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1. PCB 와 주변기술 PowerPoint PPT Presentation


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1. PCB 와 주변기술 PCB(Printed Circuit Board) 란 절연판 위와 그 내부에 회로를 형성시켜 그 위에 실장된 부품을 전기적으로 연결시켜 전기적으로 동작을 시켜주는 기판을 말한다 . 처음 PCB 가 제작될 당시 Ink 를 Screen 으로 인쇄해 회로를 형성시켰기에 Print 란 말이 따라온 것인데

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1. PCB 와 주변기술

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1 pcb

1. PCB

PCB(Printed Circuit Board) .

PCB Ink Screen Print

Ink Film Liquid Pattern . ED(Electro Deposit) . PCB PWB(Printed Wiring Board) . .


1 pcb

PCB .

PCB (Glass Fiber) 50% . PCB Soldering

Board 230260 . , . Speed PCB (Characteristic Impedance) .

(RF: Radio Frequency) PCB .


1 pcb

PCB (Passive Component). (Active Component) . PCB (Density) HDI(High Density Interconnection) Technology PCB .

PCB (Fine Pattern), (Small Hole), (High Layer) Laser Hole PCB Micro Via Build Up Technology


1 pcb

PCB Internet

. Hand Held Product,

Package Substrate .

1-1.


1 pcb

PCB . CDMA

(2000) PCB 2 (1 ) (2001) 1 . PCB Laser Micro Via Build up .

Package Substrate BGA(Ball Grid Array) CSP(Chip Scale Package) Chipac 2 . , 100 .


1 pcb

2. PCB

PCB .

PCB . PCB PCB .


1 pcb

10 PCB . .

1.

2. IPC

3.

4. BASE MATERIAL

5.

6. PCB

7. (LPC)

8. HOLE

9.

10. (FINISH)


1 pcb

2-1.

.


1 pcb

Game, , , PCB Grade .

, Hand Held PCB .

Multi Media .

Market , Consumer Electronics, Computer Business , , , Industrial Electronics and Instrument, 6 .


1 pcb

2-2. IPC

PCB, Connector, Cable, Package, Assembly The Institute for Interconnecting and Packaging Electronics Circuits .

IPC 4 . PCB .


1 pcb

2-3.

PCB . PCB Rigid Type Flexible Type 2 Rigid-Flexible Type .

Rigid PCB Flexible 4 Rigid Type PCB . Printer head Connector .

Rigid-Flex Compact , NEC Note PC, SONY DVC , Assembly . Hand held Product .


1 pcb

Rogers Bend Flex Rigid Flex PCB ASSY .

TCP(Tape Carrier Package) Flexible Polyimide COF(Chip On Flex) Flex Board Bare Chip Direct .


1 pcb

Tessera BGA Flexible Substrate , Bare Chip CSP(Chip Scaled Package) Flexible Silicon Substrate Dimensional Mismaching .

Flexible System Design Engineer .


1 pcb

2-4. BASE MATERIAL

PCB . , , . SMC Reflow CPU Clock Herz RF(Radio Frequency) .

3 .


1 pcb

Tg( ) 150 High Performance . Teflon .

1MHz1GHz FR-4 Polyimide , 3MHz3GHz 4.24.4 BT, 30MHz10GHz 3.73.9 BT, Cyanate Ester, PPO, Polyester, PPE .

300MHz300GHz PTEE .


1 pcb

2-5.

PCB . Note PC, , , PDA Hand Held Product . PCB 8 .

, FAX, , .


1 pcb

4 , , , 6, Note PC PDA, Workstation 8 .

CDMA TYCOM Mini Computer 10, 12 Back Panel IC Test Probe 12 18,

40 Main Frame .


1 pcb

2-6. PCB

PCB 1.6mm .

IC Card, ,

Pager, Note PC .

.

2-5.


1 pcb

48 0.1mm . Prepreg 1 , .

SLC Build up PCB Prepreg . .

Data 0.8t 5.3%, 0.811.6t 74.6%, 1.612.30t 12.5%, 2.3t 7.6% Share .


1 pcb

2-7. (LPC)

SMT DIP Type Package Pin Pin 0.1 (100 Mil), (Line Per Channel) . LPC .

2-7.


1 pcb

2-8. HOLE

Hole .

SMT Hole Via .

IPC Technology Roadmap Hole Size

.


1 pcb

PCB Hole . Hole PCB Blind Buried Hole .

, Via Via .


1 pcb

Hole . Hole Drill Bit Hole Blind Hole Hole .

PCB Hole , PCB Hole . BGA Cost Drill , Solder Mask, .

Hole Bit .


1 pcb

Laser Hole ESL SUMITOMO(LUMONICS) . MATSUSHITA ALIVH , CO2Laser .

0.20mm Laser Bit .

Laser IBM SLC(Surface Laminar Circuit) Photo Via CYCONEX DYCOSTRATE Plasma Hole Buried Blind Hole . Build up PCB Bit Hole .


1 pcb

2-9.

PCB , Substractive Additive .

Substractive PCB Etching , Additive PCB .

Semi-Additive Process .

Additive . Fine Pattern .


1 pcb

Direct Plate Short Process , Hole Panel Pattern . .


1 pcb

2-10. (FINISH)

PCB . Solder Solderability , Bare Board Shelf Life .

Etching Resist Tin/Lead 25 Dry Film Tenting/Etching Process Flux Coating . Pre Flux .

SMOBC(Solder Mask On Bare Copper) Tin/Lead Reflow HAL(Hot Air Leveler) . HAL 20mil pitch Fine Pitch SMC Pad Solder Coating OSP(Organic Solderability Preservative) Organic Finish . .


1 pcb

2 Reflow Benzimidazole Type Organic Finish TAMURA, SANWA, SHIKOKU , (TAMURA) ENTHONE ENTEK 106 PLUS .

OSP PCB Set .


1 pcb

2-10. Process Benefits Comparison


1 pcb

Table Immersion Gold Copper 0.05 LCD , Solder Mask .

COB(Chip On Board) BGA(Ball Grid Array) Wire Bonding (Pure Gold), Autocatalytic Type 0.3 .


1 pcb

  • 3. PCB

  • PCB .

  • :

  • * (PCB )

  • Paper/Phenol, Glass/Epoxy, Composite, Polyimide film

  • * Solder resist ( (Short) Coating())

  • :

  • * Photo resist ('' Solder Resist '' )

  • '' ( . Screen'')

  • Drill bit (Via'', '' Drill )

  • Router bit ( )

  • . .


1 pcb

. () 5 () .

1cm 1.4kg . 1cm 500g . 0.2mm 10g .

. , .

Flexible PCB Polyimide Film

(3-1-2). Polyimide Film 3 2 . .


1 pcb

3-1. (CCL)

3-1-1 Rigid() . ( 10 ) .

(paper), (Glass Cloth) .

sheet . (XY) .

, (Z) XY 10 .


1 pcb

3-3-1. Glass/Epoxy (1)

A.

