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Gamma-ray Large Area Space Telescope. TEM/TPS TRR. GLAST Large Area Telescope: Presented by G. Haller SLAC [email protected] (650) 926-4257. Contents. Introduction Overview Significant Changes since CDR Objectives Status Requirements/Verification EGSE and Test-Procedures

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Tem tps trr l.jpg

Gamma-ray Large Area Space Telescope

TEM/TPS TRR

GLAST Large Area Telescope:

Presented by G. Haller

SLAC

[email protected]

(650) 926-4257


Contents l.jpg

Contents

  • Introduction

    • Overview

    • Significant Changes since CDR

    • Objectives

    • Status

  • Requirements/Verification

  • EGSE and Test-Procedures

  • Verification Test Plan and Flow

    • At Assembly Vendor

      • Test-plan and Flow

      • Facility

      • Man-Power

      • Quality Assurance

      • Vibration

    • At SLAC

      • Test-plan and Flow

      • Thermal Vacuum Test

      • Mass Property

      • EMI/EMC (at sub-contractor)

      • Man-Power

      • Quality Assurance

  • Equipment Calibration/Safety

  • Risk Assessment

  • Schedule

  • Status of Procedures

  • Issues and Concerns


Lat electronics l.jpg

LAT Electronics

TKR Front-End Electronics (MCM)

ACD Front-End Electronics (FREE)

TKR

CAL Front-End Electronics (AFEE)

16 Tower Electronics Modules & Tower Power Supplies

CAL

Global-Trigger/ACD-EM/Signal-Distribution Unit*

3 Event-Processor Units (EPU) (2 + 1 spare)

  • Event processing CPU

  • LAT Communication Board

  • SIB

Spacecraft Interface Units (SIU)*

  • Storage Interface Board (SIB): Spacecraft interface, control & telemetry

  • LAT control CPU

  • LAT Communication Board (LCB): LAT command and data interface

Power-Distribution Unit (PDU)*

  • Spacecraft interface, power

  • LAT power distribution

  • LAT health monitoring

* Primary & Secondary Units shown in one chassis


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TEM/TPS Mounted to CAL

TKR not shown

LAT GRID with 16 CAL/TEM/TPS Modules

CAL

TEM

TPS


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Tower Electronics Module

EM Tower Electronics Module (TEM) before coating/staking

  • Main DAQ module, one on each tower

    • Controls and reads out data from TKR MCM and CAL AFEE front-end electronics

    • Zero-suppresses CAL event data

    • Buffers events in cable ASIC FIFO’s

    • Assembles CAL and TKR event fragments to tower event

    • Transmits data to GASU

    • Contains monitoring and low-rate science circuits

    • LVDS interface to front-end electronics and GASU

TEM Assembly


Tower power supply l.jpg

Tower Power Supply

EM Tower Power Supply (TPS) before coating/staking

  • Tower Power Supply module, one on each tower

    • Input 28V

    • Generates low-noise voltages for

      • TKR (2.65V analog, 2.65V Digital)

      • CAL (3.3V analog, 3.3V digital)

      • TEM (3.3V and 2.5V digital)

      • TKR Bias (20V-140V programmable)

      • CAL (20V to 90V programmable)

    • Temperature sensors

TPS Assembly


Tem tps assembly l.jpg

TEM/TPS Assembly

After TEM and TPS are tested individually, the two modules are mated and the TEM/TPS package is tested

TPS

TEM

Shown upside-down

TPS

TEM


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Changes since TEM CDR and Power-Supply Delta CDR

  • Power Supply Review from 9-22-03

    • SLAC GLAST web-site -> Electronics & DAQ -> Reviews

  • TEM

    • Modification of FPGA code

      • To fix a couple of bugs

      • To change flow-control slightly to optimize dataflow throughout system

      • Code was reviewed by GSFC reviewer (Dr Rod)

    • Some resistor/capacitor values have changed to optimize monitoring ranges

    • Details of monitoring circuit have changed and a sub-set of current monitoring functions were eliminated

  • TPS

    • Resistor/capacitor changes to optimize circuit performance over temperature

    • Changes in poly-switch values to protect better over temperature (instead of RXE185, split the load into two paths with a RXE110 each), increased the current sensing resistor from a 1W to a 3W resistor.

