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Gamma-ray Large Area Space Telescope. TEM/TPS TRR. GLAST Large Area Telescope: Presented by G. Haller SLAC [email protected] (650) 926-4257. Contents. Introduction Overview Significant Changes since CDR Objectives Status Requirements/Verification EGSE and Test-Procedures

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Tem tps trr l.jpg

Gamma-ray Large Area Space Telescope


GLAST Large Area Telescope:

Presented by G. Haller


[email protected]

(650) 926-4257

Contents l.jpg

  • Introduction

    • Overview

    • Significant Changes since CDR

    • Objectives

    • Status

  • Requirements/Verification

  • EGSE and Test-Procedures

  • Verification Test Plan and Flow

    • At Assembly Vendor

      • Test-plan and Flow

      • Facility

      • Man-Power

      • Quality Assurance

      • Vibration

    • At SLAC

      • Test-plan and Flow

      • Thermal Vacuum Test

      • Mass Property

      • EMI/EMC (at sub-contractor)

      • Man-Power

      • Quality Assurance

  • Equipment Calibration/Safety

  • Risk Assessment

  • Schedule

  • Status of Procedures

  • Issues and Concerns

Lat electronics l.jpg
LAT Electronics

TKR Front-End Electronics (MCM)

ACD Front-End Electronics (FREE)


CAL Front-End Electronics (AFEE)

16 Tower Electronics Modules & Tower Power Supplies


Global-Trigger/ACD-EM/Signal-Distribution Unit*

3 Event-Processor Units (EPU) (2 + 1 spare)

  • Event processing CPU

  • LAT Communication Board

  • SIB

Spacecraft Interface Units (SIU)*

  • Storage Interface Board (SIB): Spacecraft interface, control & telemetry

  • LAT control CPU

  • LAT Communication Board (LCB): LAT command and data interface

Power-Distribution Unit (PDU)*

  • Spacecraft interface, power

  • LAT power distribution

  • LAT health monitoring

* Primary & Secondary Units shown in one chassis

Tem tps mounted to cal l.jpg
TEM/TPS Mounted to CAL

TKR not shown

LAT GRID with 16 CAL/TEM/TPS Modules




Tower electronics module l.jpg
Tower Electronics Module

EM Tower Electronics Module (TEM) before coating/staking

  • Main DAQ module, one on each tower

    • Controls and reads out data from TKR MCM and CAL AFEE front-end electronics

    • Zero-suppresses CAL event data

    • Buffers events in cable ASIC FIFO’s

    • Assembles CAL and TKR event fragments to tower event

    • Transmits data to GASU

    • Contains monitoring and low-rate science circuits

    • LVDS interface to front-end electronics and GASU

TEM Assembly

Tower power supply l.jpg
Tower Power Supply

EM Tower Power Supply (TPS) before coating/staking

  • Tower Power Supply module, one on each tower

    • Input 28V

    • Generates low-noise voltages for

      • TKR (2.65V analog, 2.65V Digital)

      • CAL (3.3V analog, 3.3V digital)

      • TEM (3.3V and 2.5V digital)

      • TKR Bias (20V-140V programmable)

      • CAL (20V to 90V programmable)

    • Temperature sensors

TPS Assembly

Tem tps assembly l.jpg
TEM/TPS Assembly

After TEM and TPS are tested individually, the two modules are mated and the TEM/TPS package is tested



Shown upside-down



Changes since tem cdr and power supply delta cdr l.jpg
Changes since TEM CDR and Power-Supply Delta CDR

  • Power Supply Review from 9-22-03

    • SLAC GLAST web-site -> Electronics & DAQ -> Reviews

  • TEM

    • Modification of FPGA code

      • To fix a couple of bugs

      • To change flow-control slightly to optimize dataflow throughout system

      • Code was reviewed by GSFC reviewer (Dr Rod)

    • Some resistor/capacitor values have changed to optimize monitoring ranges

    • Details of monitoring circuit have changed and a sub-set of current monitoring functions were eliminated

  • TPS

    • Resistor/capacitor changes to optimize circuit performance over temperature

    • Changes in poly-switch values to protect better over temperature (instead of RXE185, split the load into two paths with a RXE110 each), increased the current sensing resistor from a 1W to a 3W resistor.

