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Pisa activities II part. Maria Giuseppina Bisogni Universita ’ di Pisa and INFN Sezione di Pisa. Outline. SiPM 4x4 matrices new results 8x8 matrices first results New DAQ system. SiPM Matrices and arrays readout.

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Pisa activities ii part

Pisa activities II part

Maria GiuseppinaBisogni

Universita’ di Pisa

and

INFN Sezionedi Pisa


Outline
Outline

  • SiPM 4x4 matrices new results

  • 8x8 matrices first results

  • New DAQ system


Sipm matrices and arrays readout
SiPM Matrices and arrays readout

  • Framework: development of a SiPM based PET system demonstrator based on

    • Matrices of SiPM pixels (FBK-irst)

    • Final target  8 x 8 ; Currently available  4 x 4

    • Front-End ASIC with trigger and digitization capabilities (Politecnico di Bari)

    • Final target  32 channel ; Currently available  8 channel

  • Meanwhile, readout of SiPM matrices employing different systems:

    • Readout system from LAL-Orsay (MAROC2 ASIC).

    • Readout system for PET applications employing the VA-TA ASICs from gamma medica-IDEAS (SiPM0)


Sipm 4x4 matrices from fbk irst

1 mm

4 mm

SiPM 4x4 matrices from FBK-irst

Composed of 16 (4x4) pixel elements in a common substrate

1 mm pixels in 1.06 mm pitch

  • Structure: n+-p-p -p+ optimized for blue light: Shallow n+ layer + specific antireflective coating.

  • Each pixel: 625 (25 x 25) microcells, 40mm x 40mm size.

  • Polysilicon quenching resistor.

  • Fill factor 44%.

Bonded SiPM array

SiPM array

SiPM pixel


4x4 matrices characterization
4x4 Matrices Characterization

  • Full characterization of first run performed at LAL, Orsay.

  • Excellent uniformity.

    • Breakdown voltage 30.5V ; svar= 0.5%

    • Gain @33V 1.46x106; svar= 4%

  • Mean dark rate @33V (DV=2.5V): 1.98 MHz

  • PDE @ 33V 8-10% from 420 to 680 nm wavelength.

Expected PDE >15% for the results shown here (run II and DV=4V)

N. Dinu et al.

Pixel 2008 workshop,

Fermilab, September 2008.


Readout maroc2 asic
Readout: MAROC2 ASIC

  • Developed at Laboratoire de l'Accelerateur Lineaire, Orsay.

  • 64 channels

  • low noise preamplifier w variable gain (6 bits)

  • Slow shaper (~20-150 ns, adjustable)

  • Fast shaper (15 ns) + 3 discriminators =>Trigger signal.

  • Designed for MAPMT – not optimized for SiPMs, but allows us to make the tests satisfactorily.


Readout test board
Readout: Test board

  • Altera FPGA

  • USB Port

  • ADC on the board.

  • ASIC calibration input.

  • LabVIEW software for data acquisition


Experimental results
Experimental Results

  • Results with pixilated crystals

    • Results matrix + crystal array

  • Results with continuous crystals

    • Results matrix + slab

  • Position determination

  • G. Llosa et al., IEEE- MIC2008, paper M02-1

  • Submitted to TNS on march 23


Position determination
Position determination

  • Coincidence with a 2nd detector: 1 mm x 1 mm x 1 mm crystal coupled to a SiPM

  • Source close to the matrix, far from 2nd detector

  • Move together source and 2nd detector.

2nd detector

30 mm

2 mm



Position determination crystal array
Position determination- crystal array

+ 1 mm

+ 2 mm

Hitmap for different source positions with crystal array

+ 0.5 mm

+ 1.5 mm


Position determination black slab
Position determination-black slab

  • Matrix + LYSO crystal 4mmx4mmx5mm painted black

  • Center of gravity algorithm – problems at the edges

  • Difficulties due to the small size of the devices


Position determination black slab1
Position determination-black slab

  • Hitmap

  • Algoritmo “center of gravity”



Statistics
Statistics

  • 12 wafers. Alcune di questi hanno un leakage alto, sintomo di dark count alto.

  • Ogni fetta contiene 12 matrici con read-out da un lato e 4 matrici con read-out da entrambe i lati

  • matrici con read-out da un lato:

    • 32 matrici con tutti elementi funzionanti

    • 22 con 1 elemento su 64 non funzionante

    • 8 con 2 elementi su 64 non funzionanti

  • matrici con read-out da 2 lati:

    • 10 matrici con tutti elementi funzionanti

    • 8 con 1 elemento su 64 non funzionante

    • 3 con 2 elementi su 64 non funzionanti

  • Wafers 9,10,11 a Perugia per IV test dopo il taglio

  • Wafers 12, 14, 15 a Pisa

  • Wafer 14: 16 linear array 1x8


Wafer 12 c4 all chns working
Wafer 12 C4 all chns working



Dasipm3 new set up
DASIPM3 new set-up

Designer A. Soldani

Servizio Progettazione Meccanica

INFN Pisa


New daq system
New DAQ System

B side 64 chns

A side 64 chns

Conceptual Design from Ing. Giovanni Franchi from AGE Scientific


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