    • Changed resistor values to

      • Modify TKR 2.5V to 2.65V

      • Decrease maximum CAL Bias from 120V to 90V

    • Changed Zener diodes at Bias output voltage for new max values

    • Changed resistor values to optimize in-rush current level

  • Worst Case Analysis updated to incorporate changes

  • Thermal Analysis from CDR/Delta-CDR remained since changes don’t impact thermal performance


Objectives l.jpg

Objectives

  • Demonstrate that hardware, software, procedures, and support equipment are prepared to support system environmental test

  • Demonstrate that planned and completed testing meets performance and interface requirements

  • Identify and understand all the risks and limitations

  • TRR is not intended to

    • Review TEM/TPS design

    • Review flight readiness

    • Buy-off hardware or software

  • RFA’s should only be of sufficient concern to stop test

    • Prior to start of an given test, any applicable TRR RFAs must be closed


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Test Entrance / Exit Criteria

  • Entrance

    • All required paperwork released and in place

      • Procedures, drawings, etc

    • Test configuration verified and approved

    • Essential personnel in place

    • Pre-test TEM/TPS functional successfully passed

  • Exit

    • As-run procedures completed

    • Correct and accurate application of test environment

    • Test data acquired and archived

    • No damage to TPS/TEM

    • TEM/TPS performance within specification limits

    • Post-test TEM/TPS functional successful


Status l.jpg

Status

  • 3 TEM/TPS

    • Qualification unit, Tower A, and Tower B units

      • Assembled,

      • Functional tested

      • Ready for environmental test

  • Assembly of balance of 19 TEM and TPS authorized to proceed, but not started yet

    • All parts at assembler


Tests to date l.jpg

Tests To-Date

  • TEM and TPS engineering modules were extensively tested

    • As EGSE in DAQ/CAL/TKR/I&T

      • >50 test-stands were tested with SLAC TPS and TEM Test Procedure

      • TEM and TPS were used to test functionality and performance of TKR and CAL sub-system electronics

        • Met requirements by sub-system

      • CAL performed vibration tests on coated/staked TEM/TPS to CAL levels, passed (exceptions were first modules in-house staked)

    • Additional TEM/TPS tests

      • Informal thermal-vacuum test -40C to 55C, passed CPT

      • Vibration tests of staked TEM/TPS passed DAQ qual levels

    • On test-bed

      • 16 TEM/TPS connected to EM PDU and GASU and to Front-End Simulator modules generating trigger and event-data

      • Run up to 10 KHz data-rates


Tests to date con t l.jpg

Tests To-date (con’t)

  • On fully-instrumented tower

    • 36 TKR MCM’s

    • 4 CAL AFEE’s

    • Ran tests and passed

  • Test results for TEM/TPS performance tests posted for the EGSE TEM/TPS

  • E.g. TEM/TPS delivered to CAL:

    • http://www-glast.slac.stanford.edu/Elec_DAQ/EGSE/CAl-AFEE/cal.htm

  • IO tested to sub-system ICD‘s

  • Configuration and data-taking tested

  • Monitoring functions/performance tested

  • Tested over

    • Frequency (16Mhz to 22 MHz, 20 MHz nominal)

    • Temperature (-40C to 55C)

    • TEM supply range (3.3V +/- 10%, 2.5V +/-10%)

  • One flight PCB TEM/TPS was loaded at SLAC with mostly parts from flight lots, including flight-lot ACTEL FPGA‘s

    • Passed tests from -40C to 55C over voltage and frequency

  • Three TEM and TPS flight modules assembled at flight-assembly vendor individually tested with CPT procedures, over temperature, passed tests


  • Requirements l.jpg

    Requirements

    • LAT-SS-00019 Specifications, Level 3 T&DF Subsystem Specification

    • LAT-SS-00284 Specifications, Level 4 Trigger

    • LAT-SS-00285 Specifications, Level 4 Dataflow

    • LAT-SS-00136 Specifications, Level 3 Power Supply System 

    • LAT-SS-00183 Specifications, Level 4 Power Supply System

    • LAT-SS-05522 Specifications, Level 5 TEM Specification

    • LAT-SS-01281 Specifications, Level 5 TPS ICD & Specification

    • LAT-SS-05533 Specifications, Level 5 TEM/TPS Specification


    Derived requirements l.jpg

    Derived Requirements

    • LAT-SS-05533 TEM/TPS lists 132 requirements for TEM/TPS package (most are from TEM LAT-SS-05522 (108) with extensions (24) to include TPS requirements for the TEM/TPS package)

