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RF&A/MS 1- page update

RF&A/MS 1- page update. Chapter scope illustrated above Subgroup updates: CMOS, Bipolar, III-V, HVMOS, Passive devices Common to all: Very few adjustments for 2012 7 productive X-TWG meetings: A&P, Interconnect, MEMS,ERD, PIDS, Test, Design Industry survey. CMOS.

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RF&A/MS 1- page update

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  1. RF&A/MS 1-page update • Chapter scope illustrated above • Subgroup updates: • CMOS, Bipolar, III-V, HVMOS, Passive devices • Common to all: Very few adjustments for 2012 • 7 productive X-TWG meetings: • A&P, Interconnect, MEMS,ERD, PIDS, Test, Design • Industry survey

  2. CMOS • Adopt TCAD based models following PIDS • More consistent values of analog device parameters • Reflect impact of local wiring on device parameters • Use interconnect roadmap information • Review FOMs to better reflect application requirements • Apply consistently across technologies: CMOS, bipolar, III-V Bipolar • Build the roadmap by simulation • Consider performance plateaus of 3-4 years duration • Improve the tie to application requirements in defining bipolar timing – Survey? iNEMI?

  3. III-V technologies • Review FOMs vs Technology, introduce enhancement mode FETs • Heterogeneous 3D integration Passive devices • Review FOMs vs application • Consider mm-wave applications • Consider new materials for voltage regulation applications HVMOS • Add Coff, Leakage current, Ambient /Junction Temperature • Expand scope to include 60V for automotive, 100V for MEMS actuation,…

  4. X-TWG Discussions • Assy & Pkg • Die-to-Die I/O, Substrate thickness & TSV, Redistribution layers, mm-wave antennae • Interconnect • thin metal parasitics, Thick metals, TSV, Current densities & E-M • MEMS • resonators, varactors, switches. –help develop RF FOMs. • ERD • Create table of Emerging Device X Functional Elements & FOMs • Perhaps a “micro”-workshop in Monterey

  5. X-TWG Discussions(2) • PIDS • Work to make nanoHub simulator be consistent with RFAMS needs • Test • Create a table of product test and device characterization needs by frequency band • Design • Review RFAMS Drivers & FOMS, • Include Automotive & Smart-grid drivers • SIP vsSOC discussion

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