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Layer0 Status Andrei Nomerotski 2/3/2005

Layer0 Status Andrei Nomerotski 2/3/2005. Outline Introduction Module Production Assembly of Layer0 Electronics System tests Schedule Mechanical and Installation issues will be covered in Bill Cooper’s talk. Overview.

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Layer0 Status Andrei Nomerotski 2/3/2005

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  1. Layer0 Status Andrei Nomerotski 2/3/2005 Outline • Introduction • Module Production • Assembly of Layer0 • Electronics • System tests • Schedule • Mechanical and Installation issues will be covered in Bill Cooper’s talk

  2. Overview • Layer0 will improve impact parameter resolution and mitigate degradation of performance caused by radiation damage to the SMT inner layers after 3-4 fb-1 • Important for tracking & b-tagging at high luminosity and for Bs mixing measurement • Layer0 uses R&D and experience of the DZero Run2B Silicon Upgrade • Many components prototyped in advance • Contributing institutions : Brown, CINVESTAV,Fermilab, Fresno, UIC, U.Indiana, U.Kansas, Kansas State, Louisiana Tech, U.Mississippi, MSU, Moscow State, NorthWestern, Rice, Stony Brook, U.Washington, Zurich

  3. Layout of Layer0 • 6-fold symmetry, total 48 modules, 96 SVX4 readout chips • 8 module types different in sensor and analog cable length Inside SMT

  4. Run2B Silicon Closeout • Run2B closeout is complete • Results on L2-5 stave and grounding R&D on Layer0 have been presented at several instrumentation conferences and published in proceedings. • NIM paper on the grounding R&D submitted • Though present Layer0 has a different design, the original Run2B Layer 0 allowed to prototype many aspects of the new design • CF support structure • Grounding/noise issues • Assembly issues Original Run2B support structure

  5. Layer 0 Module : Concept Sensor connected to hybrid with double-deck analog cable analog cable sensor hybrid

  6. Module Production • We are in production since mid January 2005 • Had PRR in Nov 2004 – very useful, implemented many recommendations of the committee • 8 types of modules, 6 of each type • Total 48 needed • Have parts for ~100 modules, plan to build 64 modules to select best 48 • During Sept-Dec 2004 built 14 preproduction modules • Most of them used for system tests • Will discuss below • Production components • Module assembly • Status and Production rate • Module QC

  7. Sensors • Pitch 71/81 micron, intermediate strip, 70/120 mm long: four types • Ordered from HM 120 sensors (4 x 30) in March 2004 • Received 112 in July and 8 in November 2004 • All IV, CV tested at Fermilab • 3 out of spec due to large DI/DV - used for prototypes • Only one(!) bad strip – pinhole on one of last 8 sensors • Out of 120 x 256 = 30720 strips • spec 1% • Four sensors fully probed at Stony Brook • Results consistent with HM • Four sensors and test structures irradiated at KSU • Measured at Stony Brook • Built two modules, see later

  8. Pitch Adapter • Two types of Pitch Adapter • Ordered in June 2004, received in Oct 2004 (Seigert) • Satisfactory bond strength (6.8+/- 0.8 g) and etching quality • Before unsuccessfully tried two other vendors • As backup ordered pitch adapters also from Advanced Thin Film Products • Provided samples with very good pull strengths • Received and evaluating first batches • Building a module with this PA

  9. Analog Cable • 8 types of cables required (4 pairs different in length) • 128 signal lines per cable • Max length 34 cm • Ordered in March 2004, delivered in July 2004 (Dyconex) • Total 200 cables • Testing : visual inspection – no bad channels

  10. Hybrid • 48 hybrids required • Had 267 tested SVX4.2B chips • Received 119 hybrids in Sept 2004 (Amitron) • 70 good, 49 “out of spec” • “out of spec” : cutoff edge off by 200 micron, can be used with modified fixtures • Mechanical tests at Fermilab and KU • Flatness < 80 micron, thickness < 800 micron (both better than spec) • Assembled 101 hybrids at NXGen and 10 at Fermilab • Yield (before burn-in) ~90% • 7 hybrids left unstuffed, 1 broken • >50% of hybrids are burnt-in (KU)

  11. Module Assembly Overview • Sensor and spacer are glued to kapton wrap-around circuit; Spacers are glued to top cable • Bottom cable is glued to hybrid and pitch adapter • SVX chip is wire bonded to the bottom cable • Top cable is glued to bottom cable. Wrapping of sensor is completed • Pitch adapter is glued to the sensor • Cables are wire bonded to the pitch adapter and SVX chip • Sensor is bonded to pitch adapter Day 1 Day 2 Day 3 Day 4

  12. Module Assembly Fixtures Stage 4 • A number of fixtures is required for all steps • Typically have double quantity of fixtures • Example below : Gluing of analog cable pitch adapter hybrid Stage 4 analog cable Bond profiles for analog cable

  13. Assembled Layer0 Module sensor pitch adapter SVX4 analog cable hybrid

  14. Production Rate and Module QC • Current status : 10 production modules assembled since Jan 13 • Current rate : 4 modules per week • Have all fixtures to boost production to 8 modules per week • Module QC • Mechanical inspections • I-V curve • Burn-in : 72 hours with 200V bias • Encapsulation of HV and GND bonds • Another short burn-in before storage • Results analyzed and put into the module database • So far three modules with 0 defects, two with 1 defect, one with many, others still need to be tested • Additional module testing (done for a few modules) • Several modules underwent long-term tests in April-July 2004 • Built and tested two modules with irradiated sensors (~10 fb-1 equivalent) • Thermocycling • Laser tests

