Gigabit ethernet ieee 802 3z the choice of a new generation design presentation
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Gigabit Ethernet – IEEE 802.3z The Choice of a New Generation Design Presentation. ECE 4006c G2- Gigabit Ethernet Intel/Agilent TX Javier Alvarez, gte006r Astou Thiongane, gt3083a Ebrima Kujabi, gte212s. Objectives. General Use MAXIM 3287 Kit Board Specs Basic Features

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Gigabit Ethernet – IEEE 802.3z The Choice of a New Generation Design Presentation

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Gigabit ethernet ieee 802 3z the choice of a new generation design presentation

Gigabit Ethernet – IEEE 802.3zThe Choice of a New GenerationDesign Presentation

ECE 4006c

G2- Gigabit Ethernet Intel/Agilent TX

Javier Alvarez, gte006r

Astou Thiongane, gt3083a

Ebrima Kujabi, gte212s


Objectives

Objectives

  • General Use

    • MAXIM 3287 Kit

  • Board Specs

    • Basic Features

    • Component Analysis

    • Safety Features

    • Issues with Laser Mounting

  • Testing Procedures

  • Design Board


General use of maxim board

General Use of MAXIM board

  • Remove transceiver Module from Intel PRO/1000 Board.

  • Replace transmitter with MAXIM 3287

    • Optical Transmitter Module


Board specs

Board Specs

  • Basic Features

    • Optimized operation at 1.25 Gbps.

    • Supports a current modulation up to 30mA.

    • Deterministic Jitter of approx. 22 ps.

    • Requires a 3.3 V to 5V power supply.


Component analysis

Component Analysis

  • Differential Input & Output

    • Eliminates noise in channel

  • Reference Voltage

    • Used for programming a laser bias current in VCSEL applications (~0.8mA)

  • Monitor Diode

    • Monitors Laser Current

    • Not supported by board


Component analysis cont d

Component Analysis (Cont’d)

  • Current Modulation Control (Pin 15)

  • Temperature Coefficient Control (Pin 16)


Laser mounting

Laser Mounting

  • VCSEL Mounting

    • Common-Cathode Configuration

  • Avoiding Laser Ringing or Overshooting

    • Reduce Length of Leads

    • Typical Package Leads have inductances of 25nH/in.


Common cathode configuration

Common-Cathode Configuration


Safety features

Safety Features

  • Shutdown Driver Output (SHDNDRV)

  • Power-On Reset (POR)

    • Resets Laser when turned off.

    • Rejects Noise caused by VCC during power-on or hot plugging.

  • Bias Controlling Transistor Driver (BIASDRV)

    • Transistor placed between BIASDRV and VCC

    • Ensures Low Noise Operation

    • Rejects Power Supply Noise

  • Decoupling Capacitors at VCC & GND


Testing procedures

Testing Procedures

  • The Eye Mask from IEEE 802.3z

    • Distinction between logical 1 and 0

    • Allows to see amount of jitter

  • Bit Error Testing

    • Tektronic BERT

  • Testbed


Board design

Board Design

  • Parts List Consists:

    • VCSEL (~850 nm)

    • SMA Connectors

    • SMA Cable

    • Resistors

    • Capacitors

    • Inductors

    • 3 to 5 Volt Power Supply

Picture provided by: http://www.ece.gatech.edu/academic/courses/fall2001/ece4006/1G2/


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