Glass/epoxy Glass Epoxy (, ) .

- Grade FR-4 (NEMA) Tg

() FR-5( FR-5 ) .

- () Grade (G-10, G-11),

.

Glass/Epoxy PCB , Paper/Phenol CEM-3 .

PCB .


1 pcb

, Computer Glass/Polyimide

Tg Epoxy .

Package Ceramic Glass/Epoxy .


1 pcb

3-3-4. MCL-E-679


1 pcb

. () 5 () . 1cm 1.4kg . 1cm 500g . 0.2mm 10g . . , .

Flexible PCB Polyimide Film (3-1-2). Polyimide Film 3 2 .


1 pcb

3-2.

, . 3-2 .

, Roll (/) . Prepreg . Prepreg . B-stage .

Prepreg stainless (180 ) . C-stage .

B-stage Prepreg , .


1 pcb

3-2-1. , Prepreg, Shield

() '', '' Prepreg . Prepreg .

'' (3-2-1). Mass Lamination Premulti

Shield . .


1 pcb

3-3.

3-1 .

3-3-1.


1 pcb

3-3-2.


1 pcb

3-3-3.


1 pcb

  • B.

  • 1). Press

  • Press

  • Maker .

  • Epoxy 175~185 90~120,

  • 20~40kgf/ , () .

  • Tg .

  • 2).

  • - 4~60.2 () .

  • 0.2 0.12 , 0.21

  • (Single Ply).

  • Cost Down , ,

  • Drill , (),

  • . .


1 pcb

  • 3). /

  • .

  • 4, 6

  • .

  • 10 PCB

  • FR-4 FR-5( FR-5 )


1 pcb

  • 3-3-2. Glass/Epoxy (2)

  • PCB 20 Glass/Polyimide Glass/Epoxy(FR-4) FR-4 base , . .

  • FR-4

  • FR-4 UL94V-0 () Brom

  • BisphenolA Epoxy () .

  • Europe Dibenzolane

  • Halogen

  • Antimon .

  • Matsushita R-1566

  • Glass/Epoxy .

  • Plastic

  • (), , ,

  • .


1 pcb

  • 1 .

  • 1) Brom Halogen ,

  • 2) Antimon ,

  • 3) Phosphorus (/) ,

  • 4) ,

  • 5)

  • - Matsushita Halogen Antimon .


1 pcb

  • 2) FR-4

  • PCB engine

  • PCB Chip .

  • Cycle,

  • Crack .

  • R-1766M

  • TSOP Flip Chip .

  • Drill Package

  • 8~9ppm .


1 pcb

  • 3) FR-4

  • , Drill Land ,

  • ,

  • (CAF), Aspect

  • Through Hole .

  • 170 Tg FR-4 ,

  • PCB .

  • R-1766T ,

  • Bow () .


1 pcb

  • [Keyword]

  • Brom Epoxy

  • UL94V-0 TBBA(Tetra Bromo-Bisphenyel A)

  • Bisphenol A epoxy .

  • Deca-Bromo-Diphenyl-Ether

  • TBBA Brom

  • .

  • Matching X,Y .

  • /chip on board 12ppm (R1766M)

  • 9ppm package .


1 pcb

  • Tg , ,

  • .

  • Brom epoxy Brom

  • .

  • Non-Halogen

  • .


1 pcb

  • 3-3-3. Composite (1)

  • A.

  • Composite 2 CEM-1

  • CEM-3 .

  • 3-3-5 .

  • CEM-1 CEM-3 glass .

  • CEM-1

  • CEM-3 .

  • CEM-1 Paper/Phenol (FR-1)

  • .

  • FR-1 CEM-1

  • .

  • CEM-3 CEM-1 Glass/Epoxy(FR-4)

  • FR-4 .

  • glass .

  • CEM-3 through hole FR-4

  • .


1 pcb

CEM-1 , Tuner

CEM-3 . CEM-3 merit 0.8 0.6 FR-4 .

CEM-1, CEM-3 MLB build-up CEM-3 core .


1 pcb

  • B.

  • CEM-3 FR-4 FR-4 glass FR-4 .

  • (Bow) .

  • .

  • , Pattern ,

  • 1) .

  • 2) (, SR ).

  • - . CEM-3 FR-4 2 scale factor . .


1 pcb

  • C. /

  • CEM-3 FR-4 OA, FA , , , game .

  • CEM-3 FR-4 FR-4 .

  • glass epoxy 88 FR-4:CEM-3/68:32%

  • 9192 CEM-3 FR-4 ,

  • 97 .

  • FR-4 , 0.6

  • CEM-3 .

  • CEM-3 silver paste TH , paste TH

  • .


1 pcb

3-3-5. Composite


1 pcb

  • 3-3-4. Flexible

  • Flexible PCB( FPC) , ,

  • . ,

  • FPC .

  • FPC polyester( PET) polyimide film( PI)

  • .

  • () FPC

  • .

  • () ,

  • .

  • TAB(Tape Automated

  • Bonding) fine pattern () low profile

  • ( ) .

  • fine pattern

  • 18, 12, 9 () ..


1 pcb

  • cover lay base film PI, PET film Solder Resist ink .

  • (: )

  • ,

  • .

  • base film, ,

  • 3 FPC .

  • 2 FPC


1 pcb

B.

- FPC , , . , . , FPC .

- LCD film FPC . LCD FPC pitch . LCD film FPC . PI , .


1 pcb

  • , LSI

  • , ,

  • , .

  • noise noise shield

  • ground noise distortion

  • strip ) impedance control

  • .


1 pcb

  • C. /

  • FPC Camera, FDD, Thermal Head .

  • HDDFDDprinter,

  • , Oil .

  • . Pattern Fine,

  • Through Hole ()

  • LCD ,

  • .

  • FPC

  • FPC , ,

  • .


1 pcb

  • 3-3-5.

  • Computer

  • .

  • PCB () .

  • (1) PCB

  • .

(V: m/s)=KC/ (1)

(K: , C: , : )


1 pcb

  • .

  • .

  • ,

  • .

  • (2)

  • .

= 27.3f/Ctan (2)

(f: , C: , : , tan: )


1 pcb

  • B. /

  • .

  • FR-4 ,

  • device

  • FR-4

  • .

  • ,

  • mother board FR-4 Device


1 pcb

  • 3-3-6. Prepreg

  • Prepreg

  • bonding sheet .

  • prepreg core press

  • PCB .

  • prepreg press core

  • , Through hole

  • .

  • via hole core (),

  • , .

  • PC package PCB

  • Fine Line

  • .


1 pcb

  • PCB Prepreg Glass Cloth

  • , , () .

  • PCB Build-up Prepreg .

  • - Prepreg , Laser .

  • ,

  • Prepreg .


1 pcb

  • B. /

  • PCB fine line

  • .

  • 1-ply()

  • prepreg

  • .

  • PC package ,

  • .


1 pcb

  • [Keyword]

  • PCB Press Tg, , ,

  • .