  15. V-I plots • Range 0-300V, typically current ~ 50-150 nA, correlates well with sensor current

  16. Examples of plots from hybrid burn-ins :pedestals L0 - 202

  17. Tests of Irradiated Modules : Shot Noise • Good opportunity to check that we understand irradiated modules • Normally stored in the freezer - warmed up to increase current • Current vs. Temperature dependence is in agreement with expectations • Minimal increase of noise wrt non-irradiated module at operational T • Observed rising contribution from shot noise with rising T • Shot noise scales as sqrt(Integration time x Current) • ~1400 e for 396 ns integration time at T=+10oC : agrees with calculations

  18. Support Structure Assembly Fixture Collar North North Modules Holders CF Support Structure South Modules Holders Collar South Support Mount North Base Plate 90”x20” Middle Support CF Support Structure Support Mount South Rotation Control The fixture will be mounted on CMM Table Lab C at SiDET

  19. Sensor & Hybrid Holders • Each module after mounting is tested electrically

  20. Layer0 Electronics • Layer0 will use 48 readout channels now used by Outer H-disks • Readout chain needs to be interfaced to Run2A SMT electronics • New wrt Run2A : Hybrid-Jumper Cable-Junction Card-Twisted Pair Cable-Adapter Card • Adapter Card isolates Layer0 ground and detector ground • Needed because South is shorted to North by the support structure • SVX4 needs to coexist with SVX2 • Status of Cables • Digital Jumper Cables (KSU & KU) • Production cables ordered from Compunetics in Jan 2005 • Have reduced thickness to 0.15 mm • Twisted Pair Cable (KU) – ready

  21. Junction Card • Two channels per card • Cable routing and dressing prototyped with mockup • Design finalized, will be ordered in Feb

  22. Adapter Card • Four channel per card • Ground isolation tests done in Sept-Oct 2004 • Had good results with and without isolation • Plan to reproduce them with the prototype support structure • Design finalized, will be ordered in Feb

  23. System Tests • Effects of possible interference with support structure and between modules – addressed with setups at Sidet • Readout of modules installed on the support structure • Readout of large number of channels, in the limit full Layer0 • Testing at conditions similar to operations – addressed with setups at DZero • Use real DAQ with Trigger Framework • Preparation and exercising of online software • Cooling system / Thermocycling

  24. Prototype Support Structure • CF support structure for Layer0 implements new grounding approach: laminated ground mesh covering all surface – crucial design feature ensuring low inductance path for GND and hence low noise • Prototype is electrically and mechanically the same as final structure • Have 8 L0 modules mounted on the prototype support structure since Nov 2004 • Simultaneous readout through simplified chain modules installed on the support structure

  25. Results with Prototype Structure • Low total and random noise (no Faraday cage) • the grounding scheme works well • Observe pedestal shapes at fast SVX4 settings • Caused by digital-to-analog couplings between hybrid and analog cable below the hybrid Noise ~ 1500 e S(MIP) / N ~ 15:1 Coherent noise very small Noise for 4 modules hybrid cable sensor

  26. Pedestal Shapes • Pedestal peak-to-peak difference • At fast preamp settings : 6-7 ADC counts • At slow settings : 2 ADC counts - acceptable • Other remedies • It looks that most of pickup comes from clock signals – will have provisions to regulate clock amplitude at AC • Have a spacer between hybrid and analog cable • 0.2 mm spacer significantly reduces effect • More testing in progress Pedestals for 4 modules fast preamp settings 10 ADC counts slow preamp settings 10 ADC counts

  27. Plans for system tests at Sidet • Feb 2005 : Read out 10 modules on the support structure through Junction Card-Twisted Pair Cable-Adapter Card • Use prototype JumperCable-JC-TPC-AC • Mar 2005 : Read out the 10 modules though full chain (above + Sequencer + VRB) • May 2005 : Expand full readout to 48 channels • June 2005 : Read out full Layer0 • Use production JC-JC-TPC-AC • Also : thermocycle prototype support structure with 10 modules (Feb 2005)

  28. System tests at DZero • Installed two L0 modules, two hybrids, WIENER LV PS and power distribution during the 2004 shutdown • Successfully read out in special runs • Data is being analyzed, noise looks reasonable • However these SVX4 strings are not yet in operations, waiting for acceptable SEQC firmware • Have a stand at DZero with IB, SEQ and VRB crates connected to Trigger Framework to debug firmware • These SVX4 strings will be used • To develop all slow control and monitoring online software • Exercise offline software • Measure S/N from real particles in the modules 4 ch. Adapter Card at HorseShoe

  29. Other Integration Issues • Some remapping choreography of Layer0/Inner H-disks/Outer H-disk readout and HV channels will be required during 2005 shutdown • Isolated LV Supply (WIENER) • Provides SVX4 power • PS and heavy power cabling installed during 2004 shutdown • Power distribution to Adapter Cards will be installed during 2005 shutdown • High Voltage Supplies • Located outside of Collision Hall (in MCH2) • Install more channels of Bira supplies • Install new fanout box rated to 700 V • Integrate new components to • Slow Controls • Interlock • Online GUIs

  30. Schedule • Hybrid production essentially done (1/25/2005) • Junction/Adapter Cards production ends on 3/18/2005 • Module production ends on 4/22/2005 • Start module installation 4/1/2005 • Layer0 ready for system tests at Sidet on 5/11/2005 • Layer0 ready to go to DZero on 7/19/2005 Main schedule risks are in • Design and preparation of assembly fixturing • Full system tests

  31. Summary • Good progress on all fronts • All parts in hand - started module production in January 2005 • Layer0 assembly to start in April 2005 • Detector should be ready to go to DZero in July 2005 • Paying attention to system tests – so far all looks under control

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