Atlas liquid argon calorimeter read out driver board status and plans
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ATLAS Liquid Argon Calorimeter: Read Out Driver Board status and plans. Imma Riu Université de Genève Rencontres de Bossey 12 July 2002. Outline: Introduction The LArgon readout architecture ROD system description Status and plans Conclusions. Introduction. ATLAS detector.

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ATLAS Liquid Argon Calorimeter: Read Out Driver Board status and plans

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Atlas liquid argon calorimeter read out driver board status and plans

ATLAS Liquid Argon Calorimeter:Read Out Driver Board status and plans

Imma Riu

Université de Genève

Rencontres de Bossey

12 July 2002

  • Outline:

    • Introduction

    • The LArgon readout architecture

    • ROD system description

    • Status and plans

    • Conclusions

ATLAS LArgon calorimeter: ROD Board status and plans


Introduction

Introduction

ATLAS detector

  • The ATLAS Liquid Argon calorimeter is divided into:

    • Barrel calorimeter (EMB)

    • Hadronic endcaps (HEC)

    • Electromagnetic endcaps (EMEC)

    • Forward calorimeter (FCAL)

  • In total, around 190 000 channels are to be read out.

ATLAS LArgon calorimeter: ROD Board status and plans


Atlas liquid argon calorimeter read out driver board status and plans

EM Endcap prototype

ATLAS LArgon calorimeter: ROD Board status and plans


The challenge of the electronics

The challenge of the electronics

  • Large dynamic energy range: [50 MeV - 3TeV] 16 bits !

  • The bunch crossing (BX) rate at LHC is 40 MHz (each 25 ns):

    For a signal of 600 ns, the pile-up takes up to 24 BXs.

  • Required relative energy resolution: ~ 10% / E:

    Pile-up and electronic noise should be minimized.

    Good calibration of the electronics response.

Noise dependence on

luminosity and peak time

Signal after shaping

Different

BXs

Detector

signal shape

ATLAS LArgon calorimeter: ROD Board status and plans


Atlas liquid argon calorimeter read out driver board status and plans

Detector:

Radiation

environment

FEB

FEB

FEB

FEB

FEB

FEB

FEB

FEB

FEB

FEB

FEB

FEB

FEB

FEB

FEB

FEB

USA15:

Radiation free

ROD

ROD

ROD

ROD

ROD

ROD

ROD

ROD

ROD

ROD

The LArgon Read Out Architecture

HEC

EMEC

FCAL

EM Barrel

EMEC

HEC

FCAL

5

3

6

1

2

4

5

6

FEB

FEB

FEB

Front End Boards

FEB

Read Out Driver

Boards

DAQ

ATLAS LArgon calorimeter: ROD Board status and plans


Feb and rod boards functionality

FEB and ROD boards functionality

Located in the detector

Located in USA15

room

FEB

FEB

FEB

FEB

FEB

ROD

FEB

FEB

FEB

8

optical fiber

1.6 Gbit/s ~100m

100 kHz event rate

  • Radiation tolerant board.

  • 128 channels / FEB.

  • Fast signal shaping (~ 50 ns).

  • Five digitized points (12 bits) using

    three gains in the ratio 1/10/100.

  • Gain selection (2 bits).

  • LArgon needs ~1600 FEBs.

  • Event processing time  10s.

  • Computation of time, energy and shape

    quality flag (2).

  • Use of optimal filtering algorithm.

  • Use of Digital Signal Processors (DSP).

  • Generation of the ‘busy’ signal.

  • LArgon needs ~200 RODs.

ATLAS LArgon calorimeter: ROD Board status and plans


Rod physical description

  • ROD module:

    • ROD mother board (MB)

      • Uses G-link chips for deserializing the data from the optical fiber.

      • Includes TTCrx ASIC which provides Trigger-Time-Control information:

        LHC clock, event and bunch crossing identifiers, ATLAS trigger type.

      • Uses SDRAMs for storing raw data (for online histograms)

      • Uses programmable chips (FPGA).

    • 4 processing units (PU) mounted on top of the ROD mother board.

      • Include Digital Signal Processors (DSP) chips.

      • 2 DSP / PU. [1 DSP per FEB]

      • Use FPGA chips as well.

Nevis

Labs

ROD physical description

  • ROD system:

    • Input:8 optical fibers with FEB raw data (16 bits @ 80 MHz)

    • Output:4 optical fibers with ROD calculations (32 bits @ 40 MHz)

    • It consists of:

      • 9U VME64x board: ROD module (14 RODs / crate at maximum)