    • Verification Matrix gives approach to verify each requirement

      • LAT-TD-05536

      • Lists verification method used

    • Assembly level at which requirement is verified

      • All TEM requirements at TEM assembly level (LAT-SS-05522)

      • ALL TPS requirements at TPS assembly level (LAT-SS-01281)

      • TEM/TPS package requirements at TEM/TPS assembly level (LAT-SS-05533)


    System performance l.jpg

    System Performance

    • Level 3 and level 4 DAQ and TRG and power-system requirements are met with a combination of DAQ modules (TEM/TPS, GASU, SIU, PDU, etc), since the DAQ and trigger and power system is comprised of several sub-system module types

      • Level 5 TEM/TPS requirements which are verified are derived from Level 3 and Level 4 DAQ and Trigger and Power system specifications (as noted in the L5 requirements doc)

      • Level 5 requirement doc includes derived requirement addressing

        • Functionality/performance

        • Power

        • Mass/C.G.

        • EMI/EMC

        • Environmental incl temperature and vibration


    Verification status l.jpg

    Verification Status

    • Engineering Module TEM/TPS

      • EM completed full environmental/functional test program with exception of EMI/EMC, mass, and C.G.

      • Demonstrated compliance with specifications


    Egse and test procedures l.jpg

    EGSE and Test-Procedures

    • EGSE for Functional/Performance Tests

      • Test-Stand documented in LAT-DS-04085

    • TEM (at TEM module level)

      • TEM Stray-Voltage-Test Procedure LAT-TD-04097

      • TEM Electrical Interface Continuity and Isolation Test procedure LAT-TD-03831

      • TEM Test-Procedure LPT LAT-TD-03415

    • TPS (at TPS module level)

      • TPS Stray-Voltage-Test Procedure LAT-TD-04098

      • TPS Electrical Interface Continuity and Isolation Test procedure LAT-TD-04099

      • TPS Test-Procedure LPT LAT-TD-01652

    • TEM/TPS (at combined unit level)

      • TEM/TPS Performance Test Procedure LAT-TD-01485


    Egse test configuration l.jpg

    EGSE Test-Configuration

    • LAT-DS-04085


    Verification level module detail l.jpg

    Verification Level – Module Detail

    • Breakout of verification at TEM/TPS Module Level

      • Tests to be conducted after successful TRR

        • At assembly vendor

          • Functional test

          • Vibration

          • Functional test

          • Thermal cycle

          • Functional test

          • Pre-ship review

        • At SLAC

          • Incoming functional test

          • Mass properties

          • Thermal vacuum (in-situ testing)

          • EMI/EMC

          • Functional test

          • Review

          • Deliver to I&T

            • DAQ (out-going) / I&T (incoming) test combined

    • In the following slides first the work/tests at the assembly vendor is defined, then the work/tests at SLAC


    At assembly vendor l.jpg

    At Assembly Vendor

    • Test-Stand

      • Supplied by SLAC

      • Operated by SLAC engineers

    • Vibration facility at General Technology

      • Vibration test-procedure

        • http://www-glast.slac.stanford.edu/Elec_DAQ/Reviews/TEM-TRR/SK-282-SLAC-ESS-Procedure-11-03-04.pdf

          • Also includes

            • Thermal test procedures

            • Environmental chamber (thermal/vibration) description

        • SLAC engineers present for vibration tests

    • Work at assembly vendor specified in SOW

      • LAT-PS-02615


    Process test flow gtc assembly vendor l.jpg

    Process & Test Flow-GTC (Assembly Vendor)

    • See also in more detail in

    • http://www-glast.slac.stanford.edu/Elec_DAQ/Reviews/TEM-TRR/SK-282-SLAC-ESS-Procedure-11-03-04.pdf

