IMAPS Global Business Council Roadmap Process “The Road Ahead” The GBC Roadmap Team This Roadmap Process presentation was prepared by these members of the IMAPS Global Business Council & National Technology Council: Steve Adamson ([email protected])
“The Road Ahead”
IMAPS addresses the Semiconductor Packaging needs of this space.
A “cross-cut” matrix ensures feedback between the various groups.
Market Size for Materials = Market Opportunities for IMAPS members.
Source: SEMI Industry Research and Statistics and TechSearch International, November 2005
This forecast was supplied courtesy of SEMI & Techsearch International. The full report is available from SEMI’s web catalog at www.semi.org .
The complete chapter can be downloaded from the ITRS website: http://www.itrs.net/Common/2005ITRS/AP2005.pdf
The following slides contain key excerpts.
All of these topics – and those on the next slide – are comprehensively covered in the ITRS Roadmap.
This presentation will focus on the key challenges only.
Development work is required for finer pitch in-line wire bond & area array flip chip.
SoC and SiP Comparison for Cost per Function and Time to Market vs. Complexity
The number of stacked die and the number of die in a SiP are challenges.
Long term challenge for extreme thin packages.
It is very challenging to maintain packaging reliability with strong chip-to-package interaction resulting from new materials, new processes, and new interconnect features at the Si level.
New failure modes caused by new materials needed to meet environmental and performance requirements, result in significant challenges in field reliability prediction based on accelerated lab testing for broad product application field requirements.
The iNEMI Roadmap is only available for download to TWG members or on-line purchase.
The following slides contain key excerpts from the 2007 Roadmap Update-in-progess.
The ITRS Roadmap segments issues into those that are Near Term & affect Wafer Nodes ≥ 32 nm and those that are Long Term & affect Wafer Nodes <32 nm.