  • Prepreg Press

  • (3-3-3).

  • () (Gel Time) .

  • . Press

  • .


1 pcb

  • Build-up prepreg

  • 3-3-6 .

  • - GMPL-255 epoxy base prepreg.

  • CCL-ML195 BT resin base BT resin ,

  • migration .

  • - .


1 pcb

  • 3-3-7. PCB

  • , 3-3-73-3-8 .

  • PCB , , FPC Chip TAB, BGA, CSP 150

  • fine 20 .

  • , foil crack

  • HTE (3EC-), (170) (anneal)

  • Super HTE(3EC-HTE), Etching Low Profile (VLP),

  • 9 (UTC) .

  • ,

  • (MR500, MR600) .


1 pcb

  • .

  • Laser

  • Hole Drill .

  • 2) press .

  • 3) .

  • - Tg , Mitsui

  • Tg200 .


1 pcb

  • B.

  • 12 VLP 9 . 9 Carrier() .

  • Epoxy Film . Prepreg .

  • C. /

  • , Note PC Fine BVH BGA, CSP Plastic Package .

  • 12 9 .

  • Laser micro via PCB .

  • PCB maker micro via

  • .


1 pcb

[Keyword]

* Micro via

IPC 150 via hole micro via . Hole drilling photo, Laser, Plasma Laser . 130 PCB Laser .

* Tg

Glass (). . Chip Tg Tg film

. Mitsui (blend) Tg .

* UTC-

30 package . Mitsui 5 UTC , UTC .


1 pcb

  • 3-3-8. Glass Cloth

  • Glass cloth PCB , , () .

  • Glass cloth E-glass 5~9 () () (), () () .

  • Cloth

  • Prepreg Sheet ,

  • press PCB . Cloth

  • 60, 100, 200 .

  • (),

  • glass . 100

  • (), 200 () .


1 pcb

  • Glass glass cloth maker glass E-glass PCB , glass .

  • cloth Water Jet cloth

  • ()

  • glass cloth .

  • glass cloth , .


1 pcb

  • B. /

  • 3~4% Cloth .

  • PCB Note Book PC, Video Camera

  • Cloth

  • cloth Cloth

  • .

  • ,

  • .

  • PC .

  • Glass Cloth 10%


1 pcb

  • [Keyword]

  • Glass

  • , PCB ,

  • .

  • glass cloth glass

  • .

  • glass glass

  • T-glass glass D-glass

  • PCB () (cloth)

  • PCB .

  • PCB glass

  • glass , , .

  • glass NE-glass .

  • NE-glass .

  • aramid NE-glass ,

  • .


1 pcb

4.PCB

4-1. Solder Resist, Symbol Mark( ),

PCB

1)'' ,

2)Via ,

3) .

PCB .

4) Solder resist

5) Symbol mark

6)

PCB .


1 pcb

4-1-1. Solder Resist (4-1-1)

"Solder" "" . "Resist" ", " .

Resist " " . "Etching resist" '' ('' ), " .

PCB '' '' "/" .

.

PCB IC, ( ) PCB .

( Solder bridge ). .

solder bridge , Land( ) Mask() resist solder resist solder mask .


1 pcb

4-1-2 Symbol Mark( ) (4-1-2)

' ' PCB , '' .

4-1-3 (4-1-3)

PCB PCB . PCB , PCB .

, (Terminal) .

. '' .


1 pcb

4-2. (Panel)

PCB 10mm10mm,

500mm500mm .

.

'' .

'' 1

.

''

.

1,000mm1,000mm 1,000mm1,200mm

( 20mm ).

. '' - 1/2, 1/3, 1/4 510610, 510510, 510405, 510340( mmmm) .


1 pcb

4-3 PCB

4-3-1 PCB . "'' ". ''. 4-3-2 . '' '' (spray) . ' ' '' . .

'' 'Additive' . '' '' Additive . Additive "add" . (Additive ) Paste Screen .


1 pcb

4-3-1.


1 pcb

'' '' Subtractive (Subtractive subtract ).

Fine pattern '' Side etching (4-3-2).

Side etching etching resist .

Etching .


1 pcb

4-4. PCB

4-4-1 PCB . '' via


1 pcb

Via plated through hole/ ( PTH) .

PTH / .

via .

, PTH .

.


1 pcb

PTH via " paste" via .

paste paste screen via .

via paste "Silver through hole" .

pasate .


1 pcb

'' etching resist , ,

via .

PTH etching

"/Tenting " .

'' etching resist "dry film" .

Dry film resist '' .

'' PTH '' resist pattern etching .

via dry film .

'' ( ).


1 pcb

4-4-2. Via (PTH )


1 pcb

4-5.

4-5-1 PCB( MLB: Multi-Layer Board) . (T/C:Thin Core) , ''() , prepreg .


1 pcb

MLB '' via '' .

() "Registration" .

Registration MLB ,prepreg () MLB .

pin lamination mass lamination .

Pin lamination 4-5-2 () '' pin .

mass lamination pin , '' , .

Through hole '' pin lamination ,

Mass lamination X '' .


1 pcb

4-5-2. (MLB)


1 pcb

4-6. (Via )

4-6-1. Via (Through via, Blind via, Buried via)

via hole 2 .

.

via .

4-6-1(a) 1 #1 #2

A B .

#3 #4 A B .

.

via via .

#1 #2 1 4 a #3 #4 3 b, c, d .

via via .


1 pcb

via 4-6-1(b) 3 . 4 .

Via P 1(L1) 2(L2) via hole 1 4 .

(through hole, through via) .

Via Q L1-L2 via hole L1 L2 .

L1 via via .

via Blind via" .

Via R L2 L3 via 4

.

via Buried via" .


1 pcb

4-6-1(a) a , b, d blind via, c buried via .

hole (4-6-1(b) via P

L3, L4 via via ).


1 pcb

4-6-1. via


1 pcb

4-6-2. Land, Land , Land

via via via .

land .

4-6-2 .

Via land

via , via .

registration . Via

'Annular ring" .

annular ring via via ( 1).


1 pcb

annular ring .

annular ring ( land ) ( 2).

annular ring via .

, via land .

1. photo tool .

2. , land .

via

land .


1 pcb

4-6-2. Via Land


1 pcb

4-6-3. Via

.

1) pitch (Fine pitch, 3).

2) via (Small via)

3) blind via, buried via .

4) .


1 pcb

. .

fine via , blind via, buried via .

landless through hole via land

. Land via via registration .

3. Fine pitch line/space .

line/space 100 100 .


1 pcb

4-6-4. Via hole

Via via hole via hole . 4-6-3 hole punching via hole . 4-6-1 .

4-6-1. Via hole


1 pcb

Punching hole hole pitch hole via hole .

Drill via hole . Via , glass drill bit , tungsten carbide . . via . resin smear .

Hole drill via . Photo via laser via 0.1mm via hole . Buried/blind via .


