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iPod analyses

iPod analyses. Paul, Ethan, Niels. Casing : Plastic cover. Dual injection molding White cover Transparant layer on top of this Advantages Lower part cost Simplefies the production process and the fabrication quality is higher Multiple materials possible. Back case.

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iPod analyses

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  1. iPod analyses Paul, Ethan, Niels

  2. Casing: Plastic cover • Dualinjection molding • White cover • Transparant layeron top of this • Advantages • Lower part cost • Simplefies the productionprocess and the fabricationquality is higher • Multiple materialspossible

  3. Backcase Material: stainlesssteel Manufacturingprocess: pressed The back case of the iPod is made out of pressed stainless steel. A die for the top and bottom of the form are installed in a large hydraulic press. A flat piece of stainless steel is put into the press and pressed into shape. After the piece is pressed, the edges are trimmed and the ports for the audio jack, lock switch and cable connection are stamped out. And the back of the case is polished to a mirror finish. Hydraulicpress

  4. Hard drive • Metal casing • Stamped • Actual disk film • Sputteringdeposition • Logic board • Etched • Soldered Made by Toshiba for Apple

  5. Battery Lithium Polymer Thirdpartymanufacturer The battery is a third party item not manufactured by apple. It is a Lithium Polymer battery. The battery has thin flexible polymer pouches which store the energy to run the iPod. Lithium polymer technology is relatively light weight compared to other battery technologies and can be produced in a range of shapes, making this technology attractive to manufactures of small electronic devices such as music players, portable gaming devices and mobile phones.

  6. The motherboard Fibreglasslayers Wovenglass fibers (extrudedfrommoltenglass) Epoxy Fibreglasslayerimpregnatedwithepoxyresin Copper foil Copperlayers are applied and thenetchedwith thecircuit pattern (using extra layer of photosensitivematerial) Holes Holes drilled for soldering and mounting (multiple boards stacked) Soldering Multiple electroniccomponents are solderedonto the board, making contact with the copperfoil

  7. The screen Glass Cut / Polished Indium tin oxide Etched (photolithography) Polymerlayeretchedwithlinepattern Liquidcristals Injectedbetween inner polymerlayers Assemblybyglue

  8. The click wheel Plastic cover Polymer | Injectionmolded Ink | Printedsymbols Touch-sensitivemembrane PET sheets | Extruded, heated rolling Conductiveink (silver/copper/graphite) | Printed Multiple layersgluedtogether Mountingplate Metal | Stamped Holes drilled Assemblybyglue and mechanicalconnections

  9. Audio plug and Lock switch Material: Printed Circuit Board, plastic Manufacturing process: Printed Circuit Board, surface mounted components, Injection molded plastic, The audio interface had two main components. The primary piece is a printed circuit board which has the audio plug as well as the lock switch. Printed Circuit boards start as a piece of fiberglass. The copper circuit diagram is plated onto the board (an additive process). After the raw circuit board is produced, the various components such as capacitors, resistors, transistors and ICs are surface mounted to create the final functional circuit board. The plastic holder for this audio interface circuit board is a single part injection molded plastic.

  10. Limited run production • Pressedpartswouldbemilled • Cheaperforloweramounts • Injectedpartswouldbevacuumformed • Electronics insidewouldmaintain • Most parts are 3rd party parts

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