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Grand challenge addressed (from AWP 2013): 7.3.2 “Competitiveness through Semiconductor Process Differentiation” Acro

Grand challenge addressed (from AWP 2013): 7.3.2 “Competitiveness through Semiconductor Process Differentiation” Acronym proposal: RealNano.

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Grand challenge addressed (from AWP 2013): 7.3.2 “Competitiveness through Semiconductor Process Differentiation” Acro

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  1. Grand challenge addressed (from AWP 2013): 7.3.2 “Competitiveness through Semiconductor Process Differentiation” Acronym proposal: RealNano Project / subject name: Industrial Realization of CMOS-integrated NanosensorsContact person and organization: Anton Köck, AIT Austrian Institute of Technology Gmbh E-mail address: anton.koeck@ait.ac.at Telephone number(s): +43-50550-4302, +43-664-8251101

  2. Motivation • Problem to be solved: Reliable fabrication and implementation of nano-components (nanowires, nanoparticles,…) on CMOS devices • Research Domain: Heterogeneous Integration, 3D-integration, Nanotechnology; More than Moore • Market innovation and impact: Employing nano-components for the realization of new devices, such as smart sensor systems (e.g. gas sensors in consumer electronic products, safety- and health-applications in smart phone)

  3. Gas Sensors • COCOA: Chip-On-Chip technologytoOpen newApplications STMicroelectronics + 19 partners (ams AG,…) Device development • ESiP: Efficient Silicon Multi-Chip System-in-Package Integration – Reliability, Failure Analysis and Test Infineon AG + 41 partners (ams AG,…) Reliabilityissues

  4. SnO2, CuO & ZnO-Nanowires + Nanoparticles SnO2 • Reproducibility ! • Eachdeviceisunique ! • Howtoimplement on CMOS-chip ? CuO SnO2 CuO

  5. SnO2, CuO & ZnO-Nanowires + Nanoparticles CuO SnO2 ZnO CuO

  6. Objectives • Brief description of a project/subject idea: Development of an industrial process chain enabling the implementation of nano-components on CMOS-chips • Final objective: Demonstration of “nano-based” devices capable for mass production (e.g. gas sensor arrays,…) • Main activities: Process development, nanowire synthesis (on wafer-scale), nanoparticle implementation, transfer processes, device development, device fabrication, reliability issues

  7. Organizational • Consortium status Preliminary: AIT, ams AG, EVG, IMTEK(?), CAN • Available key partners and capabilities AIT, ams AG, EVG, CAN NW synthesis, 3D integration, wafer handling, NP production • Missing capabilities and/or partners: Other partners employing nano-components, identifying additional “nano-enabled” devices (e.g. super-caps), definition of viable process chains • Indicative size (person.years and Euro’s): t.b.d. • Program addressed (ENIAC/CATRENE): ENIAC

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