1 pcb

4-6-3. via


1 pcb

4-6-5. Via hole

4-6-4 via hole . via hole . . via . via hole . via through hole.

through hole 4-6-4(a) through hole 4-6-4(b) . via hole palladium . () () . () base . full additive .


1 pcb

via hole paste through hole

.

4-6-4(c) .

paste screen via hole (d) . via know how . paste paste paste .


1 pcb

4-6-4. Via hole


1 pcb

5. PCB

5-1.

5-1-1. (Press)

(Press)

, (Prepreg), .

PCB ' ' 5-1-1 Hydraulic() Autoclave() .


1 pcb

5-1-1.


1 pcb

Hydraulic () Silicon Gum () -650mmHg .

Autoclave Bag .

. -650mmHg 8~10kg/cm2 .

5-1-1 .


1 pcb

5-1-1. Press


1 pcb

B. MLB

()

MLB 3 .

(1)

(2) Prepreg

(3)

5-1-3 .


1 pcb

2) Prepreg

5-1-2.


1 pcb

5-1-3. Prepreg


1 pcb

3) Prepreg

MLB 5-3 prepreg .

, 5-4 .

5-1-4. Prepreg

(b) A, B 70 prepreg 2x(0.070.07)0.28mm prepreg 0.28mm .

[]0.10mm0.18mm0.28mm

0.15mm2 0.30mm

0.10mm3 0.30mm


1 pcb

prepreg

prepreg slipping,

prepreg () ,

prepreg .

C. MLB

5-5 4 ( ) .

5-1-5. PCB


1 pcb

5-1-6 () . (a) (b) . 5-1-3 Pepreg (a) .

5-1-6.

Prepreg 5-3 (R/C:Resin Content) . 5-1-7 (a) (b) Prepreg(PP) 1 30

0.12mm(0.034) .


1 pcb

5-1-7.

MLB . (Through hole , Patterning, Solder Resist ) 1.6 +0.1/-0.2mm( 0.3mm) .


1 pcb

5-1-2.

(Build Up)

PCB 4 5 5-1-8 5-1-9 () .

5-1-8. Mass Lamination Pin Lamination


1 pcb

[]

1) Mass Lamination Pin Lamination

2) 5-1-3.(c) 4

Guide Pin 4 4 Guide Pin .

Pin Lamination , , , Prepreg, () Film, Dummy Cushion() Guide Hole .


1 pcb

5-1-9. Build up

Mass Lamination Pin Lamination Guide Pin Mass Lamination .

1) Press Slipping( )

2) Resin Prepreg Slipping.

Slipping (, Guide Post ) 3, 4 Pin Lamination .


1 pcb

B.

Glass epoxy (FR-4) 5-10 . prepreg , , ,

, , program

5-1-10. Glass Epoxy


1 pcb

Program (Press Schedule) .

1) ( )

120130 . .

130/2030 .

2) ()

1.02.0/(130170) .

3) ()

FR-4 160/30 . Press 170180/7090 .


1 pcb

4) ()

510kg/cm2-510 (3040kg/cm2) slip , distortion .

5) ()

void () .

6)

press .

7)

Press , press programming (), (), profile .


1 pcb

5-1-3.

A.

Glass epoxy Anchor 5-1-11 prepreg .

5-1-11.

5-1-4 . (CuO, CuO2) epoxy , Haloing(Pink ring/Red eye) .

5-1-12 through hole .


1 pcb

5-1-4.


1 pcb

5-1-12. Through Hole


1 pcb

5-2.

5-2-1.

A.

PCB 5 .

1) Drilling

: Drilling

: Bit

: , PCB ( )

: Glass Epoxy

/ .

Drill PCB 5-2-1 .


1 pcb

5-2-1. PCB Drill (:mm)

: .

: , drill .

: , step , drill .

: .


1 pcb

2) Punching

: Press

: Punching pin ()

: PCB ( )

: Paper/Phenol

/ .

3) Laser

: Laser (YAG, CO2, Eximer)

: Alumina, Polyimide film

taper .

4) Etching ()

: , Etching

:

taper .

5) Beam,

PCB punching drilling , Laser


1 pcb

(1)

(cost minimum), (production maximum), (profit maximum)

(2)

PCB .

5-2-1. PCB Hole


1 pcb

2)

(1) (Stacking: )

2~4 Entry Board, Backup Board Taping( ) Pin(Stacking Pin) 5-2-2 . Stacking Pin Hole . Stacking Taping Stacking .

5-2-2. PCB Hole Stacking


1 pcb

Entry board Aluminum PCB , burr () , hole , hole () drill entry board aspect . pi 0.1~0.2mm . Entry board . Aluminum 0.1~0.2mm, phenol 0.3~0.5mm .

(2)

Drill spindle() . = drill drill . Resin smear . smear .

, Drill () V=160~180m/min., V=200m/min. . Smear .

() .


1 pcb

(3) (: Chip Load)

Drill 1 Drill Torque( ), Thrust( ) . Drill () () () Thrust() .

(4)

Backup Board PCB Drill () Entry Board Aspect drill . Drill .

(5)

/ Drill . Double Drilling Step Drilling.


1 pcb

Double Drilling 2 Drill , , () Drill (Guide Hole) , Drill .

Drill Drill .

Step Drilling Cycle . Drill drill .


1 pcb

(6)

PCB Drill .

PCB Torque, Thrust ( ) . ( Ounce ) .

, .

PCB ( Polyimide Epoxy) Drill Smear Glass Polyimide Drill Smear .


1 pcb

C.

5-2-3 diamond ( ) . Drill () () (), (: ) .


1 pcb

PCB Glass Cloth Epoxy 5-2-4 , () Ceramics(Alumina) . Ceramics Ceramics .

. Glass Cloth Epoxy


1 pcb

K .

K -glass () .


1 pcb

D. PCB Drill

5-2-5 PCB hole Drill Straight Shank ( ) 3.175mm Dril Roomer Type() Drill. Roomer Drill Shank Drilling Machine (Collet: ) NC() Hole Drill Machine Drill. 38.1mm Drill Solid Type.

Drill Straight Type Drill. Twist 30 . , Glass Epoxy PCB PCB Smear Under-cut Type .


1 pcb

E. Drill Hole

5-2-6 drill (Under-cut type ) . Drill drill bit [Shank] drill [], [ (: Point)] . () .

1) Twist Angle ( )

Twist Twist Torque .

Twist Pump . . Aluminum Twist , Twist .

2) Relief Angle ()

Relief Angle Thrust( ) . Relief . () Drill . , 8~10, PCB Drill 15~20 .


1 pcb

F. PCB Hole Drilling Machine

1)

Pin hole .

motor Z . Spindle 12,000rpm .

2) Z

Collet() Jack Hole Drill . NC() () . Hole .


1 pcb

3) NC

X-Y spindle Z . drill 1/8inch Shank Roomer Type Drill. Spindle 2~6 Set .

, 300hits/min . Spindle 80,000~120,000rpm, Z 12,000~27,000mm/min, X-Y 25,000mm/min .

table motor AC, encoder feed back closed loop .

