Cooling of chips in circuit boards
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Cooling of Chips in Circuit Boards Problem One way to cool chips mounted on circuit boards is to encapsulate the boards in metal frames that provide efficient pathways for conduction to supporting cold plates.

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Presentation Transcript

Problem l.jpg
Problem

  • One way to cool chips mounted on circuit boards is to encapsulate the boards in metal frames that provide efficient pathways for conduction to supporting cold plates.

  • Heat Generated by the chips is then dissipated by transfer to water flowing through passages drilled in the plates.


Design specifications l.jpg
Design/Specifications

Coolant Passages

water

AIR

Cold Plate

T = 32 Celsius

Circuit Board Frames. T=47 Celsius, N=10

Circuit Board Containing Chips


Assumptions l.jpg
Assumptions

  • Isothermal cold plate

  • All heated generated by circuit boards is dissipated by cold plates

  • Circuit boards may be represented as isothermal at an average surface temperature.

  • Air flow over circuit boards approximates that over a flat plate in parallel flow.

  • Part A: To find how much heat is dissipated by the circuit boards

  • Part B: To find how much of the heat generated by the circuit boards is transferred to air


Part a l.jpg
Part A

With a total of N = 10 passages, the total heat dissipation is

50.2 kW


Part b l.jpg
Part B

To find how much of the heat generated by the circuit boards is transferred to air.

2,670W 9.5 percent(low) Heat Transfer to the Air


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Results

  • Air not effect for Cooling Microchips

  • The cooling capacity of the cold plates far exceeds that of the air flow. However, the challenge would be one of efficiently transferring such a large amount of energy to the cold plates without incurring excessive temperatures on the circuit boards



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