RD51 22/11/2011
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RD51 22/11/2011. Your PCB partner RD51 22/11/2011. Our factory and our customers. CERN. Products by sector. Telecommunication. Automotive. Medical. Information Technologies. Security products. Consumer products. Industrial Automation. Military equipments. THGEM. Products: Science.

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RD51 22/11/2011

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Rd51 22 11 2011

RD51 22/11/2011

Your PCBpartner RD51 22/11/2011


Rd51 22 11 2011

Our factory and our customers

CERN


Rd51 22 11 2011

Products by sector

Telecommunication

Automotive

Medical

Information Technologies

Security products

Consumer products

Industrial Automation

Military equipments

THGEM


Rd51 22 11 2011

Products: Science

CERN-ATLAS 2009

Thin-Gap Wire Chambers (TGC) of Weizmann Inst.

PCB-cathodes made by Print electronics


Rd51 22 11 2011

Founded: 1982

Employees: approximately 100 people

Production area: 3000 sq. meters

Annual turnover: 20M$, annual growth rate over 10% 

Customers: communication, electronics, defense, science…

Company policy:

Produce high Quality, high technology quick-turn PCBs at competitive prices.

High attention to Customer's demands

Commitment to continuous improvement and high-quality Customer's service.


Rd51 22 11 2011

National Standards

ISO 9001-2008

UL94-V0

IPC 600H,6011,6012.6013

ROHS-Compliant


Rd51 22 11 2011

Quality

Print Electronics quality system is based on and conforms to the Requirements of ISO 9001. Regular audits are performed by the standard Institute of Israel.

Customer can specify IPC-6012 for commercial boards.

As matter of Print Electronics company policy, customers are encouraged to consult with our quality assurance staff both at the design review stage and after production.


Rd51 22 11 2011

Engineering

Print electronics has computerized engineering system, enabling data processing, design-criteria evaluation and fabrication of manufacturing tools

Net list is checked against Gerber files using IPC-356.


Rd51 22 11 2011

  • Standard rigid boards

    Double-sided boards & Multilayer up to 20 layers.

  • Flexible and rigid-flex boards.

  • Controlled impedance circuits.

  • Blind and buried via hole

    HDI including Blind and buried VIAS

  • Heat sink- nickel plated copper

    or aluminum

  • Other products

Products


Rd51 22 11 2011

FLEX & RIGID-FLEX BOARD

Single and doubled-sided with and without stiffeners.

Materials: Kapton/ Acrylic or modified epoxy.

Finishes : as rigid boards.


Rd51 22 11 2011

Materials

GF(FR4)

GI (Polyimide)

Teflon

Rogers Family

Kapton

Other


Rd51 22 11 2011

Finishes

  • Direct plating- through hole metallization

  • Electroplated copper

  • Hot air leveling

  • Immersion gold (electroless)

  • Immersion tin (electroless)

  • Immersion Silver (electroless)

  • OSP

  • Electro plated nickel and gold

  • SMOBC – solder mask over bare copper

  • Via holed plugging

  • Via holes- capping


Rd51 22 11 2011

DESIGN FEATURE LIMITATIONS (STANDARD)

  • BOARD THICKNESS: 8~126 mil (0.2~6.0mm)

  • Copper foil :0.5oz, 1oz, 2oz, 3oz

  • working panel size:500X600mm(STD), 500x1000m.

  • Ability to produce a larger pcb.

  • Line width/space : 4/4 mil for internal and external layers.

  • Minimum Drill size (Finish): 0.15 mm.

  • Hole location tolerance ): 10 µ.

  • Routing tolerance: +/- 0.2mm

  • Final thickness tolerance: +/- 5%

  • Aspect ratio (hole-to-thickness) up to 1:10

  • silk screening of conductive and resistive inks, which are

  • deposited


Rd51 22 11 2011

DESIGN FEATURE LIMITATIONS

Non-Standard

It is the policy of Print Electronics to provide its customers

the maximum possible technical support and to this end,

we are prepared to discuss

the manufacture of non- standard boards.


Rd51 22 11 2011

ELECTRICAL TESTING

  • Net list electrical testing is performed as standard test

  • with no extra Charges.

  • The testing is performed using:

  • Mania -" bed of nails" 15-250volts

  • Emma- Test double sided flying probe tester- 3 Machines.

  • Test voltage up to 250v.


300x300mm thgem

300x300mm THGEM!

PCB Production Overview

Material Preparation

Customer requirements

Photo resist coating

Drill holes

Brush scrubbing

Etching

Ammonium persulfate

Resist Stripping

I.G Optionally

Curing

180 deg in air

Producer:

Print Electronics

De-smearing

Electrical Test

Oven 1 hour

Cleaning

This process can be replaced by Customer requirements


300x300 thgem

300x300 THGEM

THGEM geometry:

Hole dia.: 0.5 mm

Pitch: 1 mm

Thickness: 0.4 mm

Rim: 0.05 mm

Chemical etching/no mask

Ni/Au plating

Producer:

Print Electronics www.print-e.co.il


Rd51 22 11 2011

Pictures of our machines and equipment

AOI

Hot air leveling 5224

Inspecta

Inspecta


Rd51 22 11 2011

Pictures of our machines and equipment

CNC Drilling

Silk Printer

E-T

DI


Rd51 22 11 2011

Pictures of our machines and equipment

Immersion Silver

Polar stuck up & Impedance


Product by layer count

Product By layer Count

Products by number of layers


Sales by region

Sales by Region

Sales by Region


Rd51 22 11 2011

Address:

3 Eitan St. New Ind zone, Rishon Le-Zion 75650

ISRAEL

Tel: +972-3-9611168  

Fax: 972-3-9612232

www.print-e.co.il

[email protected]


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