Drill chucking Auto Tool Changer(ATC) station 20 cartridge 150 . work station sub-table , .

NC program NC data /() step software .


1 pcb

G. Drill Hole

PCB Drill Hole , .

1) Epoxy Smear ( )

2) Hole Hole

3) Hole

4) Pink Ring ( , )

5)

6) (Burr), Nail Head ( )

7) Drill

hole hole aspect (Hole /) Drill , Drill Drill Hole .


1 pcb

5-2-2.

A. Router

PCB Press (Blanking: ) Router Routing . Router Lot .

, .

Router Endmill . Router .

Router . 5-2-16 Diamond Router .


1 pcb

5-2-10. Diamond Router Endmill

Router NC . Drilling Radial Drill , .

Spindle Pressure Foot .


1 pcb

  • B. PCB

  • PCB Router(, ) .

  • - Slot : Long Hole Drill, Router Endmill

  • ( Press Register Mark

  • ): cutter, Left Twist Endmill

  • - : Cutter (Bevel Cutter)

  • - V : V cutter (Side Cutter)

  • - Trimming: Trimming Cutter, Diamond Router Endmill

  • - : Cutter


1 pcb

C. Press ()

PCB Blanking PCB Hole Punching .

Press - .

() Press (), . Step .

Punching Paper-Phenol Paper-Epoxy PCB . Blanking Glass Epoxy .

2.0mmt , hole 1.6mmt pi 0.7mm . pin Pitch 1.78mm .


1 pcb

Press . Pattern hole pin (CCD Camera, X ), Glass , Paper-Phenol Paper-Epoxy . , , . 60~80 10 .

() ( ) . Press 2 .

= PCB ()

: Paper-phenol=8~12kg/ (, 50~60%)

Glass-epoxy=40~50kg/

2) Hole Hole

PWB Hole () Punch 80~90% . Punch, , , Punch Die Hole Clearance, .


1 pcb

Hole 5-2-11 (Dish Hall) . .

() .

Hole , Hole Punch Die Hole Clearance (5-2-12 ) 0.05~0.1mm() .

Punch , (: ) .


1 pcb

5-2-11. Punching Hole

5-2-12. Punch-Die Clearance


1 pcb

5-3.

5-3-1.

PCB , , , . Through Hole , Through Hole

PCB .

PCB Etching Resist (- ), (Bonding) Nickel .


1 pcb

5-3-2.

() Ion .

1) , 2) .

5-3-1 .

5-3-1.


1 pcb

() () .

, () () Ion .

.


1 pcb

() , , () Ion .

.

Ion Cathode .

() () () , .

, . 5-3-1 .


1 pcb

5-3-1.


1 pcb

A.

.

1) ()

2)

3)

4)

5)

, , Ion , , pH .

. Levelling, , .


1 pcb

(Anode) (Cathode) Faraday .

,

() .

1 gram () 1 Faraday(F) 96487 coulomb .

1 coulomb 1 A 1 .

I Ampere t m(g)

m = KIt

K 1 coulomb g .

1 F 1g 63.57 / 2 = 31.8g Cathode , Anode

Cu2+ .


1 pcb

B.

() Ion Cathode Anode Ion . .

1) .

2) .

3) Pin Hole .

4) .

5) , .

, , .

1)

Formalin Alkali .

Cu2++2e-Cu0

2HCHO+4OH-2HC00-+H2+2H2O+2e-

Cu2++2HCHO+4OH-Cu0+2HCOO-+H2+2H2O


1 pcb

2) Nickel

, , Alkali (Phosphorus) Natrium (Boron) P B Ni . Ni-P() , Ni-B PCB .

Nickel

Ni2++2eNi0

H2PO2-+H2OH2PO3-+2H++2e

Ni2++H2PO2-+H2ONi0+H2PO3-+2H+

5-3-2 , , , .

, pH,

.


1 pcb

5-3-2.


1 pcb

5-3-3.PCB

PCB , , , . Through Hole .

Through Hole PCB Subtractive Additive .

Subtractive () , Through Hole .

Through Hole 25 Etching Resist Solder Dry Film Laminate() Etching .


1 pcb

Additive Semi-Additive, Full-Additive, Partly-Additive Semi-Additive , , 2~3 ,

.

Etching fine pattern .

Full-Additive Resist .

, Through Hole Through Hole, Blind Hole .

, .


1 pcb

Partly-Additive , Resist Etching .

Solder Resist Through Hole .

Through Hole Through Hole .


1 pcb

5-3-4. PCB

PCB Drilling Through Hole .

Drilling Through Hole .

Void, Blow Hole, Through Hole () Hole Cleaning (5-3-3).


1 pcb

5-3-3.


1 pcb

Desmear

PCB Drilling (Smear) Hole Desmear .

PCB Drilling Smear PCB , Through Hole Smear Desmear .

Desmear Chrome , , Plasma Desmear Manganate() 3 .

1) MLB Conditioner

. Epoxy (: ).

() .


1 pcb

2) MLB Oxidizer(Etching)

Alkali () .

Smear . Microporous( ) Catalyst() . .

3) MLB Neutralizer()

,Through Hole 2 Manganese

.


1 pcb

B.

Through Hole () () .

1)Cleaner Conditioner

, , Etching Etching .

Cleaner Through Hole .

Conditioner Through Hole Catalyst .

smear Through Hole glass Catalyst Void .

Conditioner Glass Catalyst .


1 pcb

2) Soft Etching

Etching( 1), . Conditioning .

Etching , - () .

3) Catalyst Pre-Dip

Catalyst Pre-Dip . Pre-Dip Catalyst Catalyst Natrium .

Pre-Dip Catalyst .


1 pcb

4) Catalyst (Activation)

Catalyzation . .

Catalyst Palladium - .

Colloid() 50~300 Pd-Sn Sn-rich Pd-Sn .

Colloid Sn Accelerator .

Catalyst Palladium- Alkali .

5) Accelerator

Pd-Sn Colloid . Accelerator PCB Catalyst Catalyst .

Accelerator Conditioner .


1 pcb

C.

PCB 3 .

1) Low Copper (Panel ) 0.30.5

2) Heavy Copper ( ) 1.52.0

3) Heavy Copper (Additive) 2025

5-3-2. Subtractive


1 pcb

Through Hole Additive (, , ) .

Subtractive (5-3-2) Through Hole . () , .

Through Hole (, Glass ) .

2) () .

3) PCB .

Additive Thick () . , (), Gas () (: ) . Additive , , .


1 pcb

Soda, Soda, Soda

.

PCB 5-3-4 .

, , (Chelate) Rochelle , EDTA, -, Alkali (pH) Natrium .

, , , Biphyridine .


1 pcb

5-3-5.

PCB Through Hole .

Subtractive 5-3-2 3 Panel , Pattern .

Through Hole .

(: Throwing Power),

Through Hole

2) (, , , )

3) Levelling

PCB Pyrophosophate( )

1970 Pyrophosophate

1980

.