    • Changed resistor values to

      • Modify TKR 2.5V to 2.65V

      • Decrease maximum CAL Bias from 120V to 90V

    • Changed Zener diodes at Bias output voltage for new max values

    • Changed resistor values to optimize in-rush current level

  • Worst Case Analysis updated to incorporate changes

  • Thermal Analysis from CDR/Delta-CDR remained since changes don’t impact thermal performance

Objectives l.jpg

  • Demonstrate that hardware, software, procedures, and support equipment are prepared to support system environmental test

  • Demonstrate that planned and completed testing meets performance and interface requirements

  • Identify and understand all the risks and limitations

  • TRR is not intended to

    • Review TEM/TPS design

    • Review flight readiness

    • Buy-off hardware or software

  • RFA’s should only be of sufficient concern to stop test

    • Prior to start of an given test, any applicable TRR RFAs must be closed

Test entrance exit criteria l.jpg
Test Entrance / Exit Criteria

  • Entrance

    • All required paperwork released and in place

      • Procedures, drawings, etc

    • Test configuration verified and approved

    • Essential personnel in place

    • Pre-test TEM/TPS functional successfully passed

  • Exit

    • As-run procedures completed

    • Correct and accurate application of test environment

    • Test data acquired and archived

    • No damage to TPS/TEM

    • TEM/TPS performance within specification limits

    • Post-test TEM/TPS functional successful

Status l.jpg

  • 3 TEM/TPS

    • Qualification unit, Tower A, and Tower B units

      • Assembled,

      • Functional tested

      • Ready for environmental test

  • Assembly of balance of 19 TEM and TPS authorized to proceed, but not started yet

    • All parts at assembler

Tests to date l.jpg
Tests To-Date

  • TEM and TPS engineering modules were extensively tested

    • As EGSE in DAQ/CAL/TKR/I&T

      • >50 test-stands were tested with SLAC TPS and TEM Test Procedure

      • TEM and TPS were used to test functionality and performance of TKR and CAL sub-system electronics

        • Met requirements by sub-system

      • CAL performed vibration tests on coated/staked TEM/TPS to CAL levels, passed (exceptions were first modules in-house staked)

    • Additional TEM/TPS tests

      • Informal thermal-vacuum test -40C to 55C, passed CPT

      • Vibration tests of staked TEM/TPS passed DAQ qual levels

    • On test-bed

      • 16 TEM/TPS connected to EM PDU and GASU and to Front-End Simulator modules generating trigger and event-data

      • Run up to 10 KHz data-rates

Tests to date con t l.jpg
Tests To-date (con’t)

  • On fully-instrumented tower

    • 36 TKR MCM’s

    • 4 CAL AFEE’s

    • Ran tests and passed

  • Test results for TEM/TPS performance tests posted for the EGSE TEM/TPS

  • E.g. TEM/TPS delivered to CAL:

    • http://www-glast.slac.stanford.edu/Elec_DAQ/EGSE/CAl-AFEE/cal.htm

  • IO tested to sub-system ICD‘s

  • Configuration and data-taking tested

  • Monitoring functions/performance tested

  • Tested over

    • Frequency (16Mhz to 22 MHz, 20 MHz nominal)

    • Temperature (-40C to 55C)

    • TEM supply range (3.3V +/- 10%, 2.5V +/-10%)

  • One flight PCB TEM/TPS was loaded at SLAC with mostly parts from flight lots, including flight-lot ACTEL FPGA‘s

    • Passed tests from -40C to 55C over voltage and frequency

  • Three TEM and TPS flight modules assembled at flight-assembly vendor individually tested with CPT procedures, over temperature, passed tests

  • Requirements l.jpg

    • LAT-SS-00019 Specifications, Level 3 T&DF Subsystem Specification

    • LAT-SS-00284 Specifications, Level 4 Trigger

    • LAT-SS-00285 Specifications, Level 4 Dataflow

    • LAT-SS-00136 Specifications, Level 3 Power Supply System 

    • LAT-SS-00183 Specifications, Level 4 Power Supply System

    • LAT-SS-05522 Specifications, Level 5 TEM Specification

    • LAT-SS-01281 Specifications, Level 5 TPS ICD & Specification

    • LAT-SS-05533 Specifications, Level 5 TEM/TPS Specification

    Derived requirements l.jpg
    Derived Requirements

    • LAT-SS-05533 TEM/TPS lists 132 requirements for TEM/TPS package (most are from TEM LAT-SS-05522 (108) with extensions (24) to include TPS requirements for the TEM/TPS package)

