® desmear series is the industry standard for horizontal HDI manufacturing.

  • Optimal desmear attack on a wide variety of base materials.


Horizontal activation e less cu uniplate lb

Horizontal Activation & E’less CuUniplate LB

Cleaning

Etch Cleaning

Pre Dip

Neoganth 800

Activator

Reducer

E’less Copper


Economic activator neoganth 800 features benefits

Economic Activator Neoganth 800Features & Benefits

  • New Ionic activator system for horizontal application running at only 75ppm Pd

    • Activator U = 225 ppm

  • Enables significant savings in running costs by less consumed Pd

  • Fully compatible to established Atotech conditioning system

    • easy drop in solution

  • Perfect coverage on a wide range of relevant base materials

  • Same excellent reliability results as Activator U

  • Robust & easy process

  • Wide working window

Activator 800 during Alpha site test


Atotech s solutions for mlb production using advanced basematerials

Printoganth P series

X

relative strain

Z

Non-Blistering PerformanceTheoretical Explanation

  • Non-blistering performance is related to internal stress within deposited e’less Cu layer

  • Relevant factors for Cu deposit behavior

    • Stabilizer type & concentration

    • Stabilizer Co-deposits (e.g. Ni)

    • Deposition temperature

    • Baking after electroless Cu deposition

  • X-ray diffraction (XRD) measurement reveals constant tensile stress with Printoganth P Plus – a type of internal stress that is beneficial for non-blistering!


Atotech s solutions for mlb production using advanced basematerials

Printoganth P PlusApplications

FR4 Production Board

Flex-Rigid Board

  • No Blistering due to excellent stress characteristics

  • Bright deposition color


Atotech s solutions for mlb production using advanced basematerials

Printoganth P Plus fulfills all reliability requirements for high-end HDI production.

ReliabilitySummary

  • Quick Via Pull test, 3-6 mil – all passed.

  • Solder Shock Test (6x 288°C, 10s floating) – No ICDs, passed.with THs and BMVs

  • Solder Shock Test (9x 326°C, 10s), THs & BMVs– few ICDs, ok.with THs and BMVs

  • IST (+150°C / RT @ 3’/ cool down within 2‘, max. 10% resistance increase) – 2000 cycles passed.

  • Various E-tests (daisy chains)– all passed.


Atotech s solutions for mlb production using advanced basematerials

Printoganth P PlusCustomer References


Atotech s solutions for mlb production using advanced basematerials

Vertical Electroless CopperPrintoganth PV (E)


Atotech s solutions for mlb production using advanced basematerials

Process SequenceActivation & E‘less Cu

Desmear

Cleaning

Etch Cleaning

Pre Dip

Neoganth V8 (60 ppm)

50

Activator

Reducer

E’less Copper


Atotech s solutions for mlb production using advanced basematerials

Activation Series Neoganth LS PlusFeatures & Benefits

  • Ionic Activator for vertical application

  • Optimal coverage at low running cost (75ppm Pd)

  • Fine & homogeneous distribution of Pd particles

  • No tooling hole issues

  • Not corrosive

  • Improved robustness, no precipitations during manual replenishment

  • Easy handling, no premixing

  • 100% compatible to established conditioning concept

Pre Dip

Activator

Reducer


Atotech s solutions for mlb production using advanced basematerials

Activator Neoganth V8 – full power ionic activation at low cost

Economic Activator EXPT Neoganth V8Features & Benefits

  • New ionic activator system for vertical MLB/HDI applications running at only 60 ppm Pd

    • Enables significant savings in running costs by less consumed Pd

  • Modified complexing agents

    • Ensures good coverage despite low palladium content

    • ‘Locking’ copper ions in a stable complex enhances bath lifetime

  • Less alkaline

    • Improved bath stability by reduced carbonate formation

  • Perfect coverage on a wide range of relevant base materials

  • Fully compatible to established Atotech conditioning system

    • Easy drop in solution

  • Robust & easy process

    • No additional NaOH dosing required by optimized replenishment concept

    • Wide working window


Atotech s solutions for mlb production using advanced basematerials

Printoganth PV vs PV EComparison

Cleaning

Etch Cleaning

Pre Dip

  • Identical stabilizer system

  • Same bath performance

  • Different Cu source (CuSO4, CuCl) to be more flexible in supply chain

  • PV E potentially more cost-effective due to higher concentrated Cu additive

Activator

Reducer

E’less Copper


Atotech s solutions for mlb production using advanced basematerials

Printoganth PV (E)Features and Benefits

  • Versatile vertical e’less Cu process for advanced MLB/HDI applications

  • Superior adhesion on most materials including PI, PTFE, BT... due to optimal internal stress characteristics of the copper deposit:

    • No blistering

    • No pull away

  • Highly reliable process

    • Fulfills all standard reliability requirements such as SST, IST, TCT

    • No ICDs at standard conditions and only low occurrence at harsh solder shock conditions as 9x 326ºC

  • Low to high build deposit possible

    • Deposition speed 0.3 - 0.6µm in 10 min

  • Environmentally friendly

    • Tartrate based

    • Cyanide free


Atotech s solutions for mlb production using advanced basematerials

Printoganth PV ECoverage in Through Holes

Pos.1

Pos.6

Pos.7

Pos.2

Pos.3

Pos.8

Pos.4

Pos.9

Pos.10

Pos.5


Atotech s solutions for mlb production using advanced basematerials

Excellent BMV coverage despite strong glass fiber protrusion!

Printoganth PV ECoverage in Blind Micro Via

SEM picture


Atotech s solutions for mlb production using advanced basematerials

Printoganth PV ECoverage

standard pth process without 902 Flex Cleaner or Reduction Conditioner


Atotech s solutions for mlb production using advanced basematerials

Outstanding adhesion with Printoganth PV E !

Printoganth PV ESurface Adhesion

Excellent adhesion on exposed polyimide


Atotech s solutions for mlb production using advanced basematerials

Printoganth PV EProduction Example – Exotic Materials

  • Korean Customer for military application

Final Product

Fe oxide powder

EPDM Rubber


Atotech s solutions for mlb production using advanced basematerials

Printoganth PV E fulfills highest reliability requirements

Printoganth PV ESolder Shock Results

Alpha site test with customer production panel (Nanya NP-175TL, phenolic-cured FR4, Tg 175ºC)


Atotech s solutions for mlb production using advanced basematerials

Printoganth PV ESolder Shock Results

  • 6x IR reflow + 1x solder shock

  • no pull away

  • no ICD

customer internal test results, production panels (EMC EM-320, lead-free high Tg 170ºC)

  • Solder shock tests

Test at customer site with production panels (Isola E-Cu 114, dicy-cured FR4, Tg 150ºC)


Atotech s solutions for mlb production using advanced basematerials

Printoganth PV E and PVReferences

Printoganth PV

Printoganth PV E

status 2012-10


Atotech s solutions for mlb production using advanced basematerials

Printoganth PV (E)

vertical e’less Cu process for MLB/HDI applications

outstanding non-blistering performanceon any kind of base materials

highly reliable

Optimal performance in conjunction with

Securiganth BLG desmear

Neoganth LS Plus activation

Outlook

Neoganth V8 Activator for lower running cost

Printoganth PV (E)Summary

Deposit structure of Printoganth PV E

Plated BMV with Printoganth PV E


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