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Hardware Trust Implications of 3-D Integration

Hardware Trust Implications of 3-D Integration. Ted Huffmire (NPS), Timothy Levin (NPS), Michael Bilzor (NPS), Cynthia E. Irvine (NPS), Jonathan Valamehr (UCSB), Mohit Tiwari (UCSB), Timothy Sherwood (UCSB), and Ryan Kastner (UCSD) 26 October 2010

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Hardware Trust Implications of 3-D Integration

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  1. Hardware Trust Implications of 3-D Integration Ted Huffmire (NPS), Timothy Levin (NPS), Michael Bilzor (NPS), Cynthia E. Irvine (NPS), Jonathan Valamehr (UCSB), MohitTiwari (UCSB), Timothy Sherwood (UCSB), and Ryan Kastner (UCSD) 26 October 2010 Workshop on Embedded Systems Security (WESS)

  2. Nile River • Mystery on the Nile: Just Whose River Is It? • Ethiopia Claims HighGoundin Right-to-Nile Debate • Thirsty Egypt Clings Tight to the Nile • Weekend Edition Sunday (npr.org)

  3. [Koyanagi05]

  4. [Koyanagi05] • Timeline

  5. Alternative 3-D Approaches • PoP [Lim10] Wire Bonding (SiP) [Amkor09]

  6. Alternative 3-D Approaches • PoP [Lim10]

  7. Alternative 3-D Approaches • [Amkor10]

  8. Alternative 3-D Approaches • Face-to-Face [Loh07]

  9. Alternative 3-D Approaches • Face-to-Back [Loh07]

  10. What is 3Dsec? • Economics of High Assurance • High NRE Cost, Low Volume • Gap between DoD and Commercial • Disentangle security from the COTS • Use a separate chip for security • Use 3-D Integration to combine: • 3-D Control Plane • Computation Plane • Need to add posts to the COTS chip design • Dual use of computation plane

  11. Pro’s and Con’s • Why not use a co-processor? On-chip? • Pro’s • High bandwidth and low latency • Controlled lineage • Direct access to internal structures • Con’s • Thermal and cooling • Design and testing • Manufacturing yield

  12. Thermal Challenges • Thermal Simulation [Loh06, Melamed09]

  13. Yield Challenges • Wafer-to-Wafer Bonding [Euronymous07]

  14. Testing Challenges • [Thärigen10]

  15. Cost • Cost of fabricating systems with 3-D • Fabricating and testing the security layer • Bonding it to the host layer • Fabricating the vias • Testing the joined unit

  16. This Paper • Can a 3-D control plane provide useful secure services when it is conjoined with an untrustworthy computation plane? • Yes, provided: • Self-protection • Dependency Layering

  17. Face-to-Back Bonding • [Valamehr10]

  18. Primitives • [Valamehr10]

  19. Threat Model • Computation plane • Unintentional hardware flaws • Malicious software • Not in scope • Malicious inclusions • Nullify self-protection • Probing of the control plane • Compromising RF emissions

  20. Security Model • Self-protection • Do not place a post that allows the control plane to accept extraneous power, requests, or modifications. • Layered dependencies • Control plane should not depend on the computation plane

  21. Layered Dependencies • Never depend on a layer of lesser trustworthiness

  22. Dependency Properties • Service • Communication (e.g., I/O) • Synchronization • Call • Resource Creation and Provision • Storage • Contention

  23. 3-D Application Classes • Enhancement of native functions • Secure alternate service • Isolation and protection • Passive monitoring • Information flow tracking • Runtime correctness checks • Runtime security auditing

  24. Design Example • Secure Alternate Service

  25. Examples of 3-D Systems • Network-on-Chip [Kim07]

  26. Examples of 3-D Systems • Network-on-Chip [Kim07]

  27. Examples of 3-D Systems • Particle Physics [Demarteau09]

  28. Examples of 3-D Systems • Chip Scale Camera Module [Yoshikawa09]

  29. Examples of 3-D Systems • 3D-PIC 3-D CMOS Imager [Chang10]

  30. Examples of 3-D Systems • 3-D Stacked Retinal Chip [Kaiho09]

  31. Examples of 3-D Systems • 3-D Stacked Retinal Chip [Koyanagi05]

  32. Examples of 3-D Systems • 3-D FPGAs [Razavi09]

  33. Examples of 3-D Systems • 3D-MAPS: Many-core 3-D Processor with Stacked Memory [Lim10] • Solid work!

  34. Examples of 3-D Systems • [Eloy10]

  35. Future Work • Malicious Inclusions • Off-Chip I/O • Wireless • Wired • Power • Fault-Tolerant Chips for Critical Systems

  36. Wireless: Capacitive Coupling • [Kim09]

  37. Wireless: Optical • Bidirectional Communication [Dietz03]

  38. Questions? • faculty.nps.edu/tdhuffmi

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