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FLEX status

FLEX status. SVD2.5 FLEX for APV25 Print denshi The first lots were made at the end of Dec. Many shorts ->the are trying to optimize etching condition New company and method Taiyo kogyo (Wakayama) Size of Company > Print denshi Test has been done Semi-Additive method

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FLEX status

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  1. FLEX status • SVD2.5 FLEX for APV25 • Print denshi • The first lots were made at the end of Dec. • Many shorts ->the are trying to optimize etching condition • New company and method Taiyo kogyo (Wakayama) • Size of Company > Print denshi • Test has been done • Semi-Additive method • Meeting at KEK on Dec 21,2005 • With KEK electronics group and Rin-ei company.

  2. Design (L2ZF)

  3. Design (L2PF, L2ZF)

  4. Additive method Photo resist • Good way to make precise pattern • Few company are available Cu base Photo print plating Soft etching

  5. Results • They tried to optimize many conditions • Photomask print • Plating (building lines) • Washing to removing DFR (dry film resist) • Soft etching • Results • Many shorts…

  6. Lines (50mm)

  7. Around pad

  8. Resistance measurement • Line resistance • ～6cm => ～10W (t=10～15mm, enough small) Shortest line

  9. Summary • With Taiyo company (Their work is more systematic comparing with Print-denshi) • As First lot • Many shorts occurred • Reason • DFR (dry file resist) remained • Too thick plating • I can’t conclude which method are better as of now • They propose to do more test without additional payment • Much depend on Photo-resist condition • Glass mask? • Optimize plating thickness • End of January? • Print Denshi (etching method) • The first lot for APV • Many shorts • Trying again • I have not receive any sample yet • I am pushing them

  10. Additive method Photo resist Cu base Photo print plating Soft etching

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