1 pcb

PyrophosophateAlkali PCB Through Hole .

Pyrophosophate , , , , Dry Film

.

Pyrophosophate .

1) ( : Throwing power)

PCB , Through Hole () . Final Etching Etchant Over Etching Fine Pattern .

Pyrophosophate() () , . . Asbestos() PCB , () .


1 pcb

2)

Through Hole PCB . PCB Through Hole Through Hole Stress . 5-3-3(a) Z .

Through Hole Stress Corner Crack Barrel() Crack . 5-3-3(b) Through Hole .

, , Resist


1 pcb

3)Levelling

Through Hole Levelling () () () Hole Levelling Hole .

B. Pyrophosophate()

Pyrophosophate 5-3-5 Pyrophosophate PyrophosophateKalium.

Pyrophosophate PyrophosophateKalium Pyrophosophate . Pyrophosophate Alkali Resist , .

Pyrophosophate Alkali Anode Bag .


1 pcb

5-3-6.Solder

Solder - Connector Lead Frame PCB Through Hole ( Etching Resist) .

PCB Solder 60%, 40% Solder Solder .

Solder Solder FPC .

PCB Solder 1970 (Boron Fluorine) 1980 .


1 pcb

PCB Through Hole Solder Etching Resist , Fusing .

Throwing Power , Pin Hole , Sn-Pb , ()( ) Outgassing .

Etching Resist Solder Tenting(Dry Film) (, Ink) .

Fusing Sn60%-Pb40% () Solder 7~10 .

5-3-7 Solder . Solder Sn(-0.130V) Pb(-0.126V) ( 2 ) .


1 pcb

() Solder . .

PCB Solder Etching Resist , Fusing Solder Through Hole PCB , Solder Through Hole(SMOBC) . , , Solder Solder .


1 pcb

5-3-7.

PCB Connector , , .

Nickel . Nickel Nickel 36, 11.5 .

A. Nickel

Nickel 5-3-8 .

Watt . . Nickel, () Nickel .


1 pcb

B.

, , . .

* Cyan Alkali

, Alkali

* No Cyan

Cyan Ion () . Cyan Alkali.

PCB pin hole . 3545% . Ni Co , . () pulse .

Bonding, .


1 pcb

5-3-8.

Direct Plating

1960 PCB Through Hole , PCB .

, , , Full Additive PCB .

, Formalin , Chelate EDTA Europe .

Direct Plating(DP) .


1 pcb

DP Process 13~14% 500 DP Process Europe DP Process .

DP Process PCB Maker .

PCB Maker DP Process , , Through Hole , , .

DP Process Conveyer .


1 pcb

B. DP Process

PCB Direct Plating Palladium, Polymer, Carbon Graphite .

Palladium Catalyst Pd-Sn Colloid Tin Free Pd . DP Process Pd-Sn Colloid .

1)DP process

Pd-Sn Colloid DP process 5-3-10 .


1 pcb

cleaner, conditioner , Pd-Sn Colloid , Ion Accelerator Colloid Sn2+ () Ion . covering .

2)DP process

DP Process PCB Maker Process DP Process , Aspect Through hole Covering .

DP Process Process.


1 pcb

C. Nickel,

PCB , PCB SMT COB(Chip On Board) , MCM .

Through hole .

PCB .

Hot Air Leveler(HAL) , Pre-Flux, Solder Pre-Coat , Nickel .

Nickel Pad COB


1 pcb

COB Bonding (0.05~0.1) Wire Bonding Plasma Cleaning Wire Bonding

SMT COB .

PCB Nickel 5-3-11 .


1 pcb

5-4. Pattern

5-4-1.

Dry Film Photo Resist(DFR) .

DFR 5-4-1 Cover Film/Photo Resist()/Carrier Film 3 .

Cover Film Resist Laminate ().

Carrier Film LaminateResist Roll Mask Laminate Resist Film Laminate .

Film Cover Film Polyethylene Film, Carrier Film Polyester film .


1 pcb

(Etching) . 5-4-2 . 5-4-3 Through Hole Tenting .

Resist . .

2030

4050 tenting,

DFR Alkali , () .


1 pcb

5-4-2. ()

(/) Dry Film Lamination .

Resist (, , , , ) () .

.

(1) Buff Role

(2) ()

A. Brush scrub

B. Jet scrub (Honing/)

(3) Belt sander

(1),(2) .


1 pcb

Soft Etching (Ammonium, -) .

(: ) PCB Lamination .

5-4-1 .

5-4-1.


1 pcb

B.

1) Buff Roll ( )

Buff roll Scotch Brite VFSF (#320#600) . Scotch Brite SF(#600) 2() , () 5-4-4 . () .


1 pcb

2) Brush Scrub

. 5-4-5 .


1 pcb

3) Jet Scrub

Jet Through Hole . Brush Scrub . 5-4-6 .


1 pcb

4)

. . - Etching . . 5-4-7 .


1 pcb

C. Dry Film

Dry Film 0.31.0 . 0.3 . 1.0 Dry Film Etching (Tenting ) ( ) .

2) Resist Pattern

(1)

Buff Roll Jet Scrub Resist , Jet Scrub .


1 pcb

(2)

Buff Roll Jet Scrub Resist 5-4-8 . Jet Scrub Resist . Resist Line . Jet Scrub () .


1 pcb

5-4-3.Dry Film Laminate

A. Lamination

Lamination Dry Film Dry Film .

Lamination 5-4-2 .

5-4-2. Laminate


1 pcb

B. Laminate

Laminate Dry Film .

- Laminator (Roll , Roll , )

- (Roll , , , )

- Dry Film (Dry film , )

(: ) Dry Film () , Resist Pattern 5-4-10 () . Glass air void() .

, Dry Film .


1 pcb

Laminate

Dry film laminate roll /, laminate , laminate ( ) .

Laminate laminate , laminate roll laminate .

Dry film laminate .

2) Dry Film

Dry Film . Laminate Dry Film .


1 pcb

5-4-4.

Mask Film Resist , Resist .

Resist Resist (, ) .

() (). (Contrast) .

.

(5-4-11) .

Lamp .

Metal Halide Lamp .


1 pcb

Resist 365nm 405nm .

405nm . 365nm Carrier Film (PET) Resist (5-4-12).


1 pcb

Resist (5-4-13) Monomer() 3 () (5-4-14).


1 pcb

Resist ( ) . Resist .

A., B., C. .

resist () . Step Tablet .

Step Tablet Gray Scale Step Mask Film. Step (5-4-3). , Step .


1 pcb

B.

Line Space Pattern Mask , Line ( Space) .

Line/Space 1/1 5 Line ( Space) Pattern .

(5-4-16) Line ( Space) (5-4-17).


1 pcb

C. ()

mask line( space) .

5-4-18 100 line mask (plot) .

(space ) . 100 60mJ/ .


1 pcb

5-4-5.

Resist Resist . Alkali Resist 5-4-4 .