    • Verification Matrix gives approach to verify each requirement

      • LAT-TD-05536

      • Lists verification method used

    • Assembly level at which requirement is verified

      • All TEM requirements at TEM assembly level (LAT-SS-05522)

      • ALL TPS requirements at TPS assembly level (LAT-SS-01281)

      • TEM/TPS package requirements at TEM/TPS assembly level (LAT-SS-05533)

    System performance l.jpg
    System Performance

    • Level 3 and level 4 DAQ and TRG and power-system requirements are met with a combination of DAQ modules (TEM/TPS, GASU, SIU, PDU, etc), since the DAQ and trigger and power system is comprised of several sub-system module types

      • Level 5 TEM/TPS requirements which are verified are derived from Level 3 and Level 4 DAQ and Trigger and Power system specifications (as noted in the L5 requirements doc)

      • Level 5 requirement doc includes derived requirement addressing

        • Functionality/performance

        • Power

        • Mass/C.G.

        • EMI/EMC

        • Environmental incl temperature and vibration

    Verification status l.jpg
    Verification Status

    • Engineering Module TEM/TPS

      • EM completed full environmental/functional test program with exception of EMI/EMC, mass, and C.G.

      • Demonstrated compliance with specifications

    Egse and test procedures l.jpg
    EGSE and Test-Procedures

    • EGSE for Functional/Performance Tests

      • Test-Stand documented in LAT-DS-04085

    • TEM (at TEM module level)

      • TEM Stray-Voltage-Test Procedure LAT-TD-04097

      • TEM Electrical Interface Continuity and Isolation Test procedure LAT-TD-03831

      • TEM Test-Procedure LPT LAT-TD-03415

    • TPS (at TPS module level)

      • TPS Stray-Voltage-Test Procedure LAT-TD-04098

      • TPS Electrical Interface Continuity and Isolation Test procedure LAT-TD-04099

      • TPS Test-Procedure LPT LAT-TD-01652

    • TEM/TPS (at combined unit level)

      • TEM/TPS Performance Test Procedure LAT-TD-01485

    Verification level module detail l.jpg
    Verification Level – Module Detail

    • Breakout of verification at TEM/TPS Module Level

      • Tests to be conducted after successful TRR

        • At assembly vendor

          • Functional test

          • Vibration

          • Functional test

          • Thermal cycle

          • Functional test

          • Pre-ship review

        • At SLAC

          • Incoming functional test

          • Mass properties

          • Thermal vacuum (in-situ testing)

          • EMI/EMC

          • Functional test

          • Review

          • Deliver to I&T

            • DAQ (out-going) / I&T (incoming) test combined

    • In the following slides first the work/tests at the assembly vendor is defined, then the work/tests at SLAC

    At assembly vendor l.jpg
    At Assembly Vendor

    • Test-Stand

      • Supplied by SLAC

      • Operated by SLAC engineers

    • Vibration facility at General Technology

      • Vibration test-procedure

        • http://www-glast.slac.stanford.edu/Elec_DAQ/Reviews/TEM-TRR/SK-282-SLAC-ESS-Procedure-11-03-04.pdf

          • Also includes

            • Thermal test procedures

            • Environmental chamber (thermal/vibration) description

        • SLAC engineers present for vibration tests

    • Work at assembly vendor specified in SOW

      • LAT-PS-02615

    Process test flow gtc assembly vendor l.jpg
    Process & Test Flow-GTC (Assembly Vendor)

    • See also in more detail in

    • http://www-glast.slac.stanford.edu/Elec_DAQ/Reviews/TEM-TRR/SK-282-SLAC-ESS-Procedure-11-03-04.pdf



    Stake HW



    Vibration Test

    Source inspection

    &EIDP review

    Functional test



    Final functional test

    Pack & ship to


    Gtc environmental test requirements l.jpg
    GTC Environmental Test Requirements

