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DOE Review 4.1.7 DAQ

Gamma-ray Large Area Space Telescope. DOE Review 4.1.7 DAQ. GLAST Large Area Telescope: G. Haller SLAC haller@slac.stanford.edu (650) 926-4257. Contents. Overview - Production & Testing - Schedule TEM/TPS Flight Units PDU Flight Units GASU Flight Units SIU/EPU Flight Units Testbed

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DOE Review 4.1.7 DAQ

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  1. Gamma-ray Large Area Space Telescope DOE Review 4.1.7 DAQ GLAST Large Area Telescope: G. Haller SLAC haller@slac.stanford.edu (650) 926-4257

  2. Contents • Overview - Production & Testing - Schedule • TEM/TPS Flight Units • PDU Flight Units • GASU Flight Units • SIU/EPU Flight Units • Testbed • Installation & Test Support • Budget

  3. LAT Electronics TKR Front-End Electronics (MCM) ACD Front-End Electronics (FREE) TKR CAL Front-End Electronics (AFEE) 16 Tower Electronics Modules & Tower Power Supplies CAL Global-Trigger/ACD-EM/Signal-Distribution Unit* 3 Event-Processor Units (EPU) (2 + 1 spare) • Event processing CPU • LAT Communication Board • SIB Spacecraft Interface Units (SIU)* • Storage Interface Board (SIB): Spacecraft interface, control & telemetry • LAT control CPU • LAT Communication Board (LCB): LAT command and data interface Power-Distribution Unit (PDU)* • Spacecraft interface, power • LAT power distribution • LAT health monitoring * Primary & Secondary Units shown in one chassis

  4. TEM/TPS Mounted to CAL TKR not shown LAT GRID with 16 CAL/TEM/TPS Modules CAL TEM TPS

  5. Tower Electronics Module/Tower Power Supply • Tower Electronics Module: Main DAQ module, one on each tower • Controls and reads out data from TKR MCM and CAL AFEE front-end electronics • Assembles CAL and TKR event fragments to tower event • Tower Power Supply module, one on each tower • Input 28V • Generates low-noise voltages for • TKR (2.65V analog, 2.65V Digital) • CAL (3.3V analog, 3.3V digital) • TEM (3.3V and 2.5V digital) • TKR Bias (20V-140V programmable) • CAL (20V to 90V programmable) Tower Electronics Module (TEM) before coating/staking TEM Tower Power Supply (TPS) before coating/staking Shown upside-down TPS

  6. TEM/TPS Status & Schedule • Status • Three Flight Tower-Electronics Modules/Tower Power Supplies received • Fully assembled • Thermal-cycled • Vibration tested (one of them to qualification levels) • One unit finished thermal-vacuum testing • One unit in thermal-vacuum testing • Both units finished EMI/EMC testing • No issues/problems • Balance of 19 TEM/TPS in surface-mount assembly at vendor • Schedule • 2/17/05 First TEM/TPS to I&T • 2/25/05 Second TEM/TPS to I&T • 4/1/05 Third TEM/TPS to I&T • 4/22/05 Fourth TEM/TPS to I&T • One week lag between delivery of consecutive assemblies • 7/26/05 Last TEM/TPS to I&T

  7. PDU & GASU Mounted on LAT GASU PDU

  8. Power Distribution Module (PDU) EM PDU enclosure with primary/redundant PDU circuit cards, no coating/staking • Primary and Redundant Circuits in one Enclosure • Receives Primary and Redundant 28-V from spacecraft • Each, primary and redundant PDU can select between primary and redundant spacecraft power • Filters 28V • Turns on/off 28V to 16 towers and 3 EPU’s under program control • Protects PDU and down-stream circuits from over-current and under-voltage • Over-current via poly-switches • Under-voltage via custom circuit in each power-on branch • Receives command/clock from GASU • Digitizes voltages/temperatures from > 150 sources • Includes temperatures from radiators, GRID; used for thermal control • Reads back data to SIU via GASU • Provides PDU DAQ voltage and temperature analog data to spacecraft for monitoring

  9. PDU Status and Schedule • Status • Design/documentation complete • Enclosures fabricated • All parts received (except recalled International Rectifier regulator, due end of February) • Assembly contract awarded • All parts kitted and audited by assembly vendor • Assembly started • Schedule for Flight Unit • 5/15/05 Precoat PDU assembly ready for electrical test • 5/30/05 Complete assembly ready for environmental test • 7/1/05 Flight PDU to I&T

  10. GASU PDU enclosure with primary/redundant PDU circuit cards, no coating/staking • Primary and Redundant Circuits in one Enclosure • Contains two types of circuit card assemblies • GASU Power Supply CCA • GASU DAQ Board CCA • GASU Power Supply • Receives 28-V supply voltages for • Primary and redundant DAQ board, generates 3.3V and 2.5v • ACD FREE cards • Filtering for 28-V • 3.3V regulation • GASU DAQ Board • Contains 9 FPGA’s • Includes Command Response Unit, Fan-out and fan-in of commanding to 16 TEMs, PDU, EPU’s, ACD • Includes Global Trigger Logic • Includes LAT Event-Builder Logic • Includes command/control/read-back for ACD sub-system • Includes power-control for ACD FREE Boards

  11. GASU Status and Schedule • Status • Design/documentation complete • Enclosures fabricated • All components/parts received • Assembly contract awarded • Parts being kitted • Flight assembly to start 3/10/05 • Schedule for Flight Unit • 5/20/05 Precoat GASU assembly ready for electrical test • 6/10/05 Complete assembly ready for environmental test • 7/13/05 Flight GASU to I&T

  12. SIU/EPU • Spacecraft Interface Unit (SIU) • Event Processor Unit (EPU) • Difference is boot code loaded into RAD750 CPU Enclosure LCB Backplane SIB Power-Supply CPU

  13. SIU/EPU Status and Schedule • Status • Design/documentation complete • Enclosures fabricated • All components/parts received except BAE RAD750 CPU • Uses recalled International Rectifier regulator • Boards to be sent back to BAE • Reworked boards expected 3 weeks after they receive components; June 05 • Assembly contract out for RFP • Schedule • 6/1/05 Precoat cCPI boards ready for electrical test • 7/28/05 Complete assembly ready for environmental test • 8/19/05 First Flight SIU/EPU to I&T • 8/24/05 Second flight SIU/EPU to I&T • 8/27/05 Third flight SIU/EPU to I&T • 8/30/05 Fourth flight SIU/EPU to I&T • 9/2/05 Last flight SIU/EPU to I&T

  14. Testbed and I&T Support • Testbed • Upgrade of engineering modules to reflect flight designs • Scheduled over next 6 months • Labor to support upgrade • Labor to support testing of electronics and flight software using data generated via front-end simulator boards • Labor to support test-stands for flight electronics qualification and acceptance testing • I&T Support • Design/fabrication/testing of virtual spacecraft simulator for I&T • Support for integration and testing of DAQ modules on instrument

  15. Management & EGSE • Management • Sub-system manager • Technical writer • Support for environmental test • Travel • Computer for test-stations (HW & SW) maintenance • Shipping charges for flight hardware • EGSE (Electrical Ground Support Equipment) • Maintenance/repair of test-stations supplied to sub-systems

  16. Costs & Commits Explanation: Dataflow Electronics = TEM/TPS Flight Units ACD GASU FU & GLT FU = GASU Power Conditioning = PDU SIU & LAT Communication Card = SIU

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