(1) , (2) (), (3) 3

5-4-19 .


1 pcb

Alkali Dry Film (Emulsion) .

Alkali Binder Polymer .

Binder Polymer (5-4-20).

Emulsion () () Emulsion () .


1 pcb

. Line () () .

(Resist , Break Point: B.P.) .

B.P. 1.5 (5-4-21 ).


1 pcb

. Alkali , Resist Na

( Side Wall).

Na Ion . .

R - COO-Na++ H2O R - COOH + NaOH


1 pcb

. (4-22 ).

Na2CO3

1% resist . Resist Na2CO3 , .

b. Resist

resist . () PH .


1 pcb

5-4-6. Etching

Etching

Etching Etching Resist - .

Fine Pattern Etching System (Etching + Process) . Etching (Etchant) .

1). Resist

2). ,

3). ,

PCB Etching 2 , 2 , Alkali Etching -Etching .


1 pcb

B. Etching

2

2 (CuCl22H2O) 2 .

2 .

Cu + CuCl2 2CuCl

Etching 2 1

(5-4-23, 24).


1 pcb

1 etching 1 .

. .

2CuCl + 2HCl + H2O2 2CuCl2 + 2H2O

2 .

A.

B. etching

C. ( 130g/l)

D. Etching

E.


1 pcb

2) 2

2(FeCl3) 40Baume( ) (FeCl3 = 37%, = 1.38) . . 2 Colloid() .

FeCl3+ 3H2O Fe(OH)3 + 3HCl

(5% ) . 2 .

Cu + 2FeCl3 CuCl2 + 2FeCl2

Cu + FeCl3 CuCl + FeCl2

Cu + CuCl2 2CuCl

Etching

FeCl3+ CuCl FeCl2 +CuCl2


1 pcb

2 .

-

- Etching factor

- Etching (2025/)

- (4060g/l)

-

- Etching ( )


1 pcb

3) Alkali Etching (Alkaline Etchant)

Ammonium () Alkali .

Alkaline Etchant 5-4-7 .

5-4-7. Alkaline Etchant


1 pcb

Alkaline Etchant .

Cu + Cu(NH3)4Cl2 2Cu (NH3)2Cl

(I) Etching Tetra Ammonium (II) .

() Ammonium Ammonia Spray . .

4Cu(NH3)2Cl + 4NH4Cl + 4NH4OH + O2 4Cu(NH3)4Cl2+ 6H2O

Ammonium Ammonia Etching . Alkaline Etchant Solder resist resist .


1 pcb

Alkaline Etchant .

- Etching solder,

- Etching (3545/)

- Etching factor

- (135170 g/l),

-

- Ammonia

- Sludge()

-


1 pcb

4) - Etching

Etching .

- Etching 5-4-8 .

5-4-8. - Etching


1 pcb

  • - Etching .

  • Cu + H2O2+ H2SO4 CuSO4 + 2H2O

  • ion .

  • 2H2O2 2H2O + O2

  • Etching .

  • -Etching .

  • Etching (CuSO45H2O) Closed System

  • Etching

  • -

  • - etching

  • - Solder

  • - Etching


1 pcb

5-4-7. Pattern

Pattern Resist (2 ) Etching (Solder ) .

5-4-25 Pattern , Pattern , Solder .

5-4-25. Pattern


1 pcb

A. Pattern

pattern resist (:), , .

pattern pattern , .

pattern resist , resist .

1)

resist .

. , .


1 pcb

2) Soft Etching

Soft Etching Etching Pattern . Soft Etching .

-

- -

-

3) Pattern

Pattern Pattern . Panel .


1 pcb

-

- Rack control

-

-

-

- (, , , )

- pattern pattern

- resist

- ,() pattern

Pattern . .

5-4-9 .


1 pcb

4) Solder

Solder , Control , Etching Solder .

Solder () () () . Peptone Non-Peptone . Non- .

Pb Free . 5-4-10 .


1 pcb

A. Alkali

Resist Alkali Batch Type, () Counter, pH , Alkali () Over Flow . COD, BOD .

Alkali ( Lifting Point: L.P. ) 5-4-27, 5-4-28 . .

resist () () resist . () () . , roll filter


1 pcb

. Alkali (5-4-29 ). .


1 pcb

. . . Beaker Test .

Alkali Vinyl(Vinyl Chloride) 50 . Zone SUS . Alkali .

Alkali 5-4-30 .

5-4-30. Alkali


1 pcb

5-4-9.

PCB , Fine . Resist DFR . 30 DFR line/space 20/20 .

Mini-Via Hole PCB Mini-Via Hole DFR .

Pattern DFR .


1 pcb

5-5. Solder Resist

5-5-1. Solder Resist

Solder resist solder mask solder bridge - . Solder resist pattern - - .

5-5-2. Solder resist

Solder Resist - -Solder Resist 5-5-1 .

5-5-1. Solder Resist


1 pcb

Solder Resist [PCB ()] [ ] [ ] [Solder Resist ] 4 . Screen [ ] [ ] . UV .

(Photo Resist) [ ] (Screen - Curtain Coat - Spray Coat) . SR Mask Film . [ ] /UV .

Screen - , . Solder Resist Solder Bridge . [ Resist] [] .

.


1 pcb

A. Screen

(Screen Frame) stencil Ink Resist . Ink Gum Squeegee Ink . Screen 5-4-2 Ink Gum Squeegee Screen Stencil Silk Silk Screen . Ink , , , Ink . screen PCB .

5-5-2. Screen


1 pcb

Screen 5-5-3 Solder Resist - . .

1) Ink

2) Screen frame: , Screen , Resist

3) Squeegee

4) Screen

5-5-3. Screen


1 pcb

1) Ink

Solder Resist . Mask . () Epoxy Resin Filler, (), Levelling, () . (5-5-4. ).

-

- (UV) UV

Ink 135 10 Epoxy Resin () . Epoxy Resin Ink 1 2 . Ink . 1Shelf Life () . Ink (Ir) Conveyer .


1 pcb

5-5-4. Ink UV Ink


1 pcb

UV ink J(Joule) (: ) ink acryl() . UV ink 1 .

Screen ink , , . screen ( , ) . ink Thixotropy . ink () filler , levelling


1 pcb

2) Screen

Screen -- . Mask Pattern - .

. Aluminium . Tension . Em .

(--Ink ) . Nylon, Polyester, Stainless . , () Ink (Opening) . Mesh . 1-Inch . . , Mesh , . Solder Resist 180 Mesh 250 Mesh . Mesh ( 5-5-5. ).


1 pcb

Screen . Mm Squeegee . Tension . Tension . Squeegee , . Tension (Gap) .

- . Normal , Bias . Bias 22.5, 30, 45 .

Screen () () Micron () . () Mesh .


1 pcb

5-5-5. Screen


1 pcb

Polyester Mask .

Screen ink Resist . Mask Film , . PVA(Polyvinyl Alcohol) (Diazo) .