      • 9U VME64x board: Transition Module

ATLAS LArgon calorimeter: ROD Board status and plans


Atlas liquid argon calorimeter read out driver board status and plans

Read Out Driver Board

VME

control

Processing

Unit

Glink

SDRAM

receiver

Output

Controller

staging

FPGA

Glink

Ser

receiver

Processing

Unit

Glink

receiver

SDRAM

staging

FPGA

Output

Controller

Glink

Ser

receiver

Processing

Unit

Glink

receiver

SDRAM

staging

FPGA

Output

Controller

Glink

Ser

receiver

Processing

Unit

Glink

receiver

SDRAM

staging

FPGA

Output

Controller

TTC

Glink

receiver

Ser

ATLAS LArgon calorimeter: ROD Board status and plans


Atlas liquid argon calorimeter read out driver board status and plans

Processing Unit

FIFO

Input

FPGA

DSP

Output

FPGA

VME

TTC

Input

FPGA

DSP

FIFO

ATLAS LArgon calorimeter: ROD Board status and plans


Atlas liquid argon calorimeter read out driver board status and plans

ROD at the beginning of LHC

VME

control

Processing

Unit

Glink

SDRAM

receiver

Output

Controller

staging

FPGA

Glink

Ser

receiver

Glink

receiver

SDRAM

staging

FPGA

Output

Controller

Glink

Ser

receiver

Processing

Unit

Glink

receiver

SDRAM

staging

FPGA

Output

Controller

Glink

Ser

receiver

Glink

receiver

SDRAM

staging

FPGA

Output

Controller

TTC

Glink

receiver

Ser

ATLAS LArgon calorimeter: ROD Board status and plans


Atlas liquid argon calorimeter read out driver board status and plans

VME

control

Processing

Unit

Glink

SDRAM

receiver

Output

Controller

staging

FPGA

Glink

Ser

receiver

Processing

Unit

Glink

receiver

SDRAM

staging

FPGA

Output

Controller

Glink

Ser

receiver

Processing

Unit

Glink

receiver

SDRAM

staging

FPGA

Output

Controller

Glink

Ser

receiver

Processing

Unit

Glink

receiver

SDRAM

staging

FPGA

Output

Controller

TTC

Glink

receiver

Ser

Status of the ROD

ATLAS LArgon calorimeter: ROD Board status and plans


Atlas liquid argon calorimeter read out driver board status and plans

Processing Unit

FIFO

Input

FPGA

DSP

Output

FPGA

VME

TTC

Input

FPGA

DSP

FIFO

ATLAS LArgon calorimeter: ROD Board status and plans


Delicate points

bga chip

Delicate points

  • Cooling of G-link chips:

    • 35 ºC at maximum for 80 MHz clock frequency.

    • Cooling with water or air are being studied.

  • For money saving, ‘staging’ is implemented:

    • Half of the PUs will be used at the beginning of LHC.

    • The DSP processes 128*2 channels.

  • PCB routing with multiple ball-grid-array (bga) chips.

  • The output goes through serializer/de-serializer at 280 MHz.

ATLAS LArgon calorimeter: ROD Board status and plans


Past experience in geneva

Built in 2000.

Board frequency: 40 MHz.

2 optical receivers as mezzanine in TM.

1 Output Slink in the Transition Module.

4 PUs: 1 DSP/PU, 64 channels/DSP .

Used in Test Beams and for tests of PU.

To be built in 2002.

Parts of the board at 80 MHz.

8 optical links integrated in the ROD.

4 Outputs Slink in the TM.

4 PUs: 2 DSP/PU, 128 channels/DSP.

Need of four times

less ROD modules.

Sending of data serialized LVDS at 280 MHz to the TM. (test in Geneva ok)

Addition of the staging FPGAs.

Use of ball-grid-array chips.

Past experience in Geneva

ROD demonstrator

ROD prototype

Annie,

Daniel,

Ilias,

Lorenzo

ATLAS LArgon calorimeter: ROD Board status and plans


Atlas liquid argon calorimeter read out driver board status and plans

ROD Demo

Transition Module

PU 1

Input Link

Receiver

PU 2

Input Link

Receiver

PU 3

Output Link

Transmitter

PU 4

ATLAS LArgon calorimeter: ROD Board status and plans


Plans and milestones

Plans and milestones

  • Decision of the DSP chip: Done (DSP TI 6414)

  • ROD preliminary design review: September 2002 (planned by Jan. 2002)

  • Prototype production: Oct/Nov 2002

  • Pre-series production: May 2003

  • PRR (production readiness review) : Oct/Nov 2003 (planned by April 2003)

  • Series production: January 2004

ATLAS LArgon calorimeter: ROD Board status and plans


Geneva rod group

Geneva ROD group

  • Manpower:

    • Engineers:

      • Daniel La Marra: engineer responsible of the ROD module

      • Annie Leger

    • Physicists:

      • Alain Blondel: project leader

      • Imma Riu: physicist responsible

  • Present responsibility:

    • To finish the ROD mass production by 2004.

  • Possible next steps:

    • Take part on the commissioning of the system.

    • Participate in the DAQ system for the RODs.

ATLAS LArgon calorimeter: ROD Board status and plans


Conclusions

Conclusions

  • The ROD project is ongoing well in Geneva with the collaboration of LAPP and Nevis.

  • The Geneva group is getting ready for the preliminary design review in September 2002: finishing schematics and writing documentation.

  • The ROD mother board mass production is expected to be finished in 2004.

ATLAS LArgon calorimeter: ROD Board status and plans


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