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Global Molded Interconnect Devices Market revenue to exceed $629mn by 2023

View More @ http://bit.ly/2lZKcku<br>Molded interconnect devices enable integration of mechanical and electronic components and circuits directly on 3D (three-dimensional) plastic components. This helps in integrating chips elegantly with their assemblies, and also allows the antennae in smartphones or notebooks to be installed directly within the housing. This in turn facilitates in saving a great amount of space and miniaturization.<br>

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Global Molded Interconnect Devices Market revenue to exceed $629mn by 2023

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  1. Molded Interconnect Devices (MID) Market revenue worth USD 629.5 million by 2023: Global Market Insights Inc. Fuel Cell Market size worth $25.5bn by 2024

  2. Key Insights from Molded Interconnect Devices Market: • Global Molded Interconnect Devices Market share expected to reach USD 629.5 million by 2023, impelled by economization & high environmental compatibility. These devices are reshaping electrical and mechanical designs in many applications, particularly those in telecommunication and automotive sectors. • They lead to more effective low cost designs and are best options for replacing many parts of a circuit board product by integrating electrical& mechanical functions in a single product. • MID are cost effective for complex electromechanical functions and minimize the number of parts in circuit saving space & reducing assembly time. All these factors have contributed to the growth of the global industry during forecast period. High designing flexibility and functional density is predicted to fuel the demand and growth of the industry.

  3. Continued... • RTP Company had set its production unit in China in 2006. The new specialty thermoplastic compound facility provided technical support, product development and customer support to its clients in China along with increased support and service to international clients. • It was the second production unit establishment of the company in Asia after it first opened its manufacturing set up in Singapore in 2002. The firm has seven production units set up in three continents along with sales representatives in Asia Pacific, Europe and North America.

  4. China molded interconnect device market size, by application, 2012-2023 (USD Million)

  5. Browse Full Market Research Report of Molded Interconnect Devices (MID) Market @ http://bit.ly/24jYVkS Read our Insightful Blog @ http://bit.ly/2j8aZWs Request for a Sample of this Research report @ https://www.gminsights.com/request-sample/detail/424

  6. 360° Analysis • Application Analysis • Telecommunication application accounted for more than 60% of the global revenue in 2015, and is poised to grow at 13.6% CAGR from 2016 to 2023. The growth can be primarily attributed to increasing usage in antennas. Automotive is forecast to witness the fastest growth in the coming years at 14.8% CAGR, owing to increasing product adoption in brake-light fixtures. • Regional Analysis • Asia Pacific molded interconnect devices market size was evaluated at more than $175 million for 2015. The growth can be attributed to availability of low cost parts in countries like China. European industry is predicted to witness high growth due to presence of many automotive industries in the region. It was evaluated at $24 million for 2015 and is predicted to register CAGR of 12.2% during the forecast period. • Competitive Market Share • Key industry participants accumulating major molded interconnect device market share include Molex, TE Connectivity and Harting Technology Group. Other notable players are MacDermid Incorporated, LPKF Laser & Electronics, SelectConnect Technologies.

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