5-5-6 , , . . Film , . () Film Screen , Resist Pattern .


1 pcb

5-5-6. , ,


1 pcb

3) Squeegee

Stencil Ink Squeegee Gum . Gum Polyurethane . Gum , Gum Blade (, ) .

''(-) D 60 90 . Solder Resist 70 . Pattern . Gum Ink (Monomer) () . Squeegee Gum . Sharp() . Gum Ink .


1 pcb

4)

, , . .

< > < > <Squeegee () > <Squeegee () Timing > <Ink > < > < > .

Pin CCD Camera . Mark PCB .


1 pcb

C.

, Solder Resist Pattern . Photo Resist Resist .

Film Tack Free ( ) Dry Film Type Photo Resist Type . Alkali .

Alkali Photo Resist .

1) Dry Film Type Photo Resist ( 5-5-7)

75, 100 Resist Film . Polyester Film Resist () Cover Film 3 . Dry Film Laminator Laminator Laminate . '' Resist . - Chamber Resist Film Laminate . Photo Resist Maker . Film Type Resist

Via Through Hole Tenting .


1 pcb

5-4-7. Dry Film Resist Laminator


1 pcb

2) Photo Resist

Dry Film . '' . Photo Resist Mask Film Tack Free / Resist . Resist (/// ) . Resist / Solder Resist 2 . Resist '' (Open Mesh), Roll Coat, Curtain Coat, Spray Coat .

(Screen )

'' . '' Mask Pattern . TH Solder Resist Resist .

. . Resist Solder Resist .


1 pcb

(Roll Coat)

Roll Roll Solder Resist . Screen Solder Resist TH( TH) Solder Resist Line Speed .

(Curtain Coat) ( 5-5-8 )

Solder Resist '' . Resist () Ink ( 5-5-11 ).

Resist


1 pcb

5-4-8. Curtain Coater


1 pcb

(Spray Coat) ( 5-5-9 5-5-10 )

Solder Resist Ink Spray . Spray (1)Air Spray, (2)Airless Spray, (3)Bell Spray .

Air Spray Solder Resist Ink Spray Nozzle . , () , .


1 pcb

Airless Spray Air Assist Airless Spray( ) Solder Resist Ink () . Assist Air Spray . Bell Spray Rotor() Solder Resist Ink . () . Shaping Air .


1 pcb

Spray Coat . () Spray Air . Solder Resist Solder Resist .

-

Resist . Resist (Screen ,Roll Coat) . ( ) Solder Trap( ) . Solder Ball .

- () Resist

Resist () Resist Resist . () Pad Solder . Maker .


1 pcb

- TH '' Resist

Resist . Resist . Solder Resist . Resist .

- Solder Resist Dam()

Fine Pitch SMD Pad Solder Resist Dam .

Photo Resist ()

. Solder Resist Dam (0.15Mm) Resist , Photo Resist Resist Solder Resist Dam () . .


1 pcb

- Solder Resist

Solder Resist () . Buff( ) , () , , Soft Etching () , .

. Buff Overhang , () .


1 pcb

5-5-3. Marking

, , Pin . Screen . Marking Ink Solder Resist Ink . Ink .

Marking , . , Screen . Via Hole . PCB .

Marking Screen . Screen () . ink .


1 pcb

5-6. (Finish)

5-6-1.

lead pitch pitch(2.540.05) PCB pitch PCB solder bridge wetting soldering , . . PCB .

- Solderability Solder

- Aging Solderability

- Reflow Solderability

- Flux

- Cream Solder

-

- Pad

- Migration


1 pcb

5-6-2. PCB

HASL(Hot Air Solder Leveling) PCB , . HASL, OSP(OrgaincSolderabilityPreservatative) Coating Ni/Au , Pd , Ag .

- HASL (Hot Air Solder Leveling)

Solder Hot Air Pcb Pad Hole Solder Coating , Flux , Hasl Solder Cream Solder , Reflow Solder Bridge Pitch SMC . Multiple Soldering . 2004 (Eu Directive) Finish .


1 pcb

- OSP (Organic Solderability Preservative) Coating

OSP Type OSP OSP . Type OSP Preflux , Rosin Ester Roll Coating, PCB CFC Flux .

OSR Imidazole, Benzotriazole, Benzimidazole Pad Hole . Imidazole Benzotriazole OSP Reflow Mixed Surface Mount Technology


1 pcb

.

OSP Benzimidazole OSP Pad , Flux , Solderability .

- Nickel/Gold

, . PCB (TAB) . 0.31.27 35 Nickel . soldering Hot Solder Fine Pitch OSP soldering .


1 pcb

Solder Bath 35% Gold Embrittle Solder Joint 0.2 . Soldering Soldering Nickel Nickel . Soldeing Nickel . Nickel Nickel (phosphor) 310% Solderability . .

2 . .

Nickel 0.020.05 . . Immersion Gold .

Electroless Gold 0.51.0 . Package Wire Bonding .


1 pcb

5-6-1.


1 pcb

  • Pd

  • . . .

  • Soldering Ni-P P() Au/Ni Nickel .

  • Hardness 250290HV Nickel (Copper) Key Pad .

  • Immersion Gold Wire Bonding .

  • Gold 230 Solder Bath 3.0/sec Pd 0.35/sec .


1 pcb

  • Ag

  • Ag 0.070.1 Organic Molecular Layer Migration .

  • , Aging Soldering , Flux Solder Paste , .

  • Organic Molecular Layer Migration .

  • Ag .

  • , .


1 pcb

  • (Immersion Tin)

  • Soldering .

  • White Tin( Gray Tin) 1 Soldering .

Gray Tin White Tin .

White Tin OranoMetalic Film Coating (Ormecon) .

Process Hot Solder Fine Pitch 2 Reflow Solderability .


1 pcb

6. ,

PCB , PCB .

PCB "" "" ") . - . .

.

PCB - PCB . - .

3 .

-()- . 6-1 PCB .


1 pcb

6-1. PCB


1 pcb

6-1. ()

PCB . () . , .

test probe () . fixture () - .

6-1-1 6-1-2 , 6-2 .

Bare board .

(1) Fine pitch pad

QFP footprint() pitch 0.5mm pitch, TCP lead pitch 0.25mm 0.2mm . fine pitch . (Camera ) probe pin (), gum .


1 pcb

(2)

bare board 100% probing . . bare board test .

(3)

-, probe pin . lot - 100% . .

(4) CAD/CAM Data Link ()

data . Data Link AOI() .


1 pcb

6-1-1.


1 pcb

- ( , - ) , pin hole- () / clearance hole .

.

(6-1-3 ). CCD Camera Laser () .

2 .

PCB PCB CAD (6-1-4 ).


1 pcb

6-2.

'' . PCB solder resist , pad , , -, , marking , , , () delamination( ), , , , HAL solder , pit() . 2 .

6-19 6-3, 6-20 6-4, 6-21 6-5, 6-22 6-6, 6-23 (JIS C 5014) .

feedback .


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