    Figure 1. Vibration Levels, Duration, and Spectra

    Manpower quality assurance at assembly vendor l.jpg
    Manpower & Quality Assurance at Assembly Vendor

    • Man-Power

      • Thermal and vibration test man-power provided by assembler

      • Test man-power supplied by SLAC

        • TEM: L. Sapozhnikov

        • TPS: D. Nelson

        • Test Support: J. Ludvik

      • Quality assurance: see below

    • Quality Assurance

      • Assembly QA by vendor as required by SOW

      • On-site, full-time LAT QA presence (P. Lujan)

      • Required changes to documentation at GTC is immediately documented on an NCMR and forwarded to SLAC for disposition

      • All outstanding changes to documents are incorporated and a new revision released into LAT DOCs prior to final inspection at each manufacturing/test level (CCA, Module, Top Assembly)

    At slac l.jpg
    At SLAC

    • After TEM/TPS module has been shipped from assembly vendor to SLAC:

    • Test-Stand

      • Supplied by SLAC, operated by SLAC engineers

    • Work flow

      • Functional Test

      • Mass Property

        • Plus C.G. measurement

      • Thermal Vacuum (in-situ testing)

      • Functional Test

      • Ship to EMI/EMC vendor

      • EMI/EMC test

      • Ship back to SLAC

      • Final functional test

      • Review

    Mass property l.jpg
    Mass Property

    • Mass properties checked at SLAC

      • Procedure in progress (done at SLAC Metrology)

      • Measured on EM (ref LAT-TD-00564)

        • TEM 2.710 kg

        • TPS 4.340 kg

        • TEM/TPS Total 7,050 kg

        • Allocation 12% above = 7,896 kg

      • C.G. to be measured for the qualification unit

    Thermal vacuum test l.jpg
    Thermal Vacuum Test

    • Thermal Vacuum facility in Building 33 at SLAC

      • Thermal Vacuum Chamber Operating Procedure LAT-TD-02541 (draft in review)

      • TEM/TPS Thermal Vacuum Test-Procedure LAT-TD-03631 ( draft in review)

      • Chamber was relocated to Building 33 from Central Lab

      • Needs earth-quake securing, in progress (by 1/10)

      • Needs recalibration (by 1/15)

    Qual and flight acceptance thermal vacuum test l.jpg
    Qual and Flight Acceptance Thermal Vacuum Test

    • See TEM/TPS Thermal Vacuum Test-Procedure LAT-TD-03631

    At < 10-5 Torr

    Manpower quality assurance at slac l.jpg
    Manpower & Quality Assurance at SLAC

    • Man-Power

      • Thermal Vacuum test (R. Williams, J. Ludvik)

      • Test man-power supplied by SLAC

        • TEM/TPS: L. Sapozhnikov, D. Nelson, J. Ludvik

      • Quality Assurance

        • LAT QA already present at SLAC

        • Required changes to documentation is immediately documented on an NCMR

    Emi emc test l.jpg
    EMI/EMC Test

    • Qualification Test (Conductive & Radiative)

      • Sub-contracted to CK Labs

      • Statement of Work: LAT-PS- 04568

        • CE102, CECN, CS102, CSCM, CS06, RE101, RE102, RS101, RS103

      • Detailed EMI/EMC procedure deliverable by vendor (in work)

        • Required to be reviewed/released prior to tests

      • SLAC engineers present at vendor for tests

      • Vendor supplies test-report

      • LAT QA at SLAC present for tests

    • Flight Acceptance Test (Conductive)

      • Performed at SLAC

      • Procedure in work

        • Required to be reviewed/released prior to tests

        • CE102, CS102

      • SLAC supplies test-report

      • LAT QA at SLAC present for tests

    Problem failure report configuration management l.jpg
    Problem Failure Report/ Configuration Management

    • Problem Failure Reporting

      • Via standard SLAC LAT Non-Conformance Reporting (NCR) System

        • NCR is entered

        • Reviewed/accepted/resolved

          • LAT engineering

          • LAT QC

        • Already exercised during past TEM/TPS assembly

    • Configuration Management

      • Via standard LATDOC system

    Planned tests l.jpg
    Planned Tests

    • Function/Performance Tests (LAT-TD-01485)

      • Verifies all requirements in LAT-SS-05533 except below

    • Thermal Vacuum Tests

      • Verifies performance/function over temperature

    • Mass/C.G.