    Assemble

    TEM/TPS

    Stake HW

    Functional

    Test

    Vibration Test

    Source inspection

    &EIDP review

    Functional test

    Thermal

    test

    Final functional test

    Pack & ship to

    SLAC


    Gtc qualification and acceptance test matrix l.jpg

    GTC Qualification and Acceptance Test Matrix


    Gtc environmental test requirements l.jpg

    GTC Environmental Test Requirements

    Figure 1. Vibration Levels, Duration, and Spectra


    Manpower quality assurance at assembly vendor l.jpg

    Manpower & Quality Assurance at Assembly Vendor

    • Man-Power

      • Thermal and vibration test man-power provided by assembler

      • Test man-power supplied by SLAC

        • TEM: L. Sapozhnikov

        • TPS: D. Nelson

        • Test Support: J. Ludvik

      • Quality assurance: see below

    • Quality Assurance

      • Assembly QA by vendor as required by SOW

      • On-site, full-time LAT QA presence (P. Lujan)

      • Required changes to documentation at GTC is immediately documented on an NCMR and forwarded to SLAC for disposition

      • All outstanding changes to documents are incorporated and a new revision released into LAT DOCs prior to final inspection at each manufacturing/test level (CCA, Module, Top Assembly)


    At slac l.jpg

    At SLAC

    • After TEM/TPS module has been shipped from assembly vendor to SLAC:

    • Test-Stand

      • Supplied by SLAC, operated by SLAC engineers

    • Work flow

      • Functional Test

      • Mass Property

        • Plus C.G. measurement

      • Thermal Vacuum (in-situ testing)

      • Functional Test

      • Ship to EMI/EMC vendor

      • EMI/EMC test

      • Ship back to SLAC

      • Final functional test

      • Review


    Mass property l.jpg

    Mass Property

    • Mass properties checked at SLAC

      • Procedure in progress (done at SLAC Metrology)

      • Measured on EM (ref LAT-TD-00564)

        • TEM 2.710 kg

        • TPS 4.340 kg

        • TEM/TPS Total 7,050 kg

        • Allocation 12% above = 7,896 kg

      • C.G. to be measured for the qualification unit


    Thermal vacuum test l.jpg

    Thermal Vacuum Test

    • Thermal Vacuum facility in Building 33 at SLAC

      • Thermal Vacuum Chamber Operating Procedure LAT-TD-02541 (draft in review)

      • TEM/TPS Thermal Vacuum Test-Procedure LAT-TD-03631 ( draft in review)

      • Chamber was relocated to Building 33 from Central Lab

      • Needs earth-quake securing, in progress (by 1/10)

      • Needs recalibration (by 1/15)


    Qual and flight acceptance thermal vacuum test l.jpg

    Qual and Flight Acceptance Thermal Vacuum Test

    • See TEM/TPS Thermal Vacuum Test-Procedure LAT-TD-03631

    At < 10-5 Torr


    Manpower quality assurance at slac l.jpg

    Manpower & Quality Assurance at SLAC

    • Man-Power

      • Thermal Vacuum test (R. Williams, J. Ludvik)

      • Test man-power supplied by SLAC

        • TEM/TPS: L. Sapozhnikov, D. Nelson, J. Ludvik

      • Quality Assurance

        • LAT QA already present at SLAC

        • Required changes to documentation is immediately documented on an NCMR


    Emi emc test l.jpg

    EMI/EMC Test

    • Qualification Test (Conductive & Radiative)

      • Sub-contracted to CK Labs

      • Statement of Work: LAT-PS- 04568

        • CE102, CECN, CS102, CSCM, CS06, RE101, RE102, RS101, RS103

      • Detailed EMI/EMC procedure deliverable by vendor (in work)

        • Required to be reviewed/released prior to tests

      • SLAC engineers present at vendor for tests

      • Vendor supplies test-report

      • LAT QA at SLAC present for tests

    • Flight Acceptance Test (Conductive)

      • Performed at SLAC

      • Procedure in work

        • Required to be reviewed/released prior to tests

        • CE102, CS102

      • SLAC supplies test-report

      • LAT QA at SLAC present for tests


    Problem failure report configuration management l.jpg

    Problem Failure Report/ Configuration Management

    • Problem Failure Reporting

      • Via standard SLAC LAT Non-Conformance Reporting (NCR) System

        • NCR is entered

        • Reviewed/accepted/resolved

          • LAT engineering

          • LAT QC

        • Already exercised during past TEM/TPS assembly

    • Configuration Management

      • Via standard LATDOC system


    Planned tests l.jpg

    Planned Tests

    • Function/Performance Tests (LAT-TD-01485)

      • Verifies all requirements in LAT-SS-05533 except below

    • Thermal Vacuum Tests

      • Verifies performance/function over temperature

    • Mass/C.G.