      • Verifies/measures mass and C.G.

    • Vibrations test

      • Verifies vibration performance requirements

    • EMI/EMC

      • Verifies EMI/EMC performance

    Equipment calibration l.jpg
    Equipment Calibration

    • Electrical Functional Test Equipment

      • EGSE Test-Stand was certified by SLAC (will be posted on LAT EGSE web-site shortly)

    • EMI/EMC Test Equipment

      • Quantitative measurement equipment (sensors, antennas, etc) calibrated to NIST standards

      • Calibration performed annually

        • All item are (will be) within calibration at time of testing

    • Vibration Test Equipment

      • Accelerometers calibrated against a standard accelerometer traceable to NIST

      • Signal conditioners calibrated annually

    • TVAC Equipment

      • Thermocouples calibrated against standard temperature; calibrated prior to test

      • Thermocouple reader calibrated very 2 years

    Sub system safety l.jpg
    Sub-System Safety

    • EGSE

      • Safe-to-mate

      • Configuration control

      • Calibration verification

      • Functionality verification with “golden” TEM/TPS prior to test with flight hardware

    • MGSE

      • No custom MGSE

    • Environment

      • Temperature controlled in all test-facilities

      • Cleanliness actively controlled in clean-room; hardware bagged and purged when required

    • Training

      • ESD training completed

      • Clean room training completed

    Risk assessment l.jpg
    Risk Assessment

    • GTCC/GCCC TEM ASICs qualification program not completed at GSFC

      • No issue to-date

      • Test completion end of February

    • ACTEL FPGA’s

      • TEM’s use relatively new UMC fabrication-line space-qualified FPGA’s, no flight heritage

    • ESD sensitivity of ASIC’s higher than expected (200V, class 0)

      • Mate-demate and safe-to-mate are of concern when connecting/disconnecting TEM to front-end test (simulator) board. Keep cables as short as possible, apply handling taught in ESD-training, use de-ionizers

    • Schedule

      • Pressure to deliver flight hardware could force less than complete characterization and analysis of modules, could result in replicating a problem in follow-on modules

    • Performance

      • None known

    Test schedule l.jpg

    • Depending on assembly vendor, estimate as follows

      • 1/10/05: functional test of qual/TwrA/TwrB

      • 1/11-12/05: vibration test of qual/TwrA/TwrB

      • 1/13/05: functional test of qual/TwrA/TwrB

      • 1/14-15/05: TC of qual/TwrA/TwrB

      • 1/16/05: functional test of qual/TwrA/TwrB

      • 1/17-21: review/shipping

      • 1/24/05: functional test of qual/TwrA/TwrB

      • 1/25/05: mass, c.g. property test of qual/TwrA/TwrB

      • 1/26/05: TV start of TwrA, end Feb 2

      • 2/3/05: EMI/EMC of TwrA, end 2/5/05

      • 2/7/05: TV start of TwrB, end Feb 14

      • 2/15/05: EMI/EMC of TwrA, end 2/16/05

      • 2/15/05: TV start of Qual, end Feb 22

      • 2/22/05: EMI/EMC of Qual, end 3/8/05

    Status of main test procedures l.jpg
    Status of Main Test Procedures

    • TEM/TPS Performance Test Procedure LAT-TD-01485: released

    • Vibration & thermal cycle procedure

      • GT procedure SK-282-SLAC: approved

    • EMI/EMC

      • Qual

        • CKC Lab procedure: will be started 2nd week of January

      • Flight

        • Working together with TKR to get procedure finished by 3rd week of January (procedures are similar)

    • Thermal Vaccum

      • LAT-TD-03631, in draft form

    • All procedures must be released before respective test

    Issue concerns l.jpg
    Issue & Concerns

    • EMI tests

      • Concern passing qualification tests

    • Schedule

      • Tight

    • Qualification and Flight acceptance tests of flight TEM/TPS are performed with front-end simulators, not with actual CAL or TKR electronics

      • In the planning phase:

        • Taking qualification module after baseline environmental testing is completed

        • Connect it to CAL AFEE / TKR MCM electronics

        • Test over temperature (no vacuum required)

        • Need documentation

      • Possible for every flight modules: schedule issues