      • Verifies/measures mass and C.G.

    • Vibrations test

      • Verifies vibration performance requirements

    • EMI/EMC

      • Verifies EMI/EMC performance


    Equipment calibration l.jpg

    Equipment Calibration

    • Electrical Functional Test Equipment

      • EGSE Test-Stand was certified by SLAC (will be posted on LAT EGSE web-site shortly)

    • EMI/EMC Test Equipment

      • Quantitative measurement equipment (sensors, antennas, etc) calibrated to NIST standards

      • Calibration performed annually

        • All item are (will be) within calibration at time of testing

    • Vibration Test Equipment

      • Accelerometers calibrated against a standard accelerometer traceable to NIST

      • Signal conditioners calibrated annually

    • TVAC Equipment

      • Thermocouples calibrated against standard temperature; calibrated prior to test

      • Thermocouple reader calibrated very 2 years


    Sub system safety l.jpg

    Sub-System Safety

    • EGSE

      • Safe-to-mate

      • Configuration control

      • Calibration verification

      • Functionality verification with “golden” TEM/TPS prior to test with flight hardware

    • MGSE

      • No custom MGSE

    • Environment

      • Temperature controlled in all test-facilities

      • Cleanliness actively controlled in clean-room; hardware bagged and purged when required

    • Training

      • ESD training completed

      • Clean room training completed


    Risk assessment l.jpg

    Risk Assessment

    • GTCC/GCCC TEM ASICs qualification program not completed at GSFC

      • No issue to-date

      • Test completion end of February

    • ACTEL FPGA’s

      • TEM’s use relatively new UMC fabrication-line space-qualified FPGA’s, no flight heritage

    • ESD sensitivity of ASIC’s higher than expected (200V, class 0)

      • Mate-demate and safe-to-mate are of concern when connecting/disconnecting TEM to front-end test (simulator) board. Keep cables as short as possible, apply handling taught in ESD-training, use de-ionizers

    • Schedule

      • Pressure to deliver flight hardware could force less than complete characterization and analysis of modules, could result in replicating a problem in follow-on modules

    • Performance

      • None known


    Test schedule l.jpg

    Test-Schedule

    • Depending on assembly vendor, estimate as follows

      • 1/10/05: functional test of qual/TwrA/TwrB

      • 1/11-12/05: vibration test of qual/TwrA/TwrB

      • 1/13/05: functional test of qual/TwrA/TwrB

      • 1/14-15/05: TC of qual/TwrA/TwrB

      • 1/16/05: functional test of qual/TwrA/TwrB

      • 1/17-21: review/shipping

      • 1/24/05: functional test of qual/TwrA/TwrB

      • 1/25/05: mass, c.g. property test of qual/TwrA/TwrB

      • 1/26/05: TV start of TwrA, end Feb 2

      • 2/3/05: EMI/EMC of TwrA, end 2/5/05

      • 2/7/05: TV start of TwrB, end Feb 14

      • 2/15/05: EMI/EMC of TwrA, end 2/16/05

      • 2/15/05: TV start of Qual, end Feb 22

      • 2/22/05: EMI/EMC of Qual, end 3/8/05


    Status of main test procedures l.jpg

    Status of Main Test Procedures

    • TEM/TPS Performance Test Procedure LAT-TD-01485: released

    • Vibration & thermal cycle procedure

      • GT procedure SK-282-SLAC: approved

    • EMI/EMC

      • Qual

        • CKC Lab procedure: will be started 2nd week of January

      • Flight

        • Working together with TKR to get procedure finished by 3rd week of January (procedures are similar)

    • Thermal Vaccum

      • LAT-TD-03631, in draft form

    • All procedures must be released before respective test


    Issue concerns l.jpg

    Issue & Concerns

    • EMI tests

      • Concern passing qualification tests

    • Schedule

      • Tight

    • Qualification and Flight acceptance tests of flight TEM/TPS are performed with front-end simulators, not with actual CAL or TKR electronics

      • In the planning phase:

        • Taking qualification module after baseline environmental testing is completed

        • Connect it to CAL AFEE / TKR MCM electronics

        • Test over temperature (no vacuum required)

        • Need documentation

      • Possible for every flight